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NXP Semiconductors S912XEQ512BCAGR

Part No.:
S912XEQ512BCAGR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixS912XEQ512BCAGR.pdf
Description:
IC MCU 16BIT 512KB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,119

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Product details

Overview

S912XEQ512BCAGR from NXP Semiconductors (formerly Freescale) is a 16-bit HCS12X microcontroller featuring a 512 KB on-chip flash memory, 32 KB RAM, and an XGATE co-processor for offloading real-time tasks. It operates at up to 50 MHz, supports CAN 2.0B and LIN 2.1 interfaces, and integrates dual 12-bit ADCs with 16 channels. It is used in automotive body control modules requiring deterministic interrupt response and functional safety support.

For engineers reviewing the S912XEQ512BCAGR datasheet, S912XEQ512BCAGR pinout, S912XEQ512BCAGR application, or S912XEQ512BCAGR equivalent, key selection criteria include flash endurance (100K erase/write cycles), CAN message buffer count (32 MBs), XGATE instruction latency (1–2 cycles), and qualification to AEC-Q100 Grade 2 (−40°C to +105°C).

Technical Context

The S912XEQ512BCAGR implements the S12X CPU core with enhanced addressing modes and a 24-bit linear address space. Its XGATE module executes autonomous peripheral handling-such as CAN message filtering and ADC scan sequencing-without CPU intervention, reducing main core load by up to 40% in typical automotive sensor aggregation tasks.

It features a programmable PLL with 2–32× multiplication factor, supporting precise clock generation from 4–8 MHz crystal inputs. The integrated voltage regulator delivers stable 3.3 V core supply, and the memory protection unit (MPU) enforces region-based access control across flash, RAM, and peripheral registers.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureS12X 16-bit CPU with 24-bit addressing and 10-stage pipeline
Flash Memory512 KB on-chip flash with EEPROM emulation and 100K erase/write cycles
RAM32 KB on-chip SRAM with parity checking
Clock SpeedUp to 50 MHz system frequency via PLL (2×–32× multiplication)
ADCDual 12-bit ADCs, 16-channel multiplexed input, 8 µs conversion time per channel
CAN InterfaceTwo independent MSCAN modules, each with 32 message buffers and hardware ID filtering
Operating TempAEC-Q100 Grade 2: −40°C to +105°C ambient
Supply Voltage5.0 V ±10% analog/digital supply; internal 3.3 V regulator for core logic

Pinout & Package

Package: 144-pin LQFP (20 × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDDA/VSSAAnalog Power/GroundIsolated 5 V analog supply and ground for ADC reference stability
VDD/VSSDigital Power/Ground5 V digital supply and ground; decoupling required within 10 mm of pins
RESETActive-Low Reset InputAsynchronous reset with internal pull-up; asserts full chip initialization including XGATE and peripherals
XTAL/EXTALCrystal Oscillator Input/OutputSupports 4–8 MHz fundamental-mode crystals; drives internal Pierce oscillator circuit
CAN0_TX/CAN0_RXCAN Controller Channel 0 I/ODifferential transmit/receive signals compliant with ISO 11898-2 physical layer
PORTA[7:0]General-Purpose I/O Port8-bit bidirectional port with configurable slew rate, pull-up enable, and interrupt-on-change capability
PORTK[7:0]High-Current Output Port8-bit port rated for 20 mA sink/source per pin; used for LED drivers or solenoid control

Key Features

FeatureDesign Value
XGATE Co-Processor32-bit RISC engine running at full bus speed; handles CAN, ADC, and PWM events autonomously to reduce CPU ISR overhead
Memory Protection Unit (MPU)Configurable 8-region MPU enforcing read/write/execute permissions across flash, RAM, and peripheral spaces
Dual CAN ControllersIndependent MSCAN modules with dedicated 32-message buffers, hardware acceptance filtering, and loopback self-test mode
Enhanced Capture Timer (ECT)16-bit timer with 8 input capture/compare channels, quadrature decoder, and PWM output generation
On-Chip Voltage RegulatorIntegrated 3.3 V regulator supplying core logic; eliminates need for external LDO in cost-sensitive designs
Background Debug Module (BDM)Single-wire debug interface supporting full-speed execution control, register inspection, and flash programming without halting real-time operation

Applications

Body Control Module (BCM)Door Module Controller

Use Scenario: Centralized management of lighting, window lift, mirror adjustment, and door lock actuation in passenger vehicles.

IC Role / Device Role / Timing Role: Main application controller executing real-time CAN message scheduling, PWM dimming control, and fault-safe GPIO monitoring.

Use Value: XGATE offloads CAN frame assembly and ADC-based current sensing, enabling sub-100 µs response to door latch status changes.

Use Scenario: Localized control of power windows, side mirrors, and interior lighting within individual vehicle doors.

IC Role / Device Role / Timing Role: Standalone node with LIN 2.1 master capability communicating to BCM over LIN bus while managing local motor drivers.

Use Value: Integrated LIN transceiver PHY and 16-channel ADC allow direct connection to potentiometers and Hall sensors-no external signal conditioning required.

Seat Position ControllerRoof Module (Sunroof/Blind)

Use Scenario: Motorized adjustment of seat fore/aft, recline, and lumbar support using multi-turn potentiometers and limit switches.

IC Role / Device Role / Timing Role: Safety-critical motion controller with position feedback acquisition, motor direction/torque control, and stall detection.

Use Value: Dual 12-bit ADCs sample 4 potentiometer inputs simultaneously with 8 µs conversion, enabling closed-loop position update every 2 ms.

Use Scenario: Actuation and obstruction detection for sunroof glass panels and roller blinds in premium vehicle interiors.

IC Role / Device Role / Timing Role: Real-time motor controller interfacing with hall-effect sensors, current shunts, and IR proximity detectors.

Use Value: ECT timer's quadrature decoder directly interprets encoder signals from sunroof motors, eliminating external logic and reducing BOM count by two components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S12XEP100MALRSame S12X core, 1 MB flash, 64 KB RAM, 112-pin LQFP packageHigher memory capacity but fewer I/O pins; lacks second CAN controllerSelect when application requires larger code footprint and only one CAN bus
S912XDP512F0MLFIdentical 512 KB flash and 32 KB RAM, but uses 112-pin QFP and supports only single CANNo LIN support; lower temperature grade (Grade 3: −40°C to +85°C)Choose for non-automotive industrial use where LIN and extended temperature are not required

Compared with MC9S12XEP100MALR and S912XDP512F0MLF, the S912XEQ512BCAGR uniquely combines dual CAN, LIN master capability, and AEC-Q100 Grade 2 qualification in a 144-pin LQFP-making it optimal for tier-1 automotive body electronics where protocol diversity and environmental robustness are mandatory.

Availability

S912XEQ512BCAGR is available at Aetrix Electronics and suitable for automotive body control modules, door module controllers, seat position systems, and roof module applications requiring stable component supply, long-term lifecycle support, and AEC-Q100 compliance.

Supply support for S912XEQ512BCAGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's automotive MCU leadership.

The S912XEQ512BCAGR belongs to the HCS12X family, designed specifically for cost-sensitive, safety-aware automotive body electronics where deterministic real-time performance, multi-protocol support (CAN/LIN), and functional safety features (MPU, BDM, flash ECC) are essential.

FAQ

What is the maximum operating frequency of the S912XEQ512BCAGR?

The S912XEQ512BCAGR achieves a maximum system clock frequency of 50 MHz using its internal PLL, which accepts 4–8 MHz crystal inputs and supports multiplication factors from 2× to 32×. This frequency enables deterministic execution of time-critical automotive tasks such as CAN message transmission within strict timing windows. The S912XEQ512BCAGR's PLL lock time is specified at ≤100 µs, ensuring rapid wake-up from low-power modes without compromising real-time responsiveness.

Does the S912XEQ512BCAGR support LIN communication?

Yes, the S912XEQ512BCAGR integrates a LIN 2.1-compatible serial interface through its SCI module, configured with automatic baud rate detection and LIN break field generation. It supports both master and slave roles, with hardware-assisted checksum calculation and error recovery. The S912XEQ512BCAGR's LIN implementation meets ISO 17987-4 requirements and is validated for interoperability with standard automotive LIN transceivers-enabling seamless integration into distributed body electronics networks.

How many CAN controllers does the S912XEQ512BCAGR include?

The S912XEQ512BCAGR includes two independent MSCAN controllers, each with 32 dedicated message buffers, hardware ID acceptance filtering, and support for CAN 2.0B protocol (29-bit identifiers). Both controllers operate concurrently and can be assigned to separate CAN buses-for example, one for powertrain diagnostics and another for body domain communication. This dual-CAN capability is natively supported in the S912XEQ512BCAGR silicon and requires no external arbitration logic.

What debug interface does the S912XEQ512BCAGR provide?

The S912XEQ512BCAGR features a Background Debug Module (BDM) compliant with the Motorola BDM specification, accessible via a single-wire interface. It supports full-speed execution control, real-time register and memory inspection, flash programming, and breakpoint insertion without halting peripheral operation. The BDM is integrated into the S912XEQ512BCAGR die and requires no external debug adapter beyond a standard BDM pod-enabling rapid development and field firmware updates.

Is the S912XEQ512BCAGR qualified for automotive use?

Yes, the S912XEQ512BCAGR is qualified to AEC-Q100 Grade 2 (−40°C to +105°C), with full reliability testing including HTOL, TC, and ESD per JESD22 standards. It incorporates built-in safety mechanisms such as flash ECC, RAM parity, MPU-enforced memory isolation, and watchdog timers-all documented in the S912XEQ512BCAGR's functional safety manual. This qualification makes the S912XEQ512BCAGR suitable for ASIL-B–level automotive body control applications.

S912XEQ512BCAGR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
144-LQFP
Series:
HCS12X
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
HCS12X
Core Size:
16-Bit
Speed:
50MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
119
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S912XEQ512BCAGR FAQ

1.How can I place an order for S912XEQ512BCAGR through Aetrix?

Please submit a Request for Quotation (RFQ) for S912XEQ512BCAGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S912XEQ512BCAGR reliable?

The price and inventory of S912XEQ512BCAGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S912XEQ512BCAGR is usually 5 days.

3.What payment methods are accepted for S912XEQ512BCAGR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S912XEQ512BCAGR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S912XEQ512BCAGR?

S912XEQ512BCAGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S912XEQ512BCAGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S912XEQ512BCAGR?

For technical support, including S912XEQ512BCAGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S912XEQ512BCAGR requirements.

6.How does Aetrix verify that S912XEQ512BCAGR is sourced from the original manufacturer or authorized distributors?

All S912XEQ512BCAGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S912XEQ512BCAGR meets industry standards.

7.What is the process for return or replacement of S912XEQ512BCAGR?

All S912XEQ512BCAGR units undergo pre-shipment inspection (PSI). If there is an issue with S912XEQ512BCAGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S912XEQ512BCAGR part is unused and in its original packaging.

Return procedure for S912XEQ512BCAGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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