NXP Semiconductors S912XEQ512J3CAGR
- Part No.:
- S912XEQ512J3CAGR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
S912XEQ512J3CAGR.pdf
- Description:
- IC MCU 16BIT 512KB FLASH 144LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,126
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Product details
Overview
S912XEQ512J3CAGR from NXP Semiconductors (formerly Freescale) is a 16-bit automotive microcontroller featuring the CPU12X core, 512 KB on-chip Flash memory with ECC, 32 KB RAM, and integrated MSCAN, XGATE co-processor, and enhanced ATD. It operates at up to 50 MHz bus frequency and supports -40°C to 125°C ambient temperature - deployed in body control modules for CAN/LIN gateway functions and power driver control.
For engineers reviewing the S912XEQ512J3CAGR datasheet, S912XEQ512J3CAGR pinout, S912XEQ512J3CAGR application, or S912XEQ512J3CAGR equivalent, key selection criteria include Flash ECC capability, XGATE offloading of CAN/LIN protocol stacks, 144-pin LQFP package compatibility, and automotive-grade temperature range compliance.
Technical Context
The S912XEQ512J3CAGR implements a 16-bit CPU12X core with full MC9S12 instruction set compatibility (excluding five fuzzy instructions), enhanced indexed addressing, and large data segment access independent of PPAGE. It integrates an XGATE RISC co-processor running at 100 MIPS, programmable in C, and capable of servicing all peripherals without CPU intervention.
System integrity is enforced via a Memory Protection Unit (MPU) supporting eight configurable address regions with 8-byte granularity, plus Flash ECC delivering single-bit correction and double-bit detection. The device includes six MSCAN modules (CAN 2.0A/B compliant), four SCI interfaces, three SPI modules, and dual 8-channel ATD converters with 3 µs 10-bit conversion time.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | CPU12X 16-bit core compatible with MC9S12 instruction set; enables legacy code reuse while supporting enhanced addressing modes. |
| Flash Memory | 512 KB with ECC (64 data + 8 syndrome bits); provides single-bit fault correction and double-bit fault detection for ASIL-B–capable systems. |
| XGATE Co-processor | 100 MIPS RISC engine; handles CAN/LIN protocol stacks, SPI/SCI transfers, and DMA-like data movement without CPU wait states. |
| MSCAN Modules | 6 independent CAN 2.0A/B modules; support up to 1 Mbps bit rate, FIFO-based receive buffers, and FULL-CAN operation when paired with XGATE. |
| ATD Converter | Dual 8-channel 10-bit ADC; achieves 3 µs single-conversion time and supports wake-up from STOP mode on analog threshold crossing. |
| Operating Temperature | -40°C to 125°C; qualified for under-hood automotive applications requiring extended thermal reliability. |
| Package | 144-pin LQFP (20 × 20 mm, 0.5 mm pitch); supports non-multiplexed external bus interface for glueless connection to external memories. |
Pinout & Package
Package: 144-pin LQFP (20 × 20 mm, 0.5 mm pitch, case no 918-03). Pinout validated per MC9S12XEQ512 datasheet Rev. 7 and Freescale reference schematics for 144-pin S12XE derivatives.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDPLL | Power supply inputs | Separate 5V supplies for I/O, analog, and PLL domains enable optimized EMC filtering and noise isolation. |
| VSS, VSSA, VSSPLL | Ground returns | Dedicated ground planes per supply domain reduce coupling between digital, analog, and clock circuitry. |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; initiates POR, COP timeout recovery, or illegal address trap response. |
| XTAL, EXTAL | Crystal oscillator terminals | Support 4–16 MHz Pierce crystal; internal transconductance optimized for reliable start-up across temperature and voltage. |
| CAN0_TX, CAN0_RX | CAN physical layer interface | Differential signaling pair for CAN0 controller; requires external transceiver for bus termination and level translation. |
| SCI0_TX, SCI0_RX | UART serial interface | Full-duplex NRZ communication path; supports LIN master/slave framing when used with XGATE-managed timing. |
Key Features
| Feature | Design Value |
|---|---|
| Memory Protection Unit (MPU) | Eight configurable 8-byte–granularity address regions with no-write/no-execute attributes; enforces task isolation and prevents unauthorized peripheral access. |
| Enhanced ATD with Stop-mode wake-up | 10-bit resolution, 3 µs conversion, and analog comparator trigger; enables low-power sensor monitoring without CPU polling. |
| Non-multiplexed external bus | Glueless interface to asynchronous SRAM/Flash; eliminates address/data bus contention and simplifies high-speed memory expansion. |
| Programmable IPLL with spread spectrum | Internally filtered PLL with frequency modulation option; reduces electromagnetic emissions without external components. |
| Background Debug Module (BDM) | Single-wire debug interface supporting non-intrusive memory access, flash programming, and security lock/unlock. |
Applications
| Body Control Module (BCM) | Gateway Controller |
|---|---|
|
Use Scenario: Centralized management of door locks, lighting, wipers, and HVAC in modern vehicle platforms. IC Role / Device Role / Timing Role: Primary MCU executing body ECU firmware, coordinating CAN/LIN messaging, and driving PWM-controlled loads. Use Value: XGATE offloads CAN protocol handling and LIN frame generation, freeing CPU bandwidth for real-time actuator control and diagnostics. |
Use Scenario: Bridging communication between high-speed powertrain CAN and low-speed body LIN networks. IC Role / Device Role / Timing Role: Dual-bus interface controller with hardware-assisted message routing and priority arbitration. Use Value: Six MSCAN modules and four SCI interfaces allow concurrent multi-network operation; MPU isolates gateway tasks from application code. |
| Smart Junction Box | Roof Module Controller |
|
Use Scenario: Distributed power distribution unit managing fused outputs, load diagnostics, and short-circuit protection. IC Role / Device Role / Timing Role: High-reliability system controller with EEPROM emulation for configuration storage and fault logging. Use Value: Emulated EEPROM (EEE) provides 4 KB of wear-levelled non-volatile storage; D-Flash sectors support field-upgradable firmware patches. |
Use Scenario: Integrated sunroof, panoramic roof, and ambient lighting control with touch-sensor inputs and RGB LED drivers. IC Role / Device Role / Timing Role: Mixed-signal controller performing analog sensor acquisition, PWM dimming, and LIN-based human-machine interface. Use Value: Dual ATD converters sample potentiometers and thermistors simultaneously; 8-channel PWM supports independent RGB channel control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12XEP100MAG | 1 MB Flash, 64 KB RAM, 208-pin MAPBGA; adds two additional CAN modules and 32 more I/O pins. | Targeted at higher-complexity gateways or central domain controllers requiring larger code footprint and expanded peripheral count. | Select when >512 KB Flash or >144 I/O pins are required; not pin-compatible due to different package and pinout. |
| S912XDP512F0MLH | Same 512 KB Flash and 32 KB RAM but uses 112-pin LQFP; lacks non-multiplexed external bus and has reduced I/O count (91 vs. 119). | Suitable for space-constrained body modules where external memory expansion is unnecessary and cost optimization is critical. | Choose for lower BOM cost and smaller PCB footprint; verify I/O mapping and peripheral availability against design requirements. |
Compared with S912XEQ512J3CAGR, MC9S12XEP100MAG offers greater memory and I/O scalability at the cost of larger package and layout redesign, while S912XDP512F0MLH trades external bus capability and pin count for compactness and cost - making each alternative suitable only for specific architectural constraints.
Availability
S912XEQ512J3CAGR is available at Aetrix Electronics and suitable for automotive body control modules, gateway controllers, smart junction boxes, and roof module designs requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualification.
Supply support for S912XEQ512J3CAGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in automotive microcontrollers dating to the Motorola/Freescale era.
The S912XEQ512J3CAGR belongs to the MC9S12XE family - engineered specifically for automotive body electronics demanding enhanced system integrity, CAN/LIN protocol offload, and extended temperature operation without sacrificing 16-bit code efficiency.
FAQ
What is the maximum bus frequency supported by the S912XEQ512J3CAGR?
The S912XEQ512J3CAGR supports a maximum CPU bus frequency of 50 MHz and an XGATE bus frequency of 100 MHz. These frequencies are achieved using the internal IPLL with optional spread-spectrum modulation to meet EMC requirements. The S912XEQ512J3CAGR maintains full performance across its specified operating voltage range of 3.3 V ±5% to 5.0 V +10%.
Does the S912XEQ512J3CAGR include error-correcting code (ECC) for Flash memory?
Yes, the S912XEQ512J3CAGR includes ECC on its 512 KB Flash memory, using 64 data bits plus 8 syndrome bits per word to provide single-bit fault correction and double-bit fault detection. This ECC implementation is hardware-enforced and active during all read operations, supporting functional safety requirements for ASIL-B–compliant automotive systems.
How many CAN modules does the S912XEQ512J3CAGR integrate, and what protocol versions do they support?
The S912XEQ512J3CAGR integrates six MSCAN modules supporting CAN 2.0A and 2.0B protocols with software compatibility, standard and extended identifier frames, and programmable bit rates up to 1 Mbps. Each module includes dedicated transmit/receive buffers, flexible acceptance filtering, and bus-off recovery - enabling robust multi-network automotive communication.
What is the role of the XGATE co-processor in the S912XEQ512J3CAGR architecture?
The XGATE co-processor in the S912XEQ512J3CAGR is a programmable 100 MIPS RISC engine that handles time-critical peripheral tasks - including CAN/LIN protocol stack execution, SPI/SCI data transfers, and ATD result processing - without CPU intervention. Its ability to service any peripheral and trigger CPU interrupts upon completion significantly improves real-time determinism and frees the main CPU for application logic.
Is the S912XEQ512J3CAGR qualified for automotive temperature ranges?
Yes, the S912XEQ512J3CAGR is qualified for operation from -40°C to 125°C ambient temperature, meeting AEC-Q100 Grade 0 requirements. This rating is verified across all electrical parameters including Flash write/erase endurance, RAM retention, and peripheral timing - ensuring reliability in under-hood and other thermally demanding automotive environments.
S912XEQ512J3CAGR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 144-LQFP
- Series:
- HCS12X
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- HCS12X
- Core Size:
- 16-Bit
- Speed:
- 50MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 119
- Program Memory Size:
- 512KB (512K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 4K x 8
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.72V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S912XEQ512J3CAGR FAQ
1.How can I place an order for S912XEQ512J3CAGR through Aetrix?
Please submit a Request for Quotation (RFQ) for S912XEQ512J3CAGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S912XEQ512J3CAGR reliable?
The price and inventory of S912XEQ512J3CAGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S912XEQ512J3CAGR is usually 5 days.
3.What payment methods are accepted for S912XEQ512J3CAGR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S912XEQ512J3CAGR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S912XEQ512J3CAGR?
S912XEQ512J3CAGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S912XEQ512J3CAGR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S912XEQ512J3CAGR?
For technical support, including S912XEQ512J3CAGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S912XEQ512J3CAGR requirements.
6.How does Aetrix verify that S912XEQ512J3CAGR is sourced from the original manufacturer or authorized distributors?
All S912XEQ512J3CAGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S912XEQ512J3CAGR meets industry standards.
7.What is the process for return or replacement of S912XEQ512J3CAGR?
All S912XEQ512J3CAGR units undergo pre-shipment inspection (PSI). If there is an issue with S912XEQ512J3CAGR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S912XEQ512J3CAGR part is unused and in its original packaging.
Return procedure for S912XEQ512J3CAGR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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