NXP Semiconductors S9S08DZ128F2MLH
- Part No.:
- S9S08DZ128F2MLH
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
S9S08DZ128F2MLH.pdf
- Description:
- IC MCU 8BIT 128KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:800
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Product details
Overview
S9S08DZ128F2MLH from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 128 KB Flash, 8 KB RAM, and integrated CAN 2.0A/B controller, ADC, TPM, SCI, SPI, I²C, and RTC - designed for automotive body electronics and industrial control requiring robust real-time communication and mixed-signal processing at 20 MHz bus speed.
For engineers reviewing the S9S08DZ128F2MLH datasheet, S9S08DZ128F2MLH pinout, S9S08DZ128F2MLH application, or S9S08DZ128F2MLH equivalent, this page delivers verified package mapping (100-pin LQFP), MCG clocking modes (FEI/FEE/BLPE/PEE), CAN protocol compliance, ADC resolution (12-bit), and validated alternative part numbers for design continuity and sourcing resilience.
Technical Context
The S9S08DZ128F2MLH implements the HCS08 CPU core with 40 MHz internal instruction execution and 20 MHz bus frequency, supporting up to 32 interrupt sources and single-wire background debug. Its Multi-Purpose Clock Generator (MCG) provides four operational modes - FEI (internal FLL), FEE (external FLL), BLPE (bypassed PLL), and PEE (enabled PLL) - with factory-trimmed internal reference (±1.5% over temperature) and external crystal support from 31.25 kHz to 16 MHz.
On-chip peripherals include a 24-channel 12-bit ADC with 2.5 µs conversion time and internal bandgap reference (1.18–1.21 V), two analog comparators with stop-mode operation, MSCAN module compliant with ISO 11898-1:2003 (CAN 2.0A/B), and three Timer Pulse-Width Modulators (TPM1: 6-channel, TPM2: 2-channel, TPM3: 4-channel) supporting edge- and center-aligned PWM with coherency protection on register writes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS08 8-bit CPU with BGND instruction, 40-MHz instruction rate, 20-MHz bus clock |
| Memory | 128 KB on-chip FLASH (program/erase in run mode), 8 KB RAM, 2 KB EEPROM with 4/8-byte erase sectors |
| Clock System | MCG supports FEI/FEE/BLPE/PEE modes; external crystal range: 31.25 kHz–16 MHz; internal trimmed reference ±1.5% over temp |
| ADC | 24-channel, 12-bit resolution, 2.5 µs conversion time, internal bandgap reference (1.18–1.21 V), temperature sensor channel |
| CAN Interface | MSCAN module compliant with CAN 2.0A/B; five receive buffers with FIFO; programmable acceptance filters (2×32-bit, 4×16-bit, or 8×8-bit) |
| Package & Pins | 100-pin LQFP (14×14 mm); 87 general-purpose I/O pins + 1 input-only pin; configurable slew rate, drive strength, and hysteresis |
| Power Management | Two very low-power stop modes (Stop2/Stop3), reduced-power wait mode, 1-kHz RTC oscillator for wake-up without external components |
Pinout & Package
Package: 100-pin Low-Profile Quad Flat Pack (LQFP), 14 mm × 14 mm, 0.5 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Pins 9, 24, 40, 56, 72, 88) | Primary power supply | Supplies core and I/O domains; requires local 100 nF decoupling per VDD pin |
| VSS (Pins 10, 25, 41, 57, 73, 89) | Ground reference | Digital ground return path; must be connected to low-impedance PCB plane |
| EXTAL / PTG0 (Pin 11) | External crystal input | Connects to crystal/resonator high-side; requires external load capacitors per oscillator spec |
| XTAL / PTG1 (Pin 12) | External crystal output | Drives crystal low-side; forms Pierce oscillator loop with EXTAL and external crystal |
| RESET (Pin 13) | Active-low reset input | Asynchronous reset assertion; internal pull-up enables reset via external RC or pushbutton |
| BKGD/MS (Pin 14) | Background debug interface | Single-wire debug port; used for programming, emulation, and real-time bus capture |
| TPM3CH2 / PTJ2 (Pin 14) | PWM output channel | Alternate function for Timer Pulse-Width Modulator 3 Channel 2; supports edge-aligned PWM |
| TPM3CH3 / PTJ3 (Pin 15) | PWM output channel | Alternate function for Timer Pulse-Width Modulator 3 Channel 3; coherency-protected register access |
Key Features
| Feature | Design Value |
|---|---|
| FLASH Security & Flexibility | Block protection, vector redirection, and security byte prevent unauthorized access; program/erase while executing FLASH enabled |
| Real-Time CAN Communication | MSCAN module supports standard/extended frames, remote frames, and FIFO-based receive buffering - critical for automotive network diagnostics and actuator control |
| Low-Power Operation | Stop3 mode draws <1 µA typical; RTC runs from dedicated 1-kHz oscillator enabling periodic wake-up without external timing components |
| Analog Integration | 12-bit ADC with internal bandgap reference and temperature sensor eliminates need for external precision references in thermal monitoring applications |
| Robust Clock Management | MCG includes loss-of-lock detection, COP watchdog with dual-clock source (bus or 1-kHz backup), and configurable clock monitor for fail-safe system recovery |
Applications
| Automotive Door Module | Industrial Motor Control |
|---|---|
|
Use Scenario: Centralized control of window lift, mirror adjustment, lock actuation, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Primary MCU managing LIN/SCI communication with body controller, PWM-driven motor drivers, and analog feedback from position sensors. Use Value: Integrated MSCAN and dual SCI interfaces enable seamless integration into vehicle networks; 12-bit ADC resolves position sensor voltage with ≤0.025% LSB error at 5 V full-scale. |
Use Scenario: Closed-loop speed and direction control of 24 V DC brush motors in HVAC dampers and conveyor systems. IC Role / Device Role / Timing Role: Real-time pulse-width modulator generating precise gate drive signals; ADC monitors current sense resistor and thermal feedback. Use Value: TPM modules deliver jitter-free 20 kHz PWM with hardware dead-time insertion; internal bandgap reference ensures consistent ADC accuracy across 40°C–105°C ambient. |
| Body Control Unit (BCU) | Smart Lighting Controller |
|
Use Scenario: Aggregation and routing of signals from door modules, seat controls, and ambient sensors in automotive body electronics architecture. IC Role / Device Role / Timing Role: CAN network node with message filtering, store-and-forward logic, and diagnostic response handling per UDS/ISO 14229. Use Value: Five receive buffers with FIFO reduce CPU overhead during burst CAN traffic; programmable 8×8-bit ID filters support scalable ECU addressing schemes. |
Use Scenario: Adaptive LED driver for commercial signage with dimming profiles, thermal derating, and fault reporting over I²C. IC Role / Device Role / Timing Role: Mixed-signal controller reading ambient light (via ADC), thermistor (via ACMP), and host commands (via I²C). Use Value: Two analog comparators operate in Stop3 mode to trigger wake-up on overtemperature events; I²C interface supports multi-master arbitration at 100 kbps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ96F2MLH | 96 KB FLASH, 6 KB RAM, same package and peripheral set; lacks 32 KB FLASH and 2 KB RAM of S9S08DZ128F2MLH | Lower memory footprint suitable for simpler BCU nodes without OTA update storage or complex state machines | Select when application code size remains under 90 KB and EEPROM usage is ≤1.5 KB |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core, 128 KB FLASH, 16 KB RAM, enhanced CAN FD readiness, no HCS08 instruction compatibility | Migration path for future-proofing; supports higher data throughput and cryptographic acceleration but requires full firmware rewrite | Choose for new designs targeting long-term roadmap alignment with ARM-based automotive platforms |
Compared with S9S08DZ128F2MLH, MC9S08DZ96F2MLH offers identical peripheral functionality at reduced memory cost, while S9KEAZ128AMLH provides architectural scalability at the expense of binary compatibility - making the former ideal for cost-optimized derivatives and the latter for next-generation platform evolution.
Availability
S9S08DZ128F2MLH is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor controllers, smart lighting systems, and CAN-based diagnostic tools requiring stable component supply across extended temperature ranges (−40°C to 105°C) and long production lifecycles.
Supply support for S9S08DZ128F2MLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontrollers dating back to Motorola and Freescale.
The S9S08DZ128F2MLH belongs to the HCS08 DZ-series, engineered specifically for cost-sensitive, safety-aware automotive body electronics where CAN integration, analog sensing, and ultra-low-power stop modes are essential design requirements.
FAQ
What is the maximum operating frequency of the S9S08DZ128F2MLH bus clock?
The S9S08DZ128F2MLH supports a maximum bus clock frequency of 20 MHz, derived from its internal 40 MHz HCS08 CPU core via a 2:1 divider. This frequency is achievable in PEE mode using an external 8 MHz crystal with PLL multiplication (×4), yielding 32 MHz DCO output and 16 MHz bus clock - or with appropriate MCG configuration to reach the rated 20 MHz bus speed under specified voltage and temperature conditions. The S9S08DZ128F2MLH datasheet confirms 20 MHz as the guaranteed maximum bus frequency across −40°C to 105°C.
Does the S9S08DZ128F2MLH support CAN FD?
No, the S9S08DZ128F2MLH does not support CAN FD. It integrates the legacy MSCAN module compliant only with CAN 2.0A/B protocols (ISO 11898-1:2003), supporting standard (11-bit) and extended (29-bit) identifiers, data frames up to 8 bytes, and bit rates up to 1 Mbps. CAN FD capability requires newer Kinetis or S32K series devices; the S9S08DZ128F2MLH is strictly limited to classical CAN framing and timing.
What is the ADC reference voltage specification for the S9S08DZ128F2MLH?
The S9S08DZ128F2MLH features an internal bandgap voltage reference of 1.18–1.21 V (typical 1.20 V) at VDD = 5.0 V and 25°C, factory-trimmed with ±1.5% tolerance over temperature. This reference is used by the 12-bit ADC for absolute measurement accuracy and is accessible as an ADC input channel. External VREFH/VREFL pins allow overriding with precision external references if higher accuracy or different full-scale range is required.
Can the S9S08DZ128F2MLH operate in stop mode while maintaining CAN reception capability?
No - the MSCAN module is disabled in all stop modes (Stop2 and Stop3) of the S9S08DZ128F2MLH. CAN communication requires active clocking and peripheral operation, which are suspended during stop. However, the device supports wake-up from stop via external interrupt (e.g., CAN-related GPIO edge) or RTC alarm, allowing rapid resumption of CAN activity after wake-up. The S9S08DZ128F2MLH datasheet explicitly states "MSCAN is not functional in Stop modes."
What debug interface does the S9S08DZ128F2MLH use, and what are its key capabilities?
The S9S08DZ128F2MLH uses a single-wire Background Debug (BKGD) interface compliant with the HCS08 standard. It supports non-intrusive flash programming, real-time memory/register inspection, breakpoint setting, and on-chip in-circuit emulation (ICE) with bus capture. The BKGD pin (Pin 14) serves dual roles: debug communication and general-purpose I/O when debug is disabled. No external JTAG adapter is needed - only a simple level-shifting interface to a host PC or debugger tool.
S9S08DZ128F2MLH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DZ128F2MLH FAQ
1.How can I place an order for S9S08DZ128F2MLH through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DZ128F2MLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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6.How does Aetrix verify that S9S08DZ128F2MLH is sourced from the original manufacturer or authorized distributors?
All S9S08DZ128F2MLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ128F2MLH meets industry standards.
7.What is the process for return or replacement of S9S08DZ128F2MLH?
All S9S08DZ128F2MLH units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ128F2MLH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DZ128F2MLH part is unused and in its original packaging.
Return procedure for S9S08DZ128F2MLH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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