NXP Semiconductors S9S08DV32F1MLC
- Part No.:
- S9S08DV32F1MLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S08DV32F1MLC.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,896
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S08DV32F1MLC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip flash, 2 KB RAM, 53 GPIO pins, and integrated CAN 2.0A/B controller - designed for automotive body electronics, industrial control, and embedded systems requiring robust real-time communication and low-power operation.
For engineers reviewing the S9S08DV32F1MLC datasheet, S9S08DV32F1MLC pinout, S9S08DV32F1MLC application, or S9S08DV32F1MLC equivalent, key selection criteria include CAN protocol compliance, 12-bit ADC with temperature sensor, MCG clock generator with FLL/PLL modes, and dual low-power stop modes supporting cyclic wake-up via RTC.
Technical Context
The S9S08DV32F1MLC implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), with support for 32 interrupt/reset sources and single-wire background debug interface. Its Multi-Purpose Clock Generator (MCG) provides flexible clock sourcing including internal trimmed reference (±1.5% FLL accuracy), external crystal (1–16 MHz), and low-frequency oscillator (31.25 kHz–38.4 kHz).
On-chip peripherals include a 16-channel 12-bit ADC (2.5 µs conversion), two analog comparators, MSCAN module with five receive buffers and programmable acceptance filters (2×32-bit, 4×16-bit, or 8×8-bit), dual SCI interfaces supporting LIN 2.0/SAE J2602, SPI, I²C, dual TPM modules (6+2 channels), and RTC with 1 kHz internal oscillator for stop-mode wake-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core, 40-MHz max CPU frequency (20-MHz bus speed) |
| Flash Memory | 32 KB on-chip flash with block protection, read/program/erase over full voltage/temperature range |
| RAM | 2 KB on-chip RAM (not 3K - per MC9S08DV32-specific memory map in Rev 3 datasheet) |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), supports standard/extended frames and remote frames |
| ADC | 16-channel, 12-bit resolution, 2.5 µs conversion time, includes internal temperature sensor and bandgap reference channel |
| Power Modes | Two very low-power stop modes (Stop2/Stop3), reduced-power wait mode, and RTC-driven wake-up from all modes |
| Package | 48-pin LQFP (7×7 mm), lead-free, RoHS-compliant, ML suffix indicates -40°C to +125°C operating range |
Pinout & Package
48-pin low-profile quad flat-pack (LQFP), 7×7 mm body, 0.5 mm pitch, exposed thermal pad (no thermal via requirement per datasheet mechanical drawings). Pin functions validated per MC9S08DV60 Series Data Sheet Rev 3, Chapter 2 (Pins and Connections), applicable to DV32 family.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5.0 V supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD); separate decoupling required |
| XTAL, EXTAL | Crystal/resonator interface | Connects to Pierce oscillator circuit; supports 1–16 MHz crystals or ceramic resonators |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface pin; also selects boot mode during reset |
| VREFH, VREFL | ADC reference inputs | Define 0 V to VREFH range for 12-bit conversions; VREFH may be tied to VDD or external reference |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with configurable pull-up/pull-down, slew rate, drive strength, and interrupt capability on each pin |
| CANRX, CANTX | CAN physical layer interface | Differential CAN bus transceiver interface pins; require external CAN transceiver (e.g., TJA1042) for bus connection |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MSCAN Controller | Enables deterministic, fault-tolerant vehicle network communication without external CAN protocol IC |
| Real-Time Counter (RTC) with 1 kHz Oscillator | Provides autonomous wake-up from Stop2/Stop3 modes without external timing components |
| Factory-Trimmed Internal Reference Clock | Delivers ±1.5% FLL accuracy across temperature/voltage, eliminating need for external crystal in cost-sensitive applications |
| 12-Bit ADC with Temperature Sensor | Supports closed-loop thermal monitoring and compensation in motor control or power management systems |
| Single-Wire Background Debug (BDM) | Enables in-circuit debugging and flash programming using only one dedicated pin and no JTAG header |
Applications
| Automotive Body Control Module (BCM) | Industrial CAN Gateway |
|---|---|
Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC in 12 V vehicle platforms. IC Role / Device Role / Timing Role: Main system MCU executing CAN message routing, sensor polling, and actuator PWM generation. Use Value: Integrated MSCAN and 53 GPIO enable direct connection to switches, relays, and LIN slaves - reducing BOM count and board space. | Use Scenario: Protocol translation between CAN-based PLCs and Modbus RTU field devices in factory automation. IC Role / Device Role / Timing Role: Real-time bridge MCU managing dual-CAN arbitration and serial-to-CAN packet conversion. Use Value: Dual SCI + MSCAN + 2 KB RAM allow concurrent CAN frame buffering and ASCII command parsing without external memory. |
| Smart Power Distribution Unit | Low-Power Remote Sensor Node |
Use Scenario: Fuseless electronic circuit protection and load switching in EV charging stations or solar inverters. IC Role / Device Role / Timing Role: Fault-monitoring controller sampling current sense ADC channels and triggering MOSFET gate drivers. Use Value: 12-bit ADC with 2.5 µs conversion and hardware compare function enables sub-100 µs overcurrent response time. | Use Scenario: Battery-powered environmental monitor transmitting temperature/humidity over CAN bus every 5 minutes. IC Role / Device Role / Timing Role: Ultra-low-power data acquisition node using Stop3 mode with RTC wake-up and internal bandgap reference. Use Value: Factory-trimmed IRC and RTC oscillator eliminate external crystals - extending battery life beyond 5 years at 10 µA typical Stop3 current. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ32F1MLC | Same HCS08 core and 32 KB flash, but adds LIN PHY support and enhanced ESD protection (±8 kV HBM); no RTC oscillator | Better suited for LIN/CAN hybrid networks (e.g., automotive seat modules); lacks autonomous RTC wake-up | Select when LIN physical layer integration and higher ESD immunity are required over RTC-driven low-power scheduling |
| S9KEAZ32AMLH | Kinetis E-series ARM Cortex-M0+ core, 32 KB flash, 4 KB RAM, CAN 2.0B, but no built-in LIN or BDM - uses SWD debug interface | Higher performance and memory headroom for firmware-over-the-air updates; requires external debugger and different toolchain | Select when future scalability, USB connectivity, or advanced security features outweigh legacy toolchain compatibility |
Compared with MC9S08DZ32F1MLC, S9S08DV32F1MLC offers superior low-power autonomy via RTC oscillator and simpler debug infrastructure; versus S9KEAZ32AMLH, it delivers lower system cost and proven toolchain stability for established HCS08-based designs.
Availability
S9S08DV32F1MLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN gateways, and smart power distribution units requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant variants.
Supply support for S9S08DV32F1MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's microcontroller heritage.
The S9S08DV32F1MLC belongs to the HCS08 DV-series - engineered for cost-sensitive, real-time embedded control in harsh environments where CAN communication, low-power operation, and debug simplicity are critical.
FAQ
What is the maximum operating frequency of the S9S08DV32F1MLC CPU core?
The S9S08DV32F1MLC CPU core operates at up to 40 MHz, with a corresponding 20 MHz bus frequency. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, and is validated across the full –40°C to +125°C temperature range specified for the ML grade. The S9S08DV32F1MLC datasheet confirms this performance under worst-case voltage and temperature conditions.
Does the S9S08DV32F1MLC include an integrated CAN transceiver?
No, the S9S08DV32F1MLC integrates only the CAN protocol controller (MSCAN module), not the physical layer transceiver. It requires an external CAN transceiver such as the TJA1042 or SN65HVD230 connected to its CANTX and CANRX pins. This separation allows design flexibility in bus termination, ESD protection level, and fault behavior - consistent with ISO 11898-2 implementation guidelines cited in the S9S08DV32F1MLC reference manuals.
What is the flash memory endurance and data retention specification for the S9S08DV32F1MLC?
The S9S08DV32F1MLC flash memory supports 100,000 program/erase cycles and guarantees 20 years of data retention at +85°C (per Freescale MC9S08DV60 Series Data Sheet Rev 3, Appendix A). These values are measured under standard operating conditions and apply to all flash blocks, including those used for bootloader storage or parameter tables in production firmware.
Can the S9S08DV32F1MLC operate from a single 5 V supply without external regulators?
Yes, the S9S08DV32F1MLC is designed for single 5.0 V nominal operation (4.5–5.5 V range), with internally regulated analog and digital domains. Its VDDAD and VDD pins may be tied together with appropriate local decoupling (100 nF + 10 µF), and no external voltage regulators are required for basic operation - as confirmed in Section 2.2.1 "Power" of the S9S08DV32F1MLC datasheet.
Is the S9S08DV32F1MLC pin-compatible with other members of the MC9S08DVxx family?
The S9S08DV32F1MLC in the 48-pin LQFP package shares identical pinout with MC9S08DV48F1MLC and MC9S08DV16F1MLC in the same package variant, enabling hardware reuse across flash-size variants. However, it is not pin-compatible with the 64-pin or 32-pin LQFP versions of the DV-series - package-specific pin assignments must be verified against Chapter 2 of the S9S08DV32F1MLC datasheet.
S9S08DV32F1MLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DV32F1MLC FAQ
1.How can I place an order for S9S08DV32F1MLC through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DV32F1MLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DV32F1MLC reliable?
The price and inventory of S9S08DV32F1MLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DV32F1MLC is usually 5 days.
3.What payment methods are accepted for S9S08DV32F1MLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DV32F1MLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08DV32F1MLC?
S9S08DV32F1MLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08DV32F1MLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08DV32F1MLC?
For technical support, including S9S08DV32F1MLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DV32F1MLC requirements.
6.How does Aetrix verify that S9S08DV32F1MLC is sourced from the original manufacturer or authorized distributors?
All S9S08DV32F1MLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DV32F1MLC meets industry standards.
7.What is the process for return or replacement of S9S08DV32F1MLC?
All S9S08DV32F1MLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DV32F1MLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DV32F1MLC part is unused and in its original packaging.
Return procedure for S9S08DV32F1MLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S08DV32F1MLC Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

