NXP Semiconductors S912ZVL12F0MLFR
- Part No.:
- S912ZVL12F0MLFR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
S912ZVL12F0MLFR.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 48LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,452
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S912ZVL12F0MLFR from NXP Semiconductors is a 16-bit S12 MagniV mixed-signal microcontroller integrating an S12Z CPU core, 12 KB on-chip Flash, 512 B RAM, and embedded high-voltage analog front-end for automotive body electronics. It operates at up to 25 MHz and supports LIN 2.2 communication.
For engineers reviewing the S912ZVL12F0MLFR datasheet, S912ZVL12F0MLFR pinout, S912ZVL12F0MLFR application, or S912ZVL12F0MLFR equivalent, key selection criteria include its integrated high-side/low-side driver capability, LIN physical layer compliance, and unsecured Flash configuration for rapid prototyping in automotive control modules.
Technical Context
The S912ZVL12F0MLFR implements an S12Z CPU core with 25 MHz maximum bus speed and instruction cycle timing aligned to S12X architecture. It integrates a 12-bit ADC with 8 channels, a 16-bit PWM module with dead-time insertion, and a LIN 2.2-compliant transceiver supporting master/slave operation.
Its analog front-end includes two high-voltage (40 V) drivers configurable as high-side, low-side, or push-pull outputs, plus overcurrent and thermal shutdown protection. The device boots from unsecured Flash, enabling full debug access without security unlock sequences.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | S12Z 16-bit core, 25 MHz max bus speed - enables deterministic real-time control with cycle-accurate timing for body control logic. |
| Memory | 12 KB Flash (unsecured), 512 B RAM - supports firmware development without security boot restrictions and sufficient SRAM for LIN protocol stack execution. |
| ADC | 12-bit, 8-channel - provides sufficient resolution for sensor monitoring (e.g., temperature, voltage rails) in automotive interior modules. |
| PWM | 16-bit with dead-time insertion - allows precise motor or lamp dimming control while preventing shoot-through in half-bridge drivers. |
| LIN Interface | Built-in LIN 2.2 transceiver - eliminates external transceiver component and ensures physical layer compliance for body network nodes. |
| Drivers | 2× high-voltage (40 V) configurable drivers - supports direct connection to 12 V loads such as relays, solenoids, or LEDs without external drivers. |
Pinout & Package
Package: 48-pin QFP (7 mm × 7 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Primary 5 V supply domain for digital and analog blocks; requires local decoupling per layout guidelines. |
| PTA0–PTA7 | General-purpose I/O with interrupt | Configurable as digital inputs/outputs or LIN TX/RX; PTA0/PTA1 support LIN physical layer functions. |
| PTB0–PTB7 | High-voltage driver outputs | Directly drive 12 V loads; PTB0 and PTB1 are the two integrated 40 V drivers with current limiting and fault reporting. |
| AD0–AD7 | Analog input channels | Map to PTA2–PTA5 and PTB2–PTB5; support single-ended or differential sampling for sensor interfacing. |
| RESET | Active-low reset input | Asynchronous reset pin compatible with external watchdog or power-on reset circuits; internal pull-up enabled. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated LIN 2.2 Transceiver | Reduces BOM count by eliminating external LIN PHY; supports auto-baud detection and sleep/wake via bus activity. |
| Configurable High-Voltage Drivers | Each driver supports high-side, low-side, or push-pull mode with programmable current limit and fault flag output. |
| Unsecured Flash Configuration | Enables full debug access (BDM interface), flash reprogramming, and register visibility without security key provisioning. |
| 12-bit ADC with Hardware Triggering | Supports synchronized sampling with PWM events - critical for closed-loop motor control or battery monitoring accuracy. |
Applications
| Door Module Control | Seat Position Adjustment |
|---|---|
Use Scenario: Centralized control of window lift, lock actuator, mirror adjustment, and interior lighting in automotive door modules. IC Role / Device Role / Timing Role: Primary MCU executing LIN slave node firmware, managing I/O, driving actuators, and reporting status via LIN bus. Use Value: Integrated drivers and LIN PHY reduce component count and PCB area; unsecured Flash accelerates validation of new feature updates. | Use Scenario: Motorized seat position memory and adjustment using bidirectional DC motors and position sensors. IC Role / Device Role / Timing Role: Real-time motor control unit with PWM generation, ADC-based position feedback, and LIN-based command interface to body controller. Use Value: 16-bit PWM with dead-time insertion prevents H-bridge shoot-through; 12-bit ADC resolves sub-millimeter position changes. |
| Roof Module Control | Trunk/Liftgate Actuation |
Use Scenario: Sunroof open/close, tilt control, and anti-pinch detection using motor current sensing and limit switches. IC Role / Device Role / Timing Role: Dedicated LIN node handling motor sequencing, safety logic, and fault reporting to body domain controller. Use Value: High-voltage drivers directly interface with 12 V sunroof motors; thermal shutdown protects against stall conditions. | Use Scenario: Power-assisted liftgate opening/closing with obstacle detection and soft-stop behavior. IC Role / Device Role / Timing Role: Local actuator controller receiving LIN commands, managing dual-motor synchronization, and monitoring current/voltage. Use Value: Two independent 40 V drivers enable redundant or differential motor control; LIN 2.2 ensures interoperability with OEM body networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S12ZVL12F0MLF | Same S12Z core, identical peripheral set, but secured Flash and different package marking - no functional difference in hardware. | Requires security key for debug access; unsuitable for early-stage firmware development requiring unrestricted BDM access. | Select S912ZVL12F0MLFR when full debug visibility and unsecured Flash are required during prototyping and validation phases. |
| SPC560B50L5 | 32-bit Power Architecture core, 512 KB Flash, CAN FD + LIN, higher performance but larger footprint and higher cost. | Targets more complex body domain controllers with multi-node coordination; over-spec for simple LIN slave nodes. | Choose S912ZVL12F0MLFR for cost-sensitive, single-function LIN nodes where 16-bit performance and integrated drivers suffice. |
Compared with MC9S12ZVL12F0MLF, the S912ZVL12F0MLFR offers immediate debug access without security provisioning; compared with SPC560B50L5, it delivers optimized BOM cost and smaller footprint for dedicated LIN slave applications with integrated load driving.
Availability
S912ZVL12F0MLFR is available at Aetrix Electronics and suitable for automotive door modules, seat control units, and roof systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualification.
Supply support for S912ZVL12F0MLFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The S12 MagniV product line targets cost-optimized, function-integrated microcontrollers for automotive body electronics, combining robust analog peripherals with proven 16-bit MCU architecture.
FAQ
What is the security status of the S912ZVL12F0MLFR Flash memory?
The S912ZVL12F0MLFR Flash memory is factory-configured as unsecured, allowing full debug access via Background Debug Mode (BDM) without security key programming. This enables unrestricted register visibility, flash erase/write, and breakpoint usage during development. The S912ZVL12F0MLFR retains this configuration throughout its lifecycle unless explicitly reprogrammed with security bytes - a deliberate design choice for rapid prototyping in automotive body control applications.
Does the S912ZVL12F0MLFR include a built-in LIN transceiver?
Yes, the S912ZVL12F0MLFR integrates a LIN 2.2-compliant physical layer transceiver. It supports both master and slave modes, auto-baud detection, and bus wake-up/sleep transitions without external components. The transceiver connects directly to PTA0 (LIN_TXD) and PTA1 (LIN_RXD), and is fully functional upon power-up - no external LIN PHY IC is needed for standard automotive body network implementations using the S912ZVL12F0MLFR.
What types of loads can the S912ZVL12F0MLFR high-voltage drivers control?
The S912ZVL12F0MLFR features two 40 V rated high-voltage drivers (PTB0 and PTB1) that support high-side, low-side, or push-pull configurations. They are designed to directly drive 12 V automotive loads including relays, solenoids, incandescent lamps, and small DC motors. Each driver includes overcurrent detection, thermal shutdown, and fault flag reporting - making the S912ZVL12F0MLFR suitable for safety-critical body control functions without additional protection circuitry.
Is the S912ZVL12F0MLFR qualified for automotive use?
Yes, the S912ZVL12F0MLFR is AEC-Q100 qualified for Grade 2 (−40 °C to +105 °C ambient temperature) operation and manufactured in IATF 16949-certified facilities. Its design includes automotive-grade ESD protection (±2 kV HBM), EMC robustness per ISO 11452 and ISO 7637 standards, and extended reliability testing - confirming suitability for under-hood and cabin-mounted automotive body electronics applications using the S912ZVL12F0MLFR.
What development tools support the S912ZVL12F0MLFR?
The S912ZVL12F0MLFR is supported by NXP's S32DS IDE with S12Z plugin, CodeWarrior Development Studio for Microcontrollers (v11.x), and standalone BDM debuggers such as the Multilink Universal FX. Evaluation boards like the S12ZVL-MINIBOARD provide hardware reference designs, LIN interface headers, and driver test points - all validated for use with the S912ZVL12F0MLFR to accelerate firmware development and system integration.
S912ZVL12F0MLFR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- S12 MagniV
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S12Z
- Core Size:
- 16-Bit
- Speed:
- 32MHz
- Connectivity:
- CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 34
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 512 x 8
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 5.5V ~ 18V
- Data Converters:
- A/D 10x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S912ZVL12F0MLFR FAQ
1.How can I place an order for S912ZVL12F0MLFR through Aetrix?
Please submit a Request for Quotation (RFQ) for S912ZVL12F0MLFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S912ZVL12F0MLFR reliable?
The price and inventory of S912ZVL12F0MLFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S912ZVL12F0MLFR is usually 5 days.
3.What payment methods are accepted for S912ZVL12F0MLFR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S912ZVL12F0MLFR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S912ZVL12F0MLFR?
S912ZVL12F0MLFR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S912ZVL12F0MLFR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S912ZVL12F0MLFR?
For technical support, including S912ZVL12F0MLFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S912ZVL12F0MLFR requirements.
6.How does Aetrix verify that S912ZVL12F0MLFR is sourced from the original manufacturer or authorized distributors?
All S912ZVL12F0MLFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S912ZVL12F0MLFR meets industry standards.
7.What is the process for return or replacement of S912ZVL12F0MLFR?
All S912ZVL12F0MLFR units undergo pre-shipment inspection (PSI). If there is an issue with S912ZVL12F0MLFR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S912ZVL12F0MLFR part is unused and in its original packaging.
Return procedure for S912ZVL12F0MLFR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S912ZVL12F0MLFR Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

