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NXP Semiconductors S912XEQ384F0CALR
- Part No.:
- S912XEQ384F0CALR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 112-LQFP
- Datasheet:
-
S912XEQ384F0CALR.pdf
- Description:
- IC MCU 16BIT 384KB FLASH 112LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,605
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Product details
Overview
S912XEQ384F0CALR from NXP Semiconductors (formerly Freescale) is a 16-bit automotive microcontroller featuring the CPU12X core, 384 KB on-chip Flash memory with ECC, 24 KB RAM, and integrated MSCAN, XGATE co-processor, and enhanced ATD converter. It operates at up to 50 MHz bus frequency, supports -40°C to 125°C ambient temperature, and targets body control modules requiring robust system integrity and CAN/LIN gateway functionality.
For engineers reviewing the S912XEQ384F0CALR datasheet, S912XEQ384F0CALR pinout, S912XEQ384F0CALR application, or S912XEQ384F0CALR equivalent, key selection considerations include its 144-pin LQFP package, dual ATD converters (8/10/12-bit, 16-channel), 4 CAN modules, 6 SCI interfaces, and MPU-enabled memory protection for ASIL-B–capable automotive systems.
Technical Context
The S912XEQ384F0CALR implements the CPU12X 16-bit core with full MC9S12 instruction set compatibility (excluding five fuzzy instructions), enhanced indexed addressing, and large data segment access independent of PPAGE. Its XGATE co-processor runs at 100 MIPS, handles peripheral interrupts autonomously, and enables FULL-CAN operation with the MSCAN module.
System integrity is enforced via an 8-region Memory Protection Unit (MPU) with 8-byte granularity, Flash ECC (1-bit correction / 2-bit detection), and dual-voltage-supply architecture separating I/O and internal regulator rails for optimized EMC filtering. The device supports self-clock wake-up from STOP mode and includes a frequency-modulated PLL (IPLL) for reduced EMI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | CPU12X 16-bit core, compatible with MC9S12 ISA (minus MEM/WAV/WAVR/REV/REVW), enabling legacy code reuse without recompilation. |
| Flash Memory | 384 KB with ECC: 1-bit error correction and 2-bit error detection per 64-bit word, ensuring reliable program storage in harsh automotive environments. |
| RAM | 24 KB SRAM, accessible without wait states for all peripherals and memories, supporting deterministic real-time execution. |
| Operating Voltage | 3.3 V ±5% to 5.0 V +10%, with separate VDDIO and VDDREG supplies enabling independent EMC filtering and noise isolation. |
| Temperature Range | -40°C to +125°C ambient, qualified for under-hood automotive applications including body control units and gateways. |
| Bus Frequency | Up to 50 MHz CPU bus frequency and 100 MHz XGATE bus frequency, delivering high-throughput I/O handling without CPU intervention. |
| CAN Modules | 4 independent MSCAN modules compliant with CAN 2.0A/B, supporting up to 1 Mbps bit rate and FULL-CAN capability when paired with XGATE. |
| ADC | Dual ATD converters: 8/10/12-bit resolution, 16-channel multiplexer, 3 µs 10-bit conversion time, and analog-compare wake-up from low-power modes. |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch, case no. 918-03). Non-multiplexed external bus interface available. Pinout validated per MC9S12XE Data Sheet "Port Availability by Package Option" table for 144LQFP variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDREG | Internal voltage regulator supply | Provides regulated core voltage; requires dedicated decoupling to ensure stable 3.3 V operation and EMC compliance. |
| VDDIO | I/O supply rail | Independent 3.3–5.0 V supply for digital I/O; enables separate filtering from VDDREG to reduce coupling noise. |
| RESET | Active-low reset input | Asynchronous reset assertion initiates power-on reset sequence; supports external watchdog or system-level reset coordination. |
| MODB/MODA | Mode selection inputs | Configure boot mode (e.g., normal, BDM, special single-wire debug); must be pulled high/low at power-up for correct initialization. |
| PORTA[7:0] | General-purpose I/O port | 8-bit bidirectional port with configurable pull-up/pull-down, hysteresis, and drive strength; supports interrupt-on-change wake-up. |
| CAN0_TX / CAN0_RX | CAN0 differential transceiver interface | Dedicated pins for CAN0 bus signaling; require external CAN transceiver (e.g., TJA1042) and common-mode choke for ISO 11898-2 compliance. |
| SCI0_TX / SCI0_RX | SCI0 UART interface | Full-duplex asynchronous serial communication; supports LIN physical layer when configured with break detection and auto-synchronization. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Protection Unit (MPU) | 8 programmable address regions with 8-byte granularity; enforces no-write/no-execute policies and triggers non-maskable interrupt on violation - critical for ASIL-B software partitioning. |
| XGATE Co-processor | Programmable in C, executes at 100 MIPS, services all peripherals independently; offloads CAN message handling, LIN scheduling, and SPI transfers from main CPU. |
| ECC-Protected Flash | 64-bit data + 8-bit syndrome ECC per word enables real-time single-bit correction and double-bit detection - eliminates silent data corruption in safety-critical firmware. |
| Enhanced ATD Converter | Dual 16-channel ADCs with 3 µs 10-bit conversion, internal oscillator for Stop-mode operation, and analog-compare wake-up - enables battery-powered sensor monitoring with sub-µA quiescent current. |
| Frequency-Modulated PLL (IPLL) | Internally filtered spread-spectrum clock generation reduces peak EMI emissions by >10 dB; eliminates need for external loop filter components. |
| MSCAN with XGATE Integration | 4 CAN modules support FULL-CAN mailbox management (virtually unlimited mailboxes) and automatic message filtering - enables concurrent multi-bus gateway routing without CPU overhead. |
Applications
| Body Control Module (BCM) | Powertrain Gateway |
|---|---|
|
Use Scenario: Centralized vehicle body controller managing lighting, door locks, window lifts, and HVAC actuators across multiple LIN sub-nodes and CAN domains. IC Role / Device Role / Timing Role: Primary MCU executing real-time control logic, coordinating LIN slave nodes via integrated SCI modules, and routing diagnostic messages between chassis and infotainment CAN buses. Use Value: XGATE handles LIN frame scheduling and CAN message buffering autonomously, freeing the CPU for PID-based lamp dimming and motor position control with <50 µs jitter. |
Use Scenario: In-vehicle gateway bridging high-speed powertrain CAN (500 kbps) with low-speed body CAN (125 kbps) and LIN clusters for engine management and transmission control. IC Role / Device Role / Timing Role: Protocol translator and message router with hardware-accelerated filtering, prioritization, and timestamping of cross-domain frames using four independent MSCAN modules. Use Value: MPU-enforced memory isolation prevents corrupted body-CAN firmware from compromising powertrain message integrity, satisfying ISO 26262 ASIL-B partitioning requirements. |
| Roof Module Controller | Seat Position Memory System |
|
Use Scenario: Sunroof, panoramic roof, and rain sensor integration unit mounted in vehicle roof console, operating in high-temperature zones (>105°C). IC Role / Device Role / Timing Role: Sensor fusion hub aggregating analog rain/light inputs via ATD, driving PWM-controlled motors, and communicating status over LIN to BCM. Use Value: Dual ATD converters enable simultaneous sampling of photodiode and thermistor inputs with 12-bit resolution, while internal oscillator allows accurate analog wake-up from STOP mode at <1 µA. |
Use Scenario: Driver seat memory system storing and recalling position profiles using non-volatile D-Flash and emulated EEPROM for wear-leveling. IC Role / Device Role / Timing Role: Persistent data manager writing seat calibration values to 32 KB D-Flash with ECC, performing background EEE file maintenance during idle cycles. Use Value: Emulated EEPROM subsystem automatically migrates valid data to buffer RAM on reset and supports burst programming of up to four words - enabling <10 ms profile recall latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S912XEQ512F0CALR | 512 KB Flash, 32 KB RAM, same 144LQFP package and peripheral set; adds 128 KB more program memory and 8 KB more RAM. | Required for larger AUTOSAR Basic Software stacks or complex state machines exceeding 384 KB code footprint. | Select when future firmware growth headroom or additional diagnostic logging buffers are needed without changing PCB layout. |
| S912XEP384F0CALR | Same Flash/RAM size but 208-pin MAPBGA package; includes 5 CAN modules (vs. 4), 8-channel ATD (vs. dual 8/10/12-bit), and expanded I/O (152 pins vs. 119). | Suitable for higher-complexity gateways requiring extra CAN channels or external memory interfacing via non-multiplexed bus. | Choose only if board redesign accommodates 208-pin BGA and additional CAN/LIN routing; not pin-compatible with S912XEQ384F0CALR. |
Compared with S912XEQ512F0CALR, the S912XEQ384F0CALR trades 128 KB Flash and 8 KB RAM for identical peripheral count and thermal qualification - ideal for cost-optimized body controllers where code size is tightly constrained. Against S912XEP384F0CALR, it sacrifices I/O count and CAN channel count for LQFP manufacturability and lower assembly cost in mid-tier automotive modules.
Availability
S912XEQ384F0CALR is available at Aetrix Electronics and suitable for automotive body control modules, LIN/CAN gateways, and roof console electronics requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 1 qualification.
Supply support for S912XEQ384F0CALR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, with deep expertise in functional safety, secure connectivity, and embedded processing.
The S912XEQ384F0CALR belongs to the S12XE family - engineered specifically for automotive body electronics demanding ASIL-B compliance, robust EMC performance, and scalable CAN/LIN networking without sacrificing 16-bit code efficiency.
FAQ
What is the maximum operating temperature specification for the S912XEQ384F0CALR?
The S912XEQ384F0CALR is qualified for operation from -40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 1 requirements for under-hood automotive applications such as body control modules and roof controllers where thermal stress is critical.
Does the S912XEQ384F0CALR support CAN FD or only classical CAN 2.0?
The S912XEQ384F0CALR supports only classical CAN 2.0A/B protocol (up to 1 Mbps) via its four MSCAN modules. It does not implement CAN FD features such as flexible data-rate or extended payload length - those capabilities require newer S32K or MagnaChip families.
How many analog-to-digital converter (ATD) modules does the S912XEQ384F0CALR include?
The S912XEQ384F0CALR integrates two independent ATD converters, each supporting 8/10/12-bit resolution, 16-channel multiplexing, and 3 µs 10-bit conversion time - enabling simultaneous sampling of multiple sensors in body electronics applications.
Is the S912XEQ384F0CALR pin-compatible with other S12XE family members in the 144LQFP package?
Yes, the S912XEQ384F0CALR shares identical pinout and electrical characteristics with other 144LQFP S12XE derivatives (e.g., S912XEQ512F0CALR, S912XET256F0CALR), allowing drop-in replacement within the same memory/peripheral configuration tier without PCB changes.
What debug interface does the S912XEQ384F0CALR use, and is external hardware required?
The S912XEQ384F0CALR uses the Background Debug Mode (BDM) single-wire interface for non-intrusive memory access, flash programming, and real-time debugging. A standard BDM pod (e.g., P&E Micro USB-ML-12) is required - no JTAG header or external debugger chip is integrated on the MCU itself.
S912XEQ384F0CALR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 112-LQFP
- Series:
- HCS12X
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- HCS12X
- Core Size:
- 16-Bit
- Speed:
- 50MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 91
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 24K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.72V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S912XEQ384F0CALR FAQ
1.How can I place an order for S912XEQ384F0CALR through Aetrix?
Please submit a Request for Quotation (RFQ) for S912XEQ384F0CALR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S912XEQ384F0CALR reliable?
The price and inventory of S912XEQ384F0CALR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S912XEQ384F0CALR is usually 5 days.
3.What payment methods are accepted for S912XEQ384F0CALR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S912XEQ384F0CALR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S912XEQ384F0CALR?
S912XEQ384F0CALR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S912XEQ384F0CALR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S912XEQ384F0CALR?
For technical support, including S912XEQ384F0CALR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S912XEQ384F0CALR requirements.
6.How does Aetrix verify that S912XEQ384F0CALR is sourced from the original manufacturer or authorized distributors?
All S912XEQ384F0CALR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S912XEQ384F0CALR meets industry standards.
7.What is the process for return or replacement of S912XEQ384F0CALR?
All S912XEQ384F0CALR units undergo pre-shipment inspection (PSI). If there is an issue with S912XEQ384F0CALR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S912XEQ384F0CALR part is unused and in its original packaging.
Return procedure for S912XEQ384F0CALR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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