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NXP Semiconductors S912XEQ384F1CAGR

Part No.:
S912XEQ384F1CAGR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixS912XEQ384F1CAGR.pdf
Description:
IC MCU 16BIT 384KB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,380

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Product details

Overview

S912XEQ384F1CAGR from NXP Semiconductors (formerly Freescale) is a 16-bit automotive microcontroller featuring the CPU12X core, 384 KB on-chip Flash memory with ECC, 24 KB RAM, and integrated MSCAN, XGATE co-processor, and enhanced ATD. It delivers full CAN performance in body control modules and gateway applications at up to 50 MHz bus frequency.

For engineers reviewing the S912XEQ384F1CAGR datasheet, S912XEQ384F1CAGR pinout, S912XEQ384F1CAGR application, or S912XEQ384F1CAGR equivalent, key selection criteria include Flash ECC support, XGATE offloading capability for CAN/LIN, -40°C to 125°C operation, and 144-pin LQFP package compatibility with external bus interface.

Technical Context

The S912XEQ384F1CAGR implements the CPU12X 16-bit core with full MC9S12 instruction set compatibility (excluding five fuzzy instructions), supports 50 MHz bus clock via IPLL, and integrates an enhanced XGATE RISC co-processor running at 100 MHz to handle MSCAN, LIN, and SPI interrupts independently of the main CPU.

It features Memory Protection Unit (MPU) with eight configurable address regions, ECC-enabled Flash (1-bit correction / 2-bit detection), and dual ATD converters (8/10/12-bit, 16-channel multiplexer) with 3 µs 10-bit conversion time - all qualified for automotive AEC-Q100 Grade 1 (-40°C to 125°C).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core CPU12X 16-bit core, compatible with MC9S12 ISA (no MEM/WAV/REV instructions), enabling legacy code reuse without recompilation.
Flash Memory 384 KB with ECC (64 data + 8 syndrome bits), supporting 1-bit fault correction and 2-bit fault detection for ASIL-B–capable system integrity.
RAM 24 KB SRAM, accessible without wait states for real-time buffer handling in CAN/LIN message processing.
Bus Frequency 50 MHz maximum CPU bus frequency, enabling deterministic timing for body control task scheduling and PWM generation.
XGATE Performance 100 MHz RISC co-processor with full peripheral access, offloading MSCAN mailbox management and LIN frame assembly from CPU.
Operating Temperature -40°C to 125°C ambient range, qualified per AEC-Q100 Grade 1 for under-hood and body control module deployment.
ADC Resolution 8/10/12-bit ATD with 16-channel mux and 3 µs 10-bit conversion time, supporting sensor monitoring (e.g., temperature, voltage) in STOP mode wake-up.
CAN Modules 4 MSCAN modules (CAN0/CAN1/CAN2/CAN4), each compliant with CAN 2.0A/B, supporting up to 1 Mbps bit rate and FULL-CAN operation with XGATE.

Pinout & Package

Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, with non-multiplexed external bus interface enabled.

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VDDX Power supply inputs Separate analog (VDDA), core (VDD), and XGATE (VDDX) rails enable optimized EMC filtering and noise isolation for mixed-signal operation.
RESET Active-low reset input Accepts external reset assertion; internal POR/LVD circuitry ensures reliable startup and brown-out recovery in automotive environments.
OSC1/OSC2 Crystal oscillator terminals Supports 4–16 MHz Pierce crystal or full-swing 2–40 MHz crystal; integrated transconductance ensures robust start-up across temperature and voltage.
CS0–CS3 Chip select outputs Enable glue-less interface to external RAM/Flash; each configurable with wait-state timeout or EWAIT deassertion for flexible memory timing.
PORTA–PORTP General-purpose I/O ports Up to 119 GPIO pins with hysteresis, configurable pull-up/down, and edge-sensitive interrupt capability for wake-up from STOP/WAIT modes.
CAN0TX/CAN0RX CAN0 differential transceiver interface Dedicated pins for CAN0 physical layer connection; internal termination and loop-back mode support self-test and diagnostics.

Key Features

Feature Design Value
Memory Protection Unit (MPU) Eight 8-byte–granularity address regions enforce supervisor/user mode separation and prevent unauthorized peripheral access during runtime.
Enhanced XGATE Co-processor Offloads MSCAN mailbox servicing, LIN frame encoding/decoding, and SPI data transfers - freeing CPU for application logic and reducing latency.
ECC-Protected Flash Single-bit error correction and double-bit error detection ensure Flash reliability over automotive lifetime (10+ years) without requiring external ECC logic.
Full-CAN with XGATE Enables unlimited virtual mailboxes and hardware-accelerated CAN filtering, supporting >32 concurrent CAN IDs in body controller gateways.
API Timer Asynchronous periodic interrupt with ±10% trimmable accuracy and 0.2 ms–13 s range operates in Full Stop mode, enabling low-power cyclic wake-up for battery-sensitive modules.
ATD Wake-up Capability Configurable analog comparison triggers wake-up from STOP mode on voltage/temperature threshold crossing - eliminating need for external comparators.

Applications

Body Controller Gateway Module

Use Scenario: Centralized control of lighting, power windows, door locks, and HVAC actuators in modern vehicle body electronics.

IC Role / Device Role / Timing Role: Primary MCU executing body control firmware, managing PWM-driven loads, reading analog sensors, and routing CAN/LIN messages.

Use Value: XGATE handles all CAN/LIN traffic while CPU manages actuator sequencing - achieving deterministic response under 5 ms for safety-critical lock/unlock commands.

Use Scenario: Protocol translation and message routing between high-speed CAN (powertrain) and low-speed LIN (door modules, seats).

IC Role / Device Role / Timing Role: Dual-bus bridge MCU with independent CAN0/CAN1 and LIN-capable SCI modules, coordinated by XGATE for zero-latency forwarding.

Use Value: FULL-CAN capability enables simultaneous handling of 64+ CAN IDs and 16+ LIN slaves - eliminating external protocol translators and reducing BOM cost.

Roof Module Seat Control Unit

Use Scenario: Integrated sunroof, panoramic roof, and ambient lighting control with position feedback and thermal monitoring.

IC Role / Device Role / Timing Role: Sensor fusion hub aggregating potentiometer, thermistor, and Hall-effect inputs; driving multi-phase motor drivers via PWM.

Use Value: On-chip 12-bit ATD with internal oscillator allows precise position sensing and thermal shutdown during STOP mode - no external ADC or clock required.

Use Scenario: Motorized seat adjustment with memory presets, heating, and occupancy detection via capacitive sensing.

IC Role / Device Role / Timing Role: Real-time motion controller using ECT timers for position capture, PWM for motor drive, and API timer for heater duty-cycle modulation.

Use Value: MPU-enforced memory partitioning isolates seat heating firmware from motion control code - meeting ISO 26262 ASIL-B functional safety requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S12XEP100MAG 1 MB Flash, 64 KB RAM, 208-pin MAPBGA; adds extra CAN/SCI modules and larger I/O count (152 pins). Targeted at flagship body controllers requiring higher integration density and external memory expansion. Select when >384 KB Flash or >119 GPIO are required; not pin-compatible due to MAPBGA vs. LQFP packaging.
S912XEQ512F1CAGR 512 KB Flash, 32 KB RAM, identical 144-pin LQFP package and peripheral set (4 CAN, 6 SCI, 3 SPI). Same footprint and software compatibility - ideal for future-proofing designs needing headroom for OTA updates or expanded feature sets. Drop-in Flash upgrade path; same pinout, timing, and qualification - requires only Flash image update, no PCB change.

Compared with S912XEQ384F1CAGR, MC9S12XEP100MAG offers greater memory and I/O but requires board redesign due to MAPBGA packaging, while S912XEQ512F1CAGR provides seamless Flash scalability within the same 144-pin LQFP footprint and qualification envelope.

Availability

S912XEQ384F1CAGR is available at Aetrix Electronics and suitable for automotive body control units, gateway modules, roof systems, and seat control units requiring stable component supply across extended product lifecycles.

Supply support for S912XEQ384F1CAGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The S12XE family - including S912XEQ384F1CAGR - was designed specifically for automotive body electronics requiring high system integrity, CAN/LIN networking, and ASIL-B–capable memory protection in harsh environments.

FAQ

What is the maximum operating temperature range for the S912XEQ384F1CAGR?

The S912XEQ384F1CAGR is qualified for operation from -40°C to 125°C ambient temperature per AEC-Q100 Grade 1 standards. This rating enables deployment in under-hood and passenger compartment locations where thermal stress is critical, and is validated across the full voltage range (3.3 V to 5.0 V). The on-chip temperature sensor and LVD circuitry provide real-time thermal monitoring and safe shutdown capability within the S912XEQ384F1CAGR's operational envelope.

Does the S912XEQ384F1CAGR support CAN FD or only classical CAN?

The S912XEQ384F1CAGR supports only classical CAN 2.0A/B (up to 1 Mbps) via its four MSCAN modules - it does not implement CAN FD physical layer or protocol enhancements. Its MSCAN modules are software-compatible with legacy S12 devices and achieve FULL-CAN performance when paired with the XGATE co-processor, but lack the arbitration bit rate switching, extended data length, and CRC improvements defined in ISO 11898-1:2015 for CAN FD. For CAN FD requirements, newer S32K or S32G families should be evaluated instead of the S912XEQ384F1CAGR.

Is the S912XEQ384F1CAGR pin-compatible with other S12XE derivatives like the S912XEQ512F1CAGR?

Yes, the S912XEQ384F1CAGR is fully pin-compatible with the S912XEQ512F1CAGR - both use the identical 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch) and share identical pin functions, electrical characteristics, and timing specifications. This allows direct Flash memory upgrades without PCB layout changes, making the S912XEQ384F1CAGR a scalable entry point for designs that may later require larger code space for feature expansion or OTA updates.

What debug interfaces does the S912XEQ384F1CAGR support?

The S912XEQ384F1CAGR supports single-wire Background Debug Mode (BDM) for non-intrusive memory access, flash programming, and real-time debugging. It also integrates the xDBG module with four hardware comparators (A–D), a 64-entry circular trace buffer, and tag/force-type breakpoint requests - enabling deep visibility into both CPU12X and XGATE execution flow. These capabilities are fully supported by CodeWarrior Development Studio and third-party tools from P&E Micro and iSystem, without requiring JTAG headers or additional debug probes beyond standard BDM cables.

How does the Memory Protection Unit (MPU) in the S912XEQ384F1CAGR enhance system safety?

The MPU in the S912XEQ384F1CAGR defines eight independent address regions with granularity down to 8 bytes, enforcing no-write and no-execute attributes per region. When combined with supervisor/user mode separation via the condition code register, it prevents unauthorized access to peripheral registers or critical Flash sectors - a foundational requirement for ISO 26262 ASIL-B compliance. Violations trigger non-maskable interrupts, enabling immediate fault containment and safe state transition, which directly enhances functional safety in body control applications where the S912XEQ384F1CAGR is deployed.

S912XEQ384F1CAGR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LQFP
Series:
HCS12X
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
119
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
24K x 8
Voltage - Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S912XEQ384F1CAGR FAQ

1.How can I place an order for S912XEQ384F1CAGR through Aetrix?

Please submit a Request for Quotation (RFQ) for S912XEQ384F1CAGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S912XEQ384F1CAGR reliable?

The price and inventory of S912XEQ384F1CAGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S912XEQ384F1CAGR is usually 5 days.

3.What payment methods are accepted for S912XEQ384F1CAGR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S912XEQ384F1CAGR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S912XEQ384F1CAGR?

S912XEQ384F1CAGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S912XEQ384F1CAGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S912XEQ384F1CAGR?

For technical support, including S912XEQ384F1CAGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S912XEQ384F1CAGR requirements.

6.How does Aetrix verify that S912XEQ384F1CAGR is sourced from the original manufacturer or authorized distributors?

All S912XEQ384F1CAGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S912XEQ384F1CAGR meets industry standards.

7.What is the process for return or replacement of S912XEQ384F1CAGR?

All S912XEQ384F1CAGR units undergo pre-shipment inspection (PSI). If there is an issue with S912XEQ384F1CAGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S912XEQ384F1CAGR part is unused and in its original packaging.

Return procedure for S912XEQ384F1CAGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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