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NXP Semiconductors S9S08DN32F1MLH

Part No.:
S9S08DN32F1MLH
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
64-LQFP
Datasheet:
AetrixS9S08DN32F1MLH.pdf
Description:
IC MCU 8BIT 32KB FLASH 64LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,433

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Product details

Overview

S9S08DN32F1MLH from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip Flash, 2 KB RAM, and 2 KB EEPROM, operating at up to 40 MHz CPU / 20 MHz bus frequency. It integrates ADC12, dual analog comparators, SCI with LIN 2.0 support, SPI, I²C, two TPM modules, RTC, and real-time interrupt capability - deployed in automotive body control modules and industrial sensor nodes.

For engineers reviewing the S9S08DN32F1MLH datasheet, S9S08DN32F1MLH pinout, S9S08DN32F1MLH application, or S9S08DN32F1MLH equivalent, key selection criteria include Flash size (32 KB), 48-pin LQFP package, LIN-capable SCI interface, 12-bit ADC with temperature sensor, and dual low-power stop modes for battery-operated systems.

Technical Context

The S9S08DN32F1MLH implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with factory-trimmed internal reference and external crystal support (1–16 MHz).

On-chip peripherals include a 16-channel 12-bit ADC with 2.5 μs conversion time and automatic compare, two analog comparators with bandgap reference option, and SCI1 compliant with LIN 2.0 and SAE J2602 - enabling direct integration into automotive sub-networks without external protocol translators.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core, 40-MHz max CPU clock, 20-MHz bus clock - enables deterministic real-time control in resource-constrained systems
Memory32 KB Flash (in-circuit programmable/erase), 2 KB RAM, 2 KB EEPROM with 4-/8-byte erase sectors - supports field firmware updates and data logging
ADC16-channel, 12-bit resolution, 2.5 μs conversion time, internal temperature sensor and bandgap reference - suitable for precision analog monitoring
SCI InterfaceLIN 2.0 and SAE J2602 compliant, full-duplex NRZ, master break generation and slave break detection - eliminates need for external LIN transceivers in basic nodes
Power ModesTwo very low-power stop modes (Stop2/Stop3), reduced-power wait mode, and 1-kHz RTC wake-up - extends battery life in always-on sensor applications
Clock SourcesExternal crystal (1–16 MHz), internal trimmed reference (±1.5% FLL accuracy), MCG with PLL/FLL modes - simplifies BOM by reducing external timing components
I/O Pins47 general-purpose I/O pins (48-pin LQFP), 24 with configurable interrupt polarity, hysteresis and pull devices on all inputs - improves noise immunity in automotive harness environments

Pinout & Package

Package: 48-pin low-profile quad flat-pack (LQFP), 7×7 mm, 0.5 mm pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual 5.0 V supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) - enables clean ADC operation with separate noise isolation
XTAL, EXTALCrystal oscillator input/outputSupports 1–16 MHz crystals or ceramic resonators - used for high-accuracy system timing and LIN baud rate derivation
RESETActive-low reset inputAsynchronous reset with internal pull-up; accepts external reset supervisor signals - ensures reliable power-on and brownout recovery
BKGD/MSBackground debug and mode selectSingle-wire debug interface pin - allows in-circuit programming and real-time emulation without dedicated JTAG header
SCI1_TX, SCI1_RXLIN serial interfaceDirect connection to LIN bus via external transceiver (e.g., MC33661); supports auto-baud detection and wakeup-on-break - essential for body electronics slave nodes
ADC0–ADC15Analog input channelsMultiplexed inputs shared with GPIO; includes dedicated temperature sensor channel - enables thermal monitoring without external sensors
TPM1_CH0–TPM1_CH5PWM/capture timer outputs6-channel TPM1 supports edge-aligned PWM, input capture, and output compare - drives motors, LEDs, or measures pulse widths in HVAC actuators

Key Features

FeatureDesign Value
Single-wire background debugEnables full ICE functionality (breakpoints, memory access, register inspection) using only BKGD/MS pin - reduces debug footprint and PCB routing complexity
In-circuit programmable EEPROM2 KB EEPROM with 4-byte dual-page or 8-byte single-page erase - preserves calibration data across power cycles without Flash wear leveling overhead
Real-time counter with 1 kHz oscillatorFree-running RTC using on-chip low-power oscillator - provides cyclic wake-up intervals (e.g., every 100 ms) without external crystal or loading
Flash block protectionConfigurable write/erase protection per Flash block - prevents accidental overwrites of bootloader or safety-critical code segments
Low-voltage detect with interrupt/resetSelectable trip points (e.g., 4.2 V, 3.8 V) with interrupt or reset output - enables graceful shutdown or fault logging before brownout

Applications

Automotive Door ModuleIndustrial Temperature Sensor Node

Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies.

IC Role / Device Role / Timing Role: Primary MCU executing LIN slave protocol, managing motor drivers, reading switches/sensors, and coordinating with body control module.

Use Value: Integrated LIN 2.0 SCI, 12-bit ADC for potentiometer feedback, and 6-channel TPM for motor PWM reduce external component count by ≥3 ICs.

Use Scenario: Battery-powered wireless node measuring ambient and enclosure temperature in HVAC ducts or machinery enclosures.

IC Role / Device Role / Timing Role: System controller with autonomous sleep/wake cycling, local data processing, and UART-to-RF bridge interface.

Use Value: On-chip temperature sensor + 1-kHz RTC wake-up enables 10-second sampling intervals with <2 μA Stop3 current - achieving >5-year battery life on CR2032.

Smart Lighting DimmerAppliance Motor Control

Use Scenario: DALI- or 0–10 V-compatible LED driver with adaptive dimming profiles and thermal derating.

IC Role / Device Role / Timing Role: Embedded controller acquiring ambient light and thermal data, computing PWM duty cycle, and communicating via isolated UART.

Use Value: 12-bit ADC with internal bandgap reference ensures stable dimming curves across 0–70°C; dual comparators monitor overtemperature thresholds independently.

Use Scenario: Brushless DC motor commutation in cordless power tools with torque sensing and battery voltage monitoring.

IC Role / Device Role / Timing Role: Real-time motor controller interfacing with Hall sensors, driving gate drivers, and managing battery protection logic.

Use Value: 2.5 μs ADC conversion time captures fast current transients; 6-channel TPM1 supports six-step commutation with precise timing margins.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08DZ32F1MLHSame HCS08 core, 32 KB Flash, but adds CAN 2.0B controller and enhanced EMI performance - no LIN SCIPreferred where CAN bus integration is required (e.g., engine bay modules); unsuitable for LIN-only networksSelect MC9S08DZ32F1MLH only if CAN communication is mandatory and LIN is not needed.
S9KEAZ32AMLHKinetis E-series ARM Cortex-M0+, 32 KB Flash, 4 KB RAM, no LIN peripheral - includes USB, more timers, higher clock (48 MHz)Targets next-generation designs requiring software scalability, RTOS support, or mixed-signal integration beyond LINChoose S9KEAZ32AMLH when migrating from 8-bit to 32-bit architecture while retaining same package and pin count.

Compared with MC9S08DZ32F1MLH and S9KEAZ32AMLH, the S9S08DN32F1MLH delivers optimal cost/performance for LIN-based automotive body electronics where CAN bandwidth and ARM software ecosystem are unnecessary - preserving legacy toolchain compatibility and minimizing BOM changes.

Availability

S9S08DN32F1MLH is available at Aetrix Electronics and suitable for automotive body control units, industrial sensor nodes, smart lighting systems, and appliance motor controllers requiring stable component supply across extended product lifecycles.

Supply support for S9S08DN32F1MLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S08DN32F1MLH belongs to the HCS08 DN-series microcontrollers, designed specifically for cost-sensitive, low-power automotive body electronics and industrial control applications requiring LIN protocol compliance and robust analog integration.

FAQ

What is the maximum operating frequency of the S9S08DN32F1MLH CPU and bus?

The S9S08DN32F1MLH features an HCS08 CPU core rated for up to 40 MHz operation, with a corresponding maximum bus frequency of 20 MHz. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, and is validated across the full industrial temperature range (–40°C to +105°C) per the official datasheet specifications.

Does the S9S08DN32F1MLH support LIN 2.0 communication natively?

Yes, the S9S08DN32F1MLH includes SCI1 hardware that is fully compliant with LIN 2.0 and SAE J2602 protocols. It supports master extended break generation, slave extended break detection, wakeup-on-active-edge, and automatic baud rate detection - enabling direct connection to standard LIN transceivers without software bit-banging or external protocol accelerators.

What package type and pin count does the S9S08DN32F1MLH use?

The S9S08DN32F1MLH is supplied in a 48-pin low-profile quad flat-pack (LQFP) package, measuring 7×7 mm with 0.5 mm lead pitch. This package is explicitly listed in the MC9S08DN60 Series Data Sheet Rev 3 (June 2008) under "Package Options" and confirmed in Freescale's official ordering information appendix.

How much Flash, RAM, and EEPROM memory does the S9S08DN32F1MLH contain?

The S9S08DN32F1MLH contains 32 KB of on-chip Flash memory, 2 KB of RAM, and 2 KB of EEPROM. These values are explicitly stated in the "On-Chip Memory" section of the MC9S08DN60 Series Data Sheet, which covers the entire DN-family including S9S08DN32F1MLH as a derivative part number.

Can the S9S08DN32F1MLH operate in ultra-low-power modes for battery-powered applications?

Yes, the S9S08DN32F1MLH supports two very low-power stop modes (Stop2 and Stop3), a reduced-power wait mode, and a 1-kHz real-time interrupt source usable in run, wait, and stop states. In Stop3 mode, typical current consumption is below 2 μA - making it suitable for long-life battery applications such as wireless sensor nodes and remote controls.

S9S08DN32F1MLH Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
64-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
1.5K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08DN32F1MLH FAQ

1.How can I place an order for S9S08DN32F1MLH through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08DN32F1MLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08DN32F1MLH reliable?

The price and inventory of S9S08DN32F1MLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DN32F1MLH is usually 5 days.

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S9S08DN32F1MLH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08DN32F1MLH order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08DN32F1MLH?

For technical support, including S9S08DN32F1MLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DN32F1MLH requirements.

6.How does Aetrix verify that S9S08DN32F1MLH is sourced from the original manufacturer or authorized distributors?

All S9S08DN32F1MLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DN32F1MLH meets industry standards.

7.What is the process for return or replacement of S9S08DN32F1MLH?

All S9S08DN32F1MLH units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DN32F1MLH, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08DN32F1MLH part is unused and in its original packaging.

Return procedure for S9S08DN32F1MLH:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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