My Inquiry
My Account
NXP Semiconductors S912XEQ384BVAG
- Part No.:
- S912XEQ384BVAG
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
S912XEQ384BVAG.pdf
- Description:
- IC MCU 16BIT 384KB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,074
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S912XEQ384BVAG from NXP Semiconductors (formerly Freescale) is a 16-bit automotive microcontroller featuring the CPU12X core, 384 KB on-chip Flash memory with ECC, 24 KB RAM, and integrated MSCAN, XGATE co-processor, and enhanced ATD converter. It operates at up to 50 MHz bus frequency, supports -40°C to 125°C ambient temperature, and targets body control modules requiring robust system integrity.
For engineers reviewing the S912XEQ384BVAG datasheet, S912XEQ384BVAG pinout, S912XEQ384BVAG application, or S912XEQ384BVAG equivalent, key selection criteria include CAN/LIN gateway capability, MPU-enabled memory protection, ECC-protected Flash, XGATE offloading for real-time communication stacks, and qualification for automotive AEC-Q100 Grade 1.
Technical Context
The S912XEQ384BVAG implements a dual-core architecture: the 16-bit CPU12X core handles main application logic, while the programmable XGATE co-processor runs at 100 MHz and independently manages time-critical peripherals including MSCAN, SCI, and PWM-enabling FULL-CAN performance and LIN master/slave operation without CPU intervention. Its Memory Protection Unit (MPU) defines eight address regions with 8-byte granularity and enforces no-write/no-execute attributes.
System integrity is reinforced by ECC on Flash (1-bit correction / 2-bit detection), a windowed COP watchdog, clock monitor, low-voltage detection with interrupt/reset, and supervisor/user mode separation. The device uses an internal IPLL with spread-spectrum modulation for reduced EMC emissions and supports fast wake-up from STOP mode via RTI, API, or analog comparison triggers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | CPU12X 16-bit core, instruction-set compatible with MC9S12 except five removed fuzzy instructions; enables legacy code reuse with enhanced addressing. |
| Flash Memory | 384 KB with ECC (64 data + 8 syndrome bits); provides single-bit fault correction and double-bit fault detection per word during read operations. |
| RAM | 24 KB on-chip RAM; supports fast XGATE and CPU access without wait states for all peripherals and memories. |
| Operating Voltage | 3.3 V ±5% to 5.0 V +10%; separate VREG and I/O supplies allow optimized EMC filtering and stable operation across automotive battery transients. |
| Temperature Range | -40°C to 125°C (AEC-Q100 Grade 1 qualified); validated for under-hood and body control module environments. |
| Bus Frequency | Up to 50 MHz CPU bus frequency; delivers deterministic real-time performance for automotive timing-critical tasks. |
| XGATE Performance | 100 MHz RISC co-processor; executes up to 100 MIPS, handles MSCAN mailboxes, LIN framing, and SPI transfers autonomously. |
| CAN Interfaces | 4 CAN modules (CAN0–CAN3); supports CAN 2.0A/B, up to 1 Mbps bit rate, 5 receive buffers with FIFO, and FULL-CAN when paired with XGATE. |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch, case number 918-03). Pinout verified per MC9S12XE Data Sheet "Port Availability by Package Option" table for 144LQFP variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDX | Core & I/O Power Supply | Dual supply inputs enable independent filtering; VDD powers core/VREG, VDDX powers I/O-critical for EMC robustness in automotive harness noise. |
| VSS, VSSX | Core & I/O Ground | Separate ground returns minimize coupling between digital logic and high-current I/O switching paths. |
| RESET | Active-Low Reset Input | Asynchronous reset with internal pull-up; accepts external reset sources and integrates with POR, LVD, and COP timeout events. |
| MODB, MODA | Mode Selection Inputs | Configure boot mode (internal Flash, background debug, or external bus); sampled at power-on reset to determine startup vector location. |
| XTAL, EXTAL | Crystal Oscillator Interface | Supports 4–16 MHz Pierce crystal; connects to internal OSC_LCP module for stable clock generation with good noise immunity. |
| CAN0_TX, CAN0_RX | CAN0 Differential Transceiver Interface | Direct connection to external CAN transceiver (e.g., TJA1042); requires external termination and common-mode choke per ISO 11898-2. |
| SCI0_TX, SCI0_RX | LIN/SCI0 Serial Interface | Configurable as LIN physical layer (with external LIN transceiver) or standard UART; supports break detection and wake-up on active edge. |
| PORTA[7:0] | General-Purpose I/O Port | 8-bit bidirectional port with configurable pull-up/pull-down, hysteresis, and drive strength; usable for sensor inputs or discrete driver control. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Protection Unit (MPU) | 8 configurable address regions with 8-byte granularity; enforces no-write/no-execute policies and triggers non-maskable interrupt on violation-essential for ASIL-B software partitioning. |
| ECC-Protected Flash | 64-bit data + 8-bit syndrome per word; corrects single-bit errors and detects double-bit errors in real time-meets ISO 26262 functional safety requirements for memory integrity. |
| XGATE Co-Processor | Programmable in C, runs at 100 MHz; offloads MSCAN message handling, LIN frame assembly, and PWM updates-reducing CPU load by >70% in gateway applications. |
| Enhanced ATD Converter | Two independent 10-bit ATD modules (8-channel each); 3 µs conversion time with internal oscillator support-enables accurate battery voltage and cabin temperature monitoring in STOP mode. |
| API Timer | Asynchronous Periodic Interrupt timer active in Full Stop mode; trimmable ±10%, 0.2 ms–13 s range-provides precise low-power wake-up scheduling without external RTC. |
| MSCAN Module | 4 CAN controllers with 5 receive buffers/FIFO, 3 prioritized transmit buffers, and 16-bit timestamp; supports automatic bus-off recovery and listen-only diagnostic mode. |
Applications
| Body Control Module (BCM) | Gateway Controller |
|---|---|
|
Use Scenario: Centralized management of door locks, lighting, wipers, and HVAC actuators in modern vehicle body electronics. IC Role / Device Role / Timing Role: Primary MCU executing body control firmware, coordinating LIN slave nodes (e.g., mirror controls), and interfacing with CAN backbone via MSCAN. Use Value: XGATE handles LIN protocol stack and CAN message filtering autonomously, freeing CPU for application logic; MPU isolates safety-critical lock actuation routines from infotainment-linked CAN traffic. |
Use Scenario: Protocol translation and message routing between high-speed powertrain CAN and low-speed body LIN networks. IC Role / Device Role / Timing Role: Real-time bridge MCU managing CAN-to-LIN gateway functions, diagnostics (UDS over CAN/LIN), and firmware update distribution. Use Value: Dual CAN interfaces (CAN0/CAN1) and four SCI modules enable concurrent CAN FD-capable backbone and multi-LIN subnetworks; ECC Flash ensures bootloader integrity during OTA updates. |
| Roof Module Controller | Seat Control Unit |
|
Use Scenario: Integrated control of sunroof, panoramic roof, and ambient lighting with position feedback and anti-pinch safety logic. IC Role / Device Role / Timing Role: Sensor fusion MCU reading potentiometers and Hall sensors via ATD/PWM, driving H-bridge drivers, and communicating status over LIN. Use Value: 10-bit ATD with 3 µs conversion and internal oscillator allows precise motor position sampling during STOP mode; API timer enables periodic self-test without waking CPU. |
Use Scenario: Motorized seat adjustment with memory presets, heating, and occupancy detection using thermistors and pressure sensors. IC Role / Device Role / Timing Role: Safety-aware controller executing ASIL-B-compliant seat movement logic, monitoring current sense ADCs, and reporting faults over CAN. Use Value: MPU enforces strict memory isolation between heater control (non-safety) and motor stall detection (ASIL-B); ECC Flash prevents corruption of seat position calibration data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12XEQ512CVAG | 512 KB Flash, 32 KB RAM, same 144LQFP package and peripheral set; higher memory for complex gateway stacks with multiple CAN/LIN gateways. | Supports larger AUTOSAR BSW configurations and dual CAN/LIN routing with extended diagnostic services. | Select when firmware image size exceeds 384 KB or when future-proofing for feature expansion without PCB change. |
| S912XEP100BVAG | 1 MB Flash, 64 KB RAM, 208-pin MAPBGA; adds non-multiplexed external bus interface and 5 CAN modules. | Enables external memory expansion for logging or OTA update staging; suited for high-end body domain controllers with Ethernet bridging. | Choose for applications requiring >384 KB code space, external memory interface, or full 5-CAN node support-requires PCB redesign. |
Compared with S912XEQ384BVAG, MC9S12XEQ512CVAG offers direct pin-compatible memory scaling within the same 144LQFP footprint, while S912XEP100BVAG delivers significantly expanded I/O and memory but mandates a new MAPBGA layout-making the former ideal for incremental upgrades and the latter for next-generation domain controllers.
Availability
S912XEQ384BVAG is available at Aetrix Electronics and suitable for automotive body control modules, gateway controllers, roof modules, and seat control units requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified silicon.
Supply support for S912XEQ384BVAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in automotive MCUs dating to Motorola and Freescale.
The S12XE family-including S912XEQ384BVAG-was designed specifically for automotive body electronics demanding enhanced system integrity, featuring MPU, ECC Flash, and XGATE to meet ASIL-B functional safety goals without external co-processors.
FAQ
What is the maximum operating temperature rating for the S912XEQ384BVAG?
The S912XEQ384BVAG is rated for operation from -40°C to 125°C and is qualified to AEC-Q100 Grade 1 standards. This specification is validated across the full voltage range (3.3 V ±5% to 5.0 V +10%) and ensures reliable performance in under-hood and body control module environments where thermal stress is critical. The S912XEQ384BVAG's on-chip temperature sensor and low-voltage detection circuitry further support thermal monitoring in real time.
Does the S912XEQ384BVAG support CAN FD or only classical CAN?
The S912XEQ384BVAG supports only classical CAN 2.0A/B up to 1 Mbps and does not implement CAN FD protocol features such as flexible data-rate or extended data length. Its MSCAN modules are hardware-limited to 8-byte payloads and fixed bit timing; CAN FD compliance requires newer S32K or MPC57xx families. For S912XEQ384BVAG-based designs, CAN FD functionality must be implemented externally or deferred to a companion controller.
How many CAN interfaces does the S912XEQ384BVAG include, and what are their design capabilities?
The S912XEQ384BVAG includes four fully independent MSCAN modules (CAN0–CAN3), each supporting CAN 2.0A/B, standard/extended identifiers, programmable bit rates up to 1 Mbps, and five receive buffers with FIFO storage. When used with the XGATE co-processor, these modules achieve FULL-CAN capability-enabling autonomous mailbox management, timestamping, and bus-off recovery without CPU overhead. The S912XEQ384BVAG does not support CAN FD or ISO 11898-3 (fault-tolerant CAN).
Is the S912XEQ384BVAG pin-compatible with other S12XE family members in the same package?
Yes-the S912XEQ384BVAG is fully pin-compatible with other 144-pin LQFP S12XE derivatives including MC9S12XEQ512CVAG and MC9S12XET256BVAG. All share identical pin assignments, electrical characteristics, and peripheral mapping for the 144LQFP package (case 918-03), enabling drop-in memory upgrades or feature-downgrades without PCB revision. However, software configuration of unused peripherals (e.g., disabling extra CAN modules) is required to maintain functional equivalence.
What debugging interfaces does the S912XEQ384BVAG support, and how are they accessed?
The S912XEQ384BVAG supports single-wire Background Debug Mode (BDM) via the BKGD pin, enabling non-intrusive memory access, flash programming, and real-time breakpoint control. It also integrates the xDBG module with four hardware comparators and a 64-entry trace buffer for CPU/XGATE bus monitoring. Debugging requires a compatible BDM pod (e.g., P&E Multilink) and CodeWarrior IDE; no JTAG interface is present. The S912XEQ384BVAG's BDM is active in all modes except full STOP, allowing post-crash register dump and live variable inspection.
S912XEQ384BVAG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- HCS12X
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- HCS12X
- Core Size:
- 16-Bit
- Speed:
- 50MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 119
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 24K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.72V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S912XEQ384BVAG FAQ
1.How can I place an order for S912XEQ384BVAG through Aetrix?
Please submit a Request for Quotation (RFQ) for S912XEQ384BVAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S912XEQ384BVAG reliable?
The price and inventory of S912XEQ384BVAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S912XEQ384BVAG is usually 5 days.
3.What payment methods are accepted for S912XEQ384BVAG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S912XEQ384BVAG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S912XEQ384BVAG?
S912XEQ384BVAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S912XEQ384BVAG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S912XEQ384BVAG?
For technical support, including S912XEQ384BVAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S912XEQ384BVAG requirements.
6.How does Aetrix verify that S912XEQ384BVAG is sourced from the original manufacturer or authorized distributors?
All S912XEQ384BVAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S912XEQ384BVAG meets industry standards.
7.What is the process for return or replacement of S912XEQ384BVAG?
All S912XEQ384BVAG units undergo pre-shipment inspection (PSI). If there is an issue with S912XEQ384BVAG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S912XEQ384BVAG part is unused and in its original packaging.
Return procedure for S912XEQ384BVAG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S912XEQ384BVAG Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
