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NXP Semiconductors S9S08DV16F2MLC
- Part No.:
- S9S08DV16F2MLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S08DV16F2MLC.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,555
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Product details
Overview
S9S08DV16F2MLC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip flash, 2 KB RAM, and integrated CAN 2.0A/B controller, ADC, and real-time counter - designed for automotive body electronics and industrial control nodes requiring deterministic timing and robust communication.
For engineers reviewing the S9S08DV16F2MLC datasheet, S9S08DV16F2MLC pinout, S9S08DV16F2MLC application, or S9S08DV16F2MLC equivalent, key selection criteria include its 20 MHz bus frequency, 53 GPIO with configurable slew rate and pull devices, dual SCI supporting LIN 2.0/J2602, and stop-mode current as low as 1.5 µA.
Technical Context
The S9S08DV16F2MLC implements the HCS08 CPU core with 40 MHz instruction execution (20 MHz bus), HC08 instruction set plus BGND, and support for up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with internal reference trimming and external crystal/resonator options from 31.25 kHz to 16 MHz.
On-chip peripherals include a 12-bit, 16-channel ADC with 2.5 µs conversion time and temperature sensor; two analog comparators with bandgap reference option; one MSCAN module with five receive buffers and programmable identifier filters; and dual TPM modules (6-channel + 2-channel) supporting input capture, output compare, and edge-aligned PWM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40 MHz instruction rate, 20 MHz bus clock |
| Flash Memory | 16 KB program flash with block protection, read/program/erase over full voltage/temperature range |
| RAM | 2 KB on-chip SRAM for data and stack storage |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), supports standard/extended frames and remote frames |
| ADC | 12-bit resolution, 16-channel, 2.5 µs conversion time, internal temperature sensor and bandgap reference channel |
| Power Modes | Run, Wait, Stop2 (1.5 µA typical), Stop3 (0.5 µA typical); RTC wake-up from all modes using 1 kHz internal oscillator |
| I/O Pins | 53 general-purpose I/O pins with hysteresis, configurable pull devices, slew rate, and drive strength; 24 support pin-interrupt with edge polarity select |
Pinout & Package
Package: 48-pin LQFP (7×7 mm), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation in mixed-signal operation |
| XTAL, EXTAL | Crystal/resonator interface | Connects to 31.25 kHz–16 MHz crystal or ceramic resonator for precision clock source |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset signals or watchdog timeout assertion |
| BKGD/MS | Single-wire background debug | Enables on-chip debugging and flash programming via single-pin BDM interface |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with interrupt capability on each pin; supports alternate functions including SCI0, SPI, IIC, TPM, and ADC inputs |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port with interrupt capability; includes CAN_TX, CAN_RX, SCI1, TPM, and ADC channels |
| PTC0–PTC7 | Port C general-purpose I/O | 8-bit port with interrupt capability; supports MSCAN, TPM, RTC, and ADC functions |
| PTD0–PTD7 | Port D general-purpose I/O | 8-bit port with interrupt capability; includes SCI0, SPI, IIC, TPM, and ADC channels |
| PTE0–PTE7 | Port E general-purpose I/O | 8-bit port with interrupt capability; supports SCI1, TPM, and ADC functions |
| VREFH/VREFL | ADC reference voltage inputs | Accept external reference or connect to internal bandgap (1.2 V) for stable 12-bit conversions |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN 2.0A/B Controller | Five hardware receive buffers with FIFO, programmable acceptance filters (2×32-bit, 4×16-bit, or 8×8-bit), enabling robust automotive network node implementation without external CAN transceiver logic |
| Real-Time Counter (RTC) | 8-bit modulus counter with binary/decimal prescaler and free-running 1 kHz internal oscillator - supports cyclic wake-up from Stop modes without external components or crystal |
| Background Debug Interface (BDM) | Single-wire, on-chip debug interface supporting full-speed execution control, memory access, and flash programming - eliminates need for external emulator hardware |
| Low-Voltage Detection (LVD) | Configurable trip points with reset or interrupt output - ensures safe operation during brown-out conditions in automotive battery environments (5.5 V to 2.7 V) |
| Multi-Purpose Clock Generator (MCG) | Combines FLL, PLL, internal trimmed reference (±1.5% accuracy), and external crystal support - delivers flexible, low-jitter clocking across operating temperatures without external PLL ICs |
Applications
| Automotive Door Module | Industrial Motor Control Node |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main system controller executing CAN message handling, PWM motor drive, ADC-based position sensing, and LIN slave communication with body control module. Use Value: Integrated MSCAN and dual SCI enable seamless integration into vehicle networks; 16-channel ADC monitors potentiometer and thermistor feedback without external signal conditioning. | Use Scenario: Local intelligence for brushless DC motor drives in HVAC systems or conveyor subsystems. IC Role / Device Role / Timing Role: Real-time PWM generation (TPM), current/voltage sensing (ADC), fault detection (ACMP), and CAN-based command reception and status reporting. Use Value: 6-channel TPM supports three-phase commutation; dual analog comparators provide fast overcurrent shutdown (<1 µs response); CAN interface enables plug-and-play interoperability with PLC master controllers. |
| Smart Lighting Controller | Energy Meter Communication Hub |
Use Scenario: DALI or 0–10 V dimming controller for commercial LED fixtures with local sensor fusion and wireless gateway interface. IC Role / Device Role / Timing Role: Sensor hub aggregating ambient light, occupancy, and temperature data; manages DALI bus via SCI and communicates via UART-to-Sub-GHz RF bridge. Use Value: On-chip temperature sensor and 12-bit ADC eliminate external thermal monitoring ICs; low-power Stop modes extend battery life in wireless variants. | Use Scenario: Sub-metering node collecting pulse outputs from mechanical meters and relaying data via CAN or RS-485 to central concentrator. IC Role / Device Role / Timing Role: Pulse counting (input capture), time-stamped logging (RTC), secure data buffering (flash), and protocol translation between meter pulses and CAN frame payloads. Use Value: RTC maintains accurate time-of-day stamping during mains outage; flash block protection prevents firmware corruption during field updates; 53 GPIO accommodate diverse pulse input configurations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ128CLC | 128 KB flash, 8 KB RAM, same HCS08 core, enhanced CAN filtering, additional SCI and IIC modules | Supports larger firmware images and more complex protocol stacks (e.g., J1939 transport layer) | Select when future scalability, extended peripheral count, or higher memory headroom is required - not pin-compatible with S9S08DV16F2MLC |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+, 128 KB flash, 16 KB RAM, CAN FD capable, 48 MHz core | Enables migration to CAN FD, higher computational throughput, and modern toolchain support (CMSIS, HAL) | Select for new designs targeting long-term roadmap compatibility and performance uplift - requires PCB redesign and software re-architecture |
Compared with MC9S08DZ128CLC and S9KEAZ128AMLH, the S9S08DV16F2MLC offers optimal cost and footprint for legacy-compliant automotive and industrial nodes where 16 KB flash and basic CAN 2.0 meet functional requirements without over-engineering.
Availability
S9S08DV16F2MLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control nodes, smart lighting systems, and energy meter communication hubs requiring stable component supply and long-term lifecycle assurance.
Supply support for S9S08DV16F2MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08DV16F2MLC belongs to the HCS08 DV-series microcontrollers, engineered for cost-sensitive, safety-aware embedded control in harsh environments - emphasizing CAN reliability, low-power operation, and on-chip debug simplicity.
FAQ
What is the maximum bus frequency supported by the S9S08DV16F2MLC?
The S9S08DV16F2MLC supports a maximum bus frequency of 20 MHz. This is derived from its HCS08 CPU core running at up to 40 MHz with a 2:1 bus divider. The bus speed directly governs peripheral timing, including ADC conversion rates, SCI baud generation, and TPM counter increments. All electrical characteristics in the datasheet - such as I/O drive strength and setup/hold times - are validated at this 20 MHz bus frequency under specified voltage and temperature conditions.
Does the S9S08DV16F2MLC include an internal temperature sensor?
Yes, the S9S08DV16F2MLC integrates a calibrated on-die temperature sensor accessible through the 12-bit ADC module. It is implemented as a dedicated ADC channel (typically ADP9) with factory-trimmed offset and gain compensation stored in flash memory. The sensor operates across the full industrial temperature range (−40°C to +105°C) and delivers ±3°C accuracy without external components, enabling thermal monitoring in motor drivers, power supplies, and automotive ECUs without adding discrete sensors.
What debug interface does the S9S08DV16F2MLC support?
The S9S08DV16F2MLC supports a single-wire Background Debug Mode (BDM) interface via the BKGD/MS pin. This on-chip interface enables full-speed execution control, register and memory inspection, flash programming, and breakpoint setting without requiring external JTAG emulators. The BDM protocol is compatible with standard Freescale/NXP BDM tools such as the DEMO9S08DV16 evaluation board and P&E Micro's Cyclone programmers, ensuring low-cost development and field firmware updates.
Can the S9S08DV16F2MLC operate from a 3.3 V supply?
Yes, the S9S08DV16F2MLC is fully specified for operation from 2.7 V to 5.5 V, making it compatible with both 3.3 V and 5 V systems. Its internal voltage regulators and flash programming circuitry are designed to maintain functionality across this range. At 3.3 V, the maximum bus frequency remains 20 MHz, and all I/O pins are 5 V tolerant when configured as inputs - simplifying level-shifting in mixed-voltage designs common in automotive and industrial interfaces.
How many CAN message buffers does the MSCAN module in the S9S08DV16F2MLC provide?
The MSCAN module in the S9S08DV16F2MLC provides five dedicated receive buffers organized in FIFO order, plus one transmit buffer. These buffers support full CAN 2.0A/B compliance, including standard and extended identifiers, remote frames, and programmable acceptance filtering (configurable as 2×32-bit, 4×16-bit, or 8×8-bit masks). This architecture enables deterministic message handling in real-time automotive networks without host CPU polling overhead.
S9S08DV16F2MLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DV16F2MLC FAQ
1.How can I place an order for S9S08DV16F2MLC through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DV16F2MLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DV16F2MLC reliable?
The price and inventory of S9S08DV16F2MLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DV16F2MLC is usually 5 days.
3.What payment methods are accepted for S9S08DV16F2MLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DV16F2MLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08DV16F2MLC?
S9S08DV16F2MLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08DV16F2MLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08DV16F2MLC?
For technical support, including S9S08DV16F2MLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DV16F2MLC requirements.
6.How does Aetrix verify that S9S08DV16F2MLC is sourced from the original manufacturer or authorized distributors?
All S9S08DV16F2MLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DV16F2MLC meets industry standards.
7.What is the process for return or replacement of S9S08DV16F2MLC?
All S9S08DV16F2MLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DV16F2MLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DV16F2MLC part is unused and in its original packaging.
Return procedure for S9S08DV16F2MLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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