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NXP Semiconductors S9S08DN32F1MLC

Part No.:
S9S08DN32F1MLC
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixS9S08DN32F1MLC.pdf
Description:
IC MCU 8BIT 32KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,504

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Product details

Overview

S9S08DN32F1MLC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip Flash, 2 KB RAM, and 2 KB EEPROM, operating at up to 40 MHz CPU / 20 MHz bus frequency. It integrates ADC, SPI, I²C, SCI with LIN/J2602 support, RTC, two analog comparators, and six-channel TPM for embedded control in automotive body electronics and industrial sensors.

For engineers reviewing the S9S08DN32F1MLC datasheet, S9S08DN32F1MLC pinout, S9S08DN32F1MLC application, or S9S08DN32F1MLC equivalent, key selection criteria include Flash size (32 KB), EEPROM endurance (100K erase/write cycles), real-time interrupt capability in Stop3 mode, and LIN 2.0-compliant SCI interface for automotive networked nodes.

Technical Context

The S9S08DN32F1MLC implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with internal reference trimming and external crystal support (1–16 MHz).

On-chip peripherals include a 12-bit, 16-channel ADC with 2.5 μs conversion time and temperature sensor, dual analog comparators with bandgap reference option, and two timer modules (TPM1: 6-channel, TPM2: 2-channel) supporting input capture, output compare, and PWM generation.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core with 40-MHz max operation (20-MHz bus)
Flash Memory32 KB program/erase over full voltage/temperature range
EEPROM2 KB in-circuit programmable with 4-/8-byte sector erase
RAM2 KB static RAM for data and stack storage
ADC12-bit resolution, 16-channel, 2.5 μs conversion time, internal temp sensor
SCI InterfaceOne LIN 2.0 and SAE J2602 compliant serial channel with wake-on-break
Power ModesTwo very low-power Stop modes (Stop2/Stop3), Wait, and Run with RTI in all states

Pinout & Package

Package: 48-pin LQFP (7×7 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual 2.7–5.5 V supply rails for core/analog domains
XTAL, EXTALCrystal oscillator inputsSupports 1–16 MHz crystals or ceramic resonators for precise timing
RESETActive-low reset inputAsynchronous reset with internal pull-up; accepts external debounced signal
BKGD/MSSingle-wire background debugEnables on-chip debugging and flash programming via BDM interface
AD0–AD15Analog input channels16 of 53 GPIO pins configurable as ADC inputs with internal reference options
PTA0–PTA7, PTB0–PTB7, etc.General-purpose I/O ports53 total GPIO with configurable pull, slew rate, drive strength, and edge-sensitive interrupts

Key Features

FeatureDesign Value
Flash security and block protectionPrevents unauthorized read/erase via flash protection register; supports vector redirection
In-circuit programmable EEPROM2 KB EEPROM with 100K-cycle endurance and simultaneous execute-while-program capability
Real-time interrupt in Stop3 mode1 kHz internal low-power oscillator enables periodic wake-up without external components
LIN 2.0–compliant SCIHardware support for master break generation, slave break detection, and wakeup on active edge
Temperature-compensated FLLFLL achieves ±1.5% deviation over temperature using factory-trimmed internal reference

Applications

Automotive Door ModuleIndustrial Temperature Sensor Node

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in vehicle door assemblies.

IC Role / Device Role / Timing Role: Main system controller executing LIN slave protocol, managing analog sensor inputs (e.g., ambient temp), and driving discrete outputs via GPIO/PWM.

Use Value: Integrated LIN SCI, 12-bit ADC with internal temperature sensor, and EEPROM for calibration storage eliminate external transceivers and nonvolatile memory ICs.

Use Scenario: Battery-powered wireless node measuring ambient and process temperature in HVAC or factory equipment.

IC Role / Device Role / Timing Role: Low-power sensing node performing periodic ADC conversions, storing readings in EEPROM, and waking via RTC or RTI for transmission.

Use Value: Very low-power Stop3 mode with 1 kHz RTI enables 1-second wake intervals while consuming <1.5 µA, extending battery life beyond 5 years.

Smart Lighting Control UnitMotor Position Feedback Interface

Use Scenario: DALI- or 0–10 V–controlled LED driver with dimming profile storage and thermal derating logic.

IC Role / Device Role / Timing Role: System manager interfacing with analog current/voltage feedback, executing PWM dimming algorithms, and logging thermal events.

Use Value: Six-channel TPM supports independent high-resolution PWM outputs; 2 KB EEPROM stores user-defined dimming curves and fault history.

Use Scenario: Closed-loop position monitoring for BLDC or stepper motor systems using Hall-effect or encoder signals.

IC Role / Device Role / Timing Role: Real-time capture of quadrature encoder edges or Hall transitions using TPM input capture channels.

Use Value: TPM1's 6-channel input capture with noise filtering and automatic timestamping enables sub-degree angular resolution without external logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08DN48F1MLC48 KB Flash, same package and peripheral set; higher code capacityPreferred where firmware complexity exceeds 32 KB or future-proofing is requiredSelect when additional Flash headroom is needed without changing PCB layout or toolchain
S9S08DN16F1MLC16 KB Flash, identical architecture and pinout; reduced memory footprintSuitable for cost-sensitive, function-limited implementations (e.g., single-sensor endpoints)Choose for minimal BOM cost where application fits within 16 KB and no EEPROM expansion is needed

Compared with S9S08DN32F1MLC, MC9S08DN48F1MLC offers 16 KB more Flash for complex control algorithms or bootloader space, while S9S08DN16F1MLC reduces unit cost and power in resource-constrained nodes-both share identical I/O mapping, clocking, and peripheral configuration registers.

Availability

S9S08DN32F1MLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and smart lighting control requiring stable component supply and long-term lifecycle support.

Supply support for S9S08DN32F1MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S08DN32F1MLC belongs to the HCS08 DN-series microcontrollers, designed specifically for cost-effective, low-power embedded control in automotive body electronics and industrial automation where LIN communication and analog integration are essential.

FAQ

What is the maximum operating frequency of the S9S08DN32F1MLC CPU core?

The S9S08DN32F1MLC CPU core operates at a maximum frequency of 40 MHz, with a corresponding bus clock of up to 20 MHz. This performance level is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode. The S9S08DN32F1MLC maintains full functionality-including Flash access, ADC conversion, and peripheral operation-at this speed across its specified voltage (2.7–5.5 V) and temperature (–40°C to +105°C) range.

Does the S9S08DN32F1MLC support LIN 2.0 communication natively?

Yes, the S9S08DN32F1MLC includes a dedicated SCI module that fully supports LIN 2.0 and SAE J2602 protocols. Its hardware features include master-mode extended break generation, slave-mode break detection, and wakeup-on-active-edge functionality-enabling direct integration into automotive LIN networks without external transceivers. The S9S08DN32F1MLC's SCI is configured via standard register sets and requires no external protocol stack hardware.

How much EEPROM does the S9S08DN32F1MLC provide, and what are its endurance characteristics?

The S9S08DN32F1MLC integrates 2 KB of on-chip EEPROM with guaranteed endurance of at least 100,000 erase/write cycles per sector. It supports 4-byte dual-page or 8-byte single-page erase operations and allows program/erase while executing Flash code. The S9S08DN32F1MLC also includes EEPROM security features such as block protection and write-enable control via dedicated status registers.

What power-saving modes are available on the S9S08DN32F1MLC?

The S9S08DN32F1MLC offers three primary low-power modes: Wait mode (reduced power with clocks active), Stop2 (very low power with most clocks halted), and Stop3 (lowest power with 1 kHz RTI running from internal oscillator). In Stop3 mode, the S9S08DN32F1MLC draws less than 1.5 µA and retains RAM contents, enabling fast wake-up for time-triggered sensor sampling or LIN message response.

Is the S9S08DN32F1MLC pin-compatible with other devices in the MC9S08DN family?

Yes, the S9S08DN32F1MLC is pin-compatible with MC9S08DN60F1MLC, MC9S08DN48F1MLC, and S9S08DN16F1MLC in the 48-pin LQFP package. All share identical pin assignments, electrical characteristics, and peripheral mappings-only Flash (32 KB), EEPROM (2 KB), and RAM (2 KB) sizes differ. This allows scalable design reuse across product tiers without PCB redesign.

S9S08DN32F1MLC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
25
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1.5K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08DN32F1MLC FAQ

1.How can I place an order for S9S08DN32F1MLC through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08DN32F1MLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08DN32F1MLC reliable?

The price and inventory of S9S08DN32F1MLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DN32F1MLC is usually 5 days.

3.What payment methods are accepted for S9S08DN32F1MLC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DN32F1MLC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08DN32F1MLC?

S9S08DN32F1MLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08DN32F1MLC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08DN32F1MLC?

For technical support, including S9S08DN32F1MLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DN32F1MLC requirements.

6.How does Aetrix verify that S9S08DN32F1MLC is sourced from the original manufacturer or authorized distributors?

All S9S08DN32F1MLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DN32F1MLC meets industry standards.

7.What is the process for return or replacement of S9S08DN32F1MLC?

All S9S08DN32F1MLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DN32F1MLC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08DN32F1MLC part is unused and in its original packaging.

Return procedure for S9S08DN32F1MLC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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