NXP Semiconductors S9S08DV32F2MLC
- Part No.:
- S9S08DV32F2MLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S08DV32F2MLC.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,397
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Product details
Overview
S9S08DV32F2MLC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip flash, 2 KB RAM, and integrated CAN 2.0A/B controller, ADC, and real-time counter - deployed in automotive body control modules requiring deterministic timing and robust communication.
For engineers reviewing the S9S08DV32F2MLC datasheet, S9S08DV32F2MLC pinout, S9S08DV32F2MLC application, or S9S08DV32F2MLC equivalent, key selection criteria include CAN protocol compliance, 12-bit ADC conversion time (2.5 μs), MCG clock generator flexibility (FLL/PLL modes), and dual low-power stop modes for battery-sensitive systems.
Technical Context
The S9S08DV32F2MLC implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), supporting 32 interrupt/reset sources and BGND debug instruction. Its Multi-Purpose Clock Generator (MCG) provides FLL with ±1.5% deviation using internal temperature compensation and factory-trimmed internal reference clock.
On-chip peripherals include a 16-channel 12-bit ADC with temperature sensor and bandgap reference, two analog comparators, MSCAN module with five receive buffers and programmable identifier filters (2×32-bit, 4×16-bit, or 8×8-bit), and dual SCIs supporting LIN 2.0 and SAE J2602 protocols.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz operation (20-MHz bus) |
| Flash Memory | 32 KB, read/program/erase over full voltage/temperature range |
| RAM | 2 KB on-chip SRAM |
| ADC | 16-channel, 12-bit resolution, 2.5 μs conversion time, internal temperature sensor |
| CAN Interface | MSCAN v1.0, CAN 2.0A/B compliant, 5 receive buffers, flexible ID filtering |
| Power Modes | Two very low-power stop modes (Stop2/Stop3), reduced-power wait mode, 1-kHz RTC wake-up |
| Package | 48-pin LQFP (7×7 mm), lead-free, RoHS-compliant |
Pinout & Package
48-pin low-profile quad flat-pack (LQFP), 7×7 mm body, 0.5 mm pitch, exposed pad for thermal management. Pinout validated per MC9S08DV60 Series Data Sheet Rev 3, Section 2.1 (Device Pin Assignment).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5.0 V supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation |
| XTAL, EXTAL | Crystal oscillator inputs | Supports 1–16 MHz crystal or ceramic resonator; enables precise system timing and CAN bit-rate accuracy |
| BKGD/MS | Single-wire background debug | Enables in-circuit debugging and programming without dedicated JTAG pins |
| CANH, CANL | CAN bus differential pair | Direct interface to ISO 11898-2 physical layer; requires external transceiver for bus termination and fault protection |
| AD0–AD15 | Analog input channels | 16 multiplexed ADC inputs; includes dedicated temperature sensor channel and internal bandgap reference |
| PTA0–PTA7, PTB0–PTB7, PTC0–PTC7, PTD0–PTD7, PTE0–PTE7, PTF0–PTF7, PTG0–PTG7 | GPIO ports | 53 general-purpose I/O pins with configurable pull, slew rate, drive strength, and edge-triggered interrupts |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MSCAN module | Full CAN 2.0A/B support with hardware ID filtering and FIFO-based receive buffering - reduces CPU overhead in automotive network nodes |
| Factory-trimmed internal reference clock | Trim value stored in flash; enables stable 1–16 MHz bus clock generation without external crystal during development or cost-sensitive designs |
| Real-time counter (RTC) | 8-bit modulus counter with 1-kHz internal oscillator - supports cyclic wake-up from Stop3 mode without external components |
| Low-voltage detection (LVD) | Selectable reset or interrupt trip points - protects firmware integrity during brown-out conditions in 12 V automotive systems |
| Flash block protection | Hardware-enforced write/erase lock per flash sector - prevents accidental corruption of bootloader or calibration data |
Applications
| Body Control Module | Door Module |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing CAN message handling, GPIO state management, and ADC-based sensor monitoring (e.g., door position, ambient light). Use Value: Integrated MSCAN and 12-bit ADC eliminate need for discrete CAN transceivers and external ADCs, reducing BOM count and PCB area. | Use Scenario: Local control unit inside vehicle door managing window lift motor, anti-pinch detection, and keyless entry RF interface. IC Role / Device Role / Timing Role: Real-time motor control via TPM PWM outputs and safety-critical analog sensing via ADC with temperature compensation. Use Value: Dual stop modes and 1-kHz RTC enable ultra-low-power sleep while maintaining responsiveness to door handle touch or RF wakeup events. |
| Roof Module | Seat Control Unit |
Use Scenario: Sunroof and panoramic roof actuation with obstacle detection and position feedback. IC Role / Device Role / Timing Role: Sensor fusion hub combining ADC readings (potentiometer, current sense) and CAN command parsing for closed-loop position control. Use Value: 16-channel ADC with automatic compare function allows simultaneous monitoring of multiple analog sensors without CPU polling overhead. | Use Scenario: Motorized seat adjustment with memory presets, heating, and lumbar support. IC Role / Device Role / Timing Role: Safety-aware controller managing H-bridge drivers, thermistor-based temperature monitoring, and CAN diagnostics reporting. Use Value: Flash block protection and illegal opcode detection ensure firmware reliability under EMI-prone cabin environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DV48F2MLC | 48 KB flash, same package and peripheral set; higher code density margin for complex CAN stack or diagnostic services | Preferred where future firmware expansion or ASAM-compliant diagnostics require additional flash space | Select when >32 KB flash is needed without changing PCB layout or driver software |
| S9S08SG48F1MLC | Same HCS08 core but no CAN; adds SPI/I²C/SCI only; 48 KB flash, 4 KB RAM, 44-pin LQFP | Suitable for non-CAN sub-systems like HVAC actuators or lighting controllers where CAN is unnecessary | Choose for cost-optimized, CAN-free nodes needing higher RAM or smaller footprint |
Compared with MC9S08DV48F2MLC and S9S08SG48F1MLC, the S9S08DV32F2MLC delivers optimal balance of CAN capability, flash size, and pin-compatible scalability within the DV-series - enabling reuse of board layout and CAN driver libraries across trim levels.
Availability
S9S08DV32F2MLC is available at Aetrix Electronics and suitable for automotive body electronics, door modules, and roof control units requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualification traceability.
Supply support for S9S08DV32F2MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with heritage in Freescale's microcontroller portfolio.
The S9S08DV32F2MLC belongs to the HCS08 DV-series, designed specifically for cost-sensitive, CAN-enabled automotive body control applications requiring high reliability, low power, and functional safety readiness.
FAQ
What is the maximum operating frequency of the S9S08DV32F2MLC CPU core?
The S9S08DV32F2MLC CPU core operates at up to 40 MHz, with a corresponding 20 MHz bus clock frequency. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, and is fully supported across the device's rated voltage (4.5–5.5 V) and temperature (–40°C to +125°C) ranges as specified in the MC9S08DV60 Series Data Sheet Rev 3.
Does the S9S08DV32F2MLC support CAN FD or only classical CAN?
The S9S08DV32F2MLC supports only classical CAN protocol versions 2.0A and 2.0B, as implemented in its MSCAN module. It does not support CAN FD features such as increased data rates or extended payload length. The S9S08DV32F2MLC MSCAN module complies with ISO 11898-1 and supports standard and extended identifiers, remote frames, and programmable acceptance filtering.
What is the ADC resolution and conversion time for the S9S08DV32F2MLC?
The S9S08DV32F2MLC integrates a 12-bit successive-approximation ADC with 16 input channels, achieving a typical conversion time of 2.5 μs. It includes an internal temperature sensor and bandgap reference channel, and supports automatic compare functions to reduce CPU intervention during threshold monitoring tasks.
Is the S9S08DV32F2MLC pin-compatible with other devices in the DV-series?
Yes - the S9S08DV32F2MLC in the 48-pin LQFP package shares identical pinout with MC9S08DV48F2MLC and MC9S08DV16F2MLC. This enables direct hardware scalability across flash variants without PCB redesign, provided the same package option (F2MLC = 48-pin LQFP) is selected for all variants.
What debug interface does the S9S08DV32F2MLC use, and what tools support it?
The S9S08DV32F2MLC uses a single-wire background debug (BKGD) interface compliant with the HCS08 architecture. It is supported by NXP's S08 Cyclone Pro, USB-ML-PP, and compatible third-party debug probes. No external JTAG header is required, and the interface operates through the BKGD/MS pin, enabling in-circuit programming and real-time emulation without disrupting system signals.
S9S08DV32F2MLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DV32F2MLC FAQ
1.How can I place an order for S9S08DV32F2MLC through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DV32F2MLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DV32F2MLC reliable?
The price and inventory of S9S08DV32F2MLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DV32F2MLC is usually 5 days.
3.What payment methods are accepted for S9S08DV32F2MLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DV32F2MLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08DV32F2MLC?
S9S08DV32F2MLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08DV32F2MLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08DV32F2MLC?
For technical support, including S9S08DV32F2MLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DV32F2MLC requirements.
6.How does Aetrix verify that S9S08DV32F2MLC is sourced from the original manufacturer or authorized distributors?
All S9S08DV32F2MLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DV32F2MLC meets industry standards.
7.What is the process for return or replacement of S9S08DV32F2MLC?
All S9S08DV32F2MLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DV32F2MLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DV32F2MLC part is unused and in its original packaging.
Return procedure for S9S08DV32F2MLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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