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NXP Semiconductors S9S08DZ128F2MLL

Part No.:
S9S08DZ128F2MLL
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixS9S08DZ128F2MLL.pdf
Description:
IC MCU 8BIT 128KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,208

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Product details

Overview

S9S08DZ128F2MLL from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 128 KB Flash, 8 KB RAM, and integrated CAN 2.0A/B controller, ADC, TPM, SCI, SPI, I²C, and RTC - designed for automotive body electronics and industrial control applications requiring robust real-time communication and mixed-signal processing.

For engineers reviewing the S9S08DZ128F2MLL datasheet, S9S08DZ128F2MLL pinout, S9S08DZ128F2MLL application, or S9S08DZ128F2MLL equivalent, this page delivers verified package mapping (100-pin LQFP), clock architecture details (MCG with FLL/PLL), CAN timing specs, ADC resolution and conversion time, and two validated alternative MCUs with documented functional and pinout differences.

Technical Context

The S9S08DZ128F2MLL implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), with on-chip MCG supporting FEI/FEE/FBE/PEE/BLPE modes using external crystals (31.25 kHz–16 MHz) or square-wave inputs. Its PLL achieves 32 MHz DCO output via 1 MHz reference ×32 multiplication.

It integrates a 24-channel, 12-bit ADC with 2.5 μs conversion time, internal bandgap reference (1.18–1.21 V), two analog comparators, and a full-featured MSCAN module compliant with ISO 11898-1, supporting five receive buffers, programmable acceptance filters (2×32-bit, 4×16-bit, or 8×8-bit), and remote frame handling.

Key Specifications

Parameter Value and Actual Design Meaning
Core HCS08 8-bit CPU, 40 MHz max core / 20 MHz bus frequency - enables deterministic real-time control in resource-constrained systems.
Memory 128 KB Flash (in-circuit programmable), 8 KB RAM, 2 KB EEPROM - supports firmware updates, data logging, and parameter storage without external memory.
ADC 24-channel, 12-bit SAR ADC with 2.5 μs conversion time and internal temperature sensor - suitable for precision sensor interfacing in automotive cabin modules.
CAN Interface MSCAN module compliant with CAN 2.0A/B, 5 receive buffers, FIFO storage, and flexible identifier filtering - meets automotive network node requirements for LIN/CAN gateway functions.
Operating Voltage 2.7–5.5 V supply range - compatible with 3.3 V and 5 V automotive subsystems and industrial power rails.
Temperature Range −40 °C to +105 °C - qualified for under-hood and chassis-mounted automotive applications per AEC-Q100 Grade 2.
Package 100-pin LQFP (14 × 14 mm, 0.5 mm pitch) - provides high I/O count (up to 87 GPIO) with standard surface-mount manufacturability.

Pinout & Package

Package: 100-pin Low-Profile Quad Flat Pack (LQFP), 14 mm × 14 mm, 0.5 mm pitch, exposed thermal pad (MLL suffix). Pin assignments conform to Table 2-1 (Rev. 1, p.34) of the MC9S08DZ128 datasheet, with dedicated VDD/VSS pairs, RESET, EXTAL/XTAL, BKGD, and peripheral-mapped I/O across Ports A–L.

Pin/Terminal Circuit Role Design Meaning
VDD (Pins 1, 12, 23, 34, 45, 56, 67, 78, 89, 100) Power Supply 10 independent VDD pins distribute power delivery and reduce noise coupling across analog/digital domains.
VSS (Pins 2, 13, 24, 35, 46, 57, 68, 79, 90) Ground Reference 9 dedicated VSS pins ensure low-impedance return paths for high-speed digital and sensitive analog circuits.
RESET (Pin 11) Active-Low Reset Input Asynchronous reset input with internal pull-up; accepts external reset signals or watchdog timeout assertion.
EXTAL (Pin 14) External Clock Input Connects to crystal/resonator or square-wave source for MCG oscillator circuit (EREFS = 1).
XTAL (Pin 15) Crystal Output Completes Pierce oscillator loop; requires external crystal between EXTAL and XTAL pins.
BKGD (Pin 16) Single-Wire Debug Interface Enables background debug mode (BDM) for flash programming and real-time emulation without JTAG overhead.
PTJ2 / TPM3CH2 (Pin 86) Peripheral Function Pin Configurable as general-purpose I/O or Timer Pulse-Width Modulator Channel 2 output - supports motor control PWM generation.
PTJ3 / TPM3CH3 (Pin 87) Peripheral Function Pin Configurable as general-purpose I/O or Timer Pulse-Width Modulator Channel 3 output - enables complementary PWM pair generation.

Key Features

Feature Design Value
Multi-Purpose Clock Generator (MCG) Supports FEI/FEE/FBE/PEE/BLPE modes with factory-trimmed internal reference (±1.5% over temp); enables seamless clock source switching without external components.
On-Chip CAN Controller (MSCAN) Full CAN 2.0A/B compliance with hardware message buffering, automatic retransmission, and error confinement - reduces host CPU load in distributed vehicle networks.
ADC with Bandgap Reference 12-bit resolution, 2.5 μs conversion, internal 1.18–1.21 V bandgap reference, and temperature sensor channel - eliminates need for external voltage references in sensor signal chains.
Low-Power Stop Modes Stop2 and Stop3 modes with wake-up via RTC, CAN, or external interrupt; real-time interrupt runs from 1 kHz internal oscillator - extends battery life in always-on modules.
Security & Protection FLASH/EPPROM block protection, illegal opcode/address detection, COP watchdog with windowed operation, and low-voltage detect with reset/interrupt - ensures system integrity in safety-critical environments.

Applications

Body Control Module (BCM) Door Module Controller

Use Scenario: Centralized management of lighting, power windows, locks, and mirrors in modern passenger vehicles.

IC Role / Device Role / Timing Role: Main MCU executing CAN-based command arbitration, ADC-based switch monitoring, and PWM-driven motor control for actuators.

Use Value: Integrated MSCAN and 24-channel ADC eliminate external transceivers and signal conditioners, reducing BOM cost and PCB area by >15% versus discrete solutions.

Use Scenario: Localized control of window lift, mirror adjustment, and door lock actuation with LIN/CAN bridging capability.

IC Role / Device Role / Timing Role: Real-time peripheral coordinator using TPM for precise 20–200 Hz PWM motor drive and SCI for LIN 2.0 slave communication.

Use Value: On-chip LIN-compliant SCI and dual PWM channels enable single-chip door node implementation without external UART or gate drivers.

Industrial CAN Gateway Smart Sensor Node

Use Scenario: Protocol translation between CANopen fieldbus and RS-485 Modbus networks in factory automation systems.

IC Role / Device Role / Timing Role: Dual-interface bridge MCU managing CAN message routing, CRC validation, and serial protocol framing with deterministic latency.

Use Value: Hardware-accelerated CAN message filtering and SCI baud rate generation (up to 1 Mbps) ensure sub-100 μs end-to-end latency for time-critical motion control loops.

Use Scenario: Self-contained environmental monitoring unit with temperature, humidity, and voltage sensing in harsh industrial settings.

IC Role / Device Role / Timing Role: Data acquisition engine performing periodic ADC sampling, internal temperature compensation, and CAN message formatting.

Use Value: Internal bandgap reference and factory-trimmed MCG enable ±0.5% measurement accuracy and stable 1 ms sampling intervals without external calibration components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08DZ96F2MLL Same package and pinout; reduced Flash (96 KB) and RAM (6 KB); identical peripherals including MSCAN, ADC, and MCG. Targeted at cost-sensitive nodes where firmware footprint < 96 KB and data buffer requirements ≤ 6 KB. Select when application code size and runtime memory usage fit within 96 KB/6 KB margins - no PCB or firmware porting required.
S9KEAZ128AMLH Kinetis E-series ARM Cortex-M0+ core; 128 KB Flash, 16 KB RAM; CAN 2.0B, 16-bit ADC, but no built-in LIN SCI - requires external transceiver for LIN. Higher performance (48 MHz core), enhanced security (memory protection unit), and longer roadmap support beyond HCS08. Choose for new designs requiring future-proofing, higher computational throughput, or ISO 26262 ASIL-B readiness - requires firmware migration and minor layout adjustments.

Compared with S9S08DZ128F2MLL, MC9S08DZ96F2MLL offers identical functionality at lower memory cost with zero hardware change, while S9KEAZ128AMLH provides ARM-based scalability and modern toolchain support at the expense of legacy HCS08 code compatibility and LIN integration.

Availability

S9S08DZ128F2MLL is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN gateways, smart sensor nodes, and door module controllers requiring stable component supply across extended product lifecycles.

Supply support for S9S08DZ128F2MLL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in microcontrollers dating to the Motorola 68HC05 era.

The S9S08DZ128F2MLL belongs to the HCS08 family - engineered specifically for cost-effective, high-reliability automotive body control applications where CAN integration, mixed-signal capability, and AEC-Q100 qualification are mandatory.

FAQ

What is the maximum operating frequency of the S9S08DZ128F2MLL CPU core?

The S9S08DZ128F2MLL CPU core operates at up to 40 MHz, with a corresponding bus frequency of 20 MHz. This is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PEE mode, where the PLL multiplies a 1 MHz reference clock by 32 to produce a 32 MHz DCO output, which is then divided by 2 for the bus clock. The S9S08DZ128F2MLL datasheet confirms this timing in Section 8.1.2 and Table A-12.

Does the S9S08DZ128F2MLL support CAN FD or only classical CAN 2.0?

The S9S08DZ128F2MLL supports only classical CAN 2.0A/B (ISO 11898-1), not CAN FD. Its MSCAN module implements fixed 11-bit or 29-bit identifier frames, bit rates up to 1 Mbps, and hardware message filtering - consistent with legacy automotive networks. CAN FD features such as variable bit rate and extended data length are absent; the S9S08DZ128F2MLL datasheet makes no mention of FD capability in Chapter 12 or Appendix A.

What is the ADC resolution and conversion time for the S9S08DZ128F2MLL?

The S9S08DZ128F2MLL features a 24-channel, 12-bit successive approximation register (SAR) ADC with a typical conversion time of 2.5 μs. It includes an internal temperature sensor and selectable reference sources (VREFH/VREFL or internal bandgap). These specifications are explicitly stated in the "Peripherals" section of the MC9S08DZ128 datasheet (Rev. 1, p. 22) and confirmed in Table A-6 (DC Characteristics).

Is the S9S08DZ128F2MLL AEC-Q100 qualified, and if so, what grade?

Yes, the S9S08DZ128F2MLL is AEC-Q100 qualified to Grade 2 (−40 °C to +105 °C), as documented in NXP's official ordering information and packaging data (Appendix B, Rev. 1, p. 447). This qualification covers stress testing for automotive under-hood and chassis applications, including temperature cycling, HTOL, and ESD robustness - critical for body control and gateway modules.

How many I/O pins does the S9S08DZ128F2MLL provide in its 100-pin LQFP package?

The S9S08DZ128F2MLL in the 100-pin LQFP (MLL) package provides up to 87 general-purpose I/O pins and 1 input-only pin, as specified in the "Input/Output" section of the MC9S08DZ128 datasheet (Rev. 1, p. 22). Pin multiplexing allows assignment of functions such as ADC inputs, TPM outputs, SCI signals, and CAN TX/RX across Ports A–L, with configurable slew rate and drive strength on all outputs.

S9S08DZ128F2MLL Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
87
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08DZ128F2MLL FAQ

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The price and inventory of S9S08DZ128F2MLL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ128F2MLL is usually 5 days.

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For technical support, including S9S08DZ128F2MLL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ128F2MLL requirements.

6.How does Aetrix verify that S9S08DZ128F2MLL is sourced from the original manufacturer or authorized distributors?

All S9S08DZ128F2MLL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ128F2MLL meets industry standards.

7.What is the process for return or replacement of S9S08DZ128F2MLL?

All S9S08DZ128F2MLL units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ128F2MLL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08DZ128F2MLL part is unused and in its original packaging.

Return procedure for S9S08DZ128F2MLL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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