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NXP Semiconductors S9S08DV16F1MLC

Part No.:
S9S08DV16F1MLC
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixS9S08DV16F1MLC.pdf
Description:
IC MCU 8BIT 16KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,461

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Product details

Overview

S9S08DV16F1MLC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip flash, 2 KB RAM, 40-MHz CPU core (20-MHz bus), and integrated CAN 2.0A/B controller, ADC, and real-time counter - used in automotive body control modules requiring deterministic timing and fault-tolerant communication.

For engineers reviewing the S9S08DV16F1MLC datasheet, S9S08DV16F1MLC pinout, S9S08DV16F1MLC application, or S9S08DV16F1MLC equivalent, key selection criteria include CAN protocol compliance, flash memory size, stop-mode power consumption, internal clock trim capability, and single-wire background debug interface support.

Technical Context

The S9S08DV16F1MLC implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and operating at 40 MHz core/20 MHz bus frequency. Its Multi-Purpose Clock Generator (MCG) provides FLL and PLL modes with factory-trimmed internal reference clock and ±1.5% FLL accuracy using temperature compensation.

On-chip peripherals include a 12-bit, 16-channel ADC with 2.5 μs conversion time and internal temperature sensor; two analog comparators with bandgap reference option; MSCAN module supporting standard/extended frames and five receive buffers with FIFO; and dual SCI interfaces compliant with LIN 2.0 and SAE J2602 protocols.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureHCS08 8-bit CPU with BGND instruction and 32 interrupt/reset vectors
Flash Memory16 KB - sufficient for compact automotive firmware with bootloader and diagnostics
RAM Size2 KB - supports real-time task stacks, CAN message buffering, and ADC data logging
Max Bus Frequency20 MHz - defines peripheral timing budget and real-time response latency
CAN InterfaceMSCAN v1 supporting CAN 2.0A/B, five RX buffers with FIFO, and programmable ID filters
ADC Resolution12-bit with 16 channels and 2.5 μs conversion - enables high-precision sensor monitoring
Power ModesTwo very low-power stop modes, reduced-power wait mode, and RTC wake-up from stop

Pinout & Package

Package: 48-pin LQFP (7×7 mm), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual-supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation
XTAL, EXTALCrystal/resonator connectionSupports 31.25 kHz–38.4 kHz or 1–16 MHz crystals for precise clock source or MCG reference
BKGD/MSSingle-wire background debugEnables in-circuit debugging and programming without dedicated JTAG pins
CANL, CANHCAN bus differential pairDirect connection to ISO 11898-compliant transceiver; supports 1 Mbps operation
AD0–AD15Analog input channels16 multiplexed inputs shared with GPIO; includes internal temperature sensor channel
PTA0–PTA7, PTB0–PTB7, etc.General-purpose I/O ports53 GPIO + 1 input-only pin; configurable pull, slew rate, drive strength, and interrupt polarity

Key Features

FeatureDesign Value
Factory-trimmed internal reference clockTrim value stored in flash enables accurate FLL operation without external crystal during startup or fail-safe mode
Real-time counter (RTC)8-bit modulus counter with external clock input or internal 1-kHz oscillator - supports time-of-day, calendar, and cyclic wake-up without external components
Flash block protectionPrevents unauthorized read/write/erase of protected sectors - critical for secure bootloader and calibration data storage
Low-voltage detectionSelectable reset or interrupt trip points - ensures reliable operation across battery voltage fluctuations in automotive environments
Single-wire background debugReduces PCB footprint and BOM cost vs. multi-pin debug interfaces while enabling full ICE functionality

Applications

Automotive Body Control UnitIndustrial CAN Node Controller

Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in 12 V vehicle platforms.

IC Role / Device Role / Timing Role: Main MCU executing CAN message arbitration, PWM motor control, and ADC-based sensor polling at ≤10 ms cycle intervals.

Use Value: Integrated MSCAN and 20 MHz bus enable deterministic response to LIN/CAN gateway commands; 16 KB flash accommodates ASAM-compliant diagnostics stack.

Use Scenario: Distributed I/O node in factory automation systems communicating via CANopen over industrial cabling.

IC Role / Device Role / Timing Role: Peripheral controller managing discrete inputs/outputs and analog sensor acquisition synchronized to CAN network time base.

Use Value: Five CAN RX buffers with FIFO prevent message loss under burst traffic; RTC supports timestamping of process events with ±1 s/day accuracy.

Smart HVAC Actuator ModuleOff-Road Equipment Monitor

Use Scenario: Motor-driven damper and valve positioning in commercial HVAC systems with CAN-based building management integration.

IC Role / Device Role / Timing Role: Closed-loop position controller using ADC feedback and TPM-generated PWM, coordinated via CAN status reporting.

Use Value: 12-bit ADC resolution and 2.5 μs conversion allow sub-degree temperature sensing; internal bandgap reference ensures stable measurements across supply variation.

Use Scenario: Telematics and health monitoring unit in agricultural or construction machinery operating in wide-temperature (-40°C to 105°C) environments.

IC Role / Device Role / Timing Role: Fault-resilient system manager handling battery voltage supervision, CAN bus error logging, and watchdog-triggered safe state entry.

Use Value: Two very low-power stop modes reduce quiescent current to <1 μA; COP watchdog with backup 1-kHz clock maintains safety integrity during brown-out conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08DZ128CLC128 KB flash, 8 KB RAM, same HCS08 core and MSCAN peripheral but larger memory and enhanced ADC featuresTargeted at more complex body control modules requiring larger firmware image and extended diagnostic capabilitiesSelect when firmware growth exceeds 16 KB or additional RAM is needed for CAN message queuing and OTA update staging
S9KEAZ128AMLHKinetis E-series ARM Cortex-M0+ core, 128 KB flash, 16 KB RAM, CAN 2.0B, but no HCS08 software compatibilityDesigned for migration paths requiring higher performance, RTOS support, and future-proof architectureChoose for new designs prioritizing scalability and long-term roadmap alignment over legacy code reuse

Compared with MC9S08DZ128CLC and S9KEAZ128AMLH, the S9S08DV16F1MLC offers optimal balance of proven automotive qualification, minimal BOM cost, and sufficient resources for basic CAN node functions - making it ideal for cost-sensitive, volume production body electronics where code size and power efficiency are primary constraints.

Availability

S9S08DV16F1MLC is available at Aetrix Electronics and suitable for automotive body control units, industrial CAN nodes, smart HVAC actuators, and off-road equipment monitors requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S9S08DV16F1MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S08DV16F1MLC belongs to the HCS08 DV-series microcontrollers, designed specifically for cost-optimized, functionally safe automotive body electronics with integrated CAN, robust power management, and production-ready debug infrastructure.

FAQ

What is the maximum operating frequency of the S9S08DV16F1MLC CPU core?

The S9S08DV16F1MLC CPU core operates at up to 40 MHz, while its system bus runs at 20 MHz. This architecture allows efficient instruction execution while maintaining timing margins for peripheral access and deterministic interrupt response - essential for real-time automotive control tasks handled by the S9S08DV16F1MLC.

Does the S9S08DV16F1MLC support CAN FD or only classical CAN?

The S9S08DV16F1MLC supports only classical CAN 2.0A/B protocol via its MSCAN module and does not implement CAN FD features such as variable bit rates or extended data length. Its five receive buffers with FIFO and flexible identifier filtering are optimized for standard 11-/29-bit identifier messaging at up to 1 Mbps - consistent with the specification of the S9S08DV16F1MLC.

What package type and pin count does the S9S08DV16F1MLC use?

The S9S08DV16F1MLC is packaged in a 48-pin LQFP (7×7 mm) with exposed pad, rated for operation from −40°C to 105°C. This package matches the mechanical and thermal requirements of automotive under-hood and cabin applications and is explicitly listed in the MC9S08DV60 Series Data Sheet Rev 3 for the S9S08DV16F1MLC variant.

How much RAM is available on the S9S08DV16F1MLC?

The S9S08DV16F1MLC includes 2 KB of on-chip RAM, allocated for stack operations, peripheral register shadowing, CAN message buffering, and runtime variables. This RAM size is confirmed in the "On-Chip Memory" section of the official datasheet and is sufficient for deterministic real-time execution of automotive body control firmware running on the S9S08DV16F1MLC.

Is the S9S08DV16F1MLC qualified for automotive applications?

Yes, the S9S08DV16F1MLC is AEC-Q100 qualified for automotive use and specified for operation across −40°C to 105°C ambient temperature. It includes automotive-grade features such as low-voltage detection with interrupt/reset, COP watchdog with backup clock, flash block protection, and robust EMC performance - all validated per the S9S08DV16F1MLC product definition.

S9S08DV16F1MLC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
25
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08DV16F1MLC FAQ

1.How can I place an order for S9S08DV16F1MLC through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08DV16F1MLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08DV16F1MLC reliable?

The price and inventory of S9S08DV16F1MLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DV16F1MLC is usually 5 days.

3.What payment methods are accepted for S9S08DV16F1MLC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DV16F1MLC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08DV16F1MLC?

S9S08DV16F1MLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08DV16F1MLC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08DV16F1MLC?

For technical support, including S9S08DV16F1MLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DV16F1MLC requirements.

6.How does Aetrix verify that S9S08DV16F1MLC is sourced from the original manufacturer or authorized distributors?

All S9S08DV16F1MLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DV16F1MLC meets industry standards.

7.What is the process for return or replacement of S9S08DV16F1MLC?

All S9S08DV16F1MLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DV16F1MLC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08DV16F1MLC part is unused and in its original packaging.

Return procedure for S9S08DV16F1MLC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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