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NXP Semiconductors S9S08DZ128F2MLLR
- Part No.:
- S9S08DZ128F2MLLR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
S9S08DZ128F2MLLR.pdf
- Description:
- IC MCU 8BIT 128KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,865
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Product details
Overview
S9S08DZ128F2MLLR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 128 KB Flash, 8 KB RAM, and integrated CAN 2.0A/B controller, ADC, TPM, SCI, SPI, I²C, and RTC - designed for automotive body electronics and industrial control requiring robust real-time operation at up to 20 MHz bus frequency.
For engineers reviewing the S9S08DZ128F2MLLR datasheet, S9S08DZ128F2MLLR pinout, S9S08DZ128F2MLLR application, or S9S08DZ128F2MLLR equivalent, this MCU delivers deterministic interrupt response (< 4 cycles), on-chip EEPROM emulation, background debug via single-wire interface, and full-featured clock generation including PLL/FLL with external crystal support up to 16 MHz.
Technical Context
The S9S08DZ128F2MLLR implements the HCS08 CPU core with 40-MHz instruction execution (20-MHz bus), supporting up to 32 interrupt sources and featuring a Multi-Purpose Clock Generator (MCG) with FEI/FEE/FBE/PEE/BLPE modes, internal bandgap reference (1.18–1.21 V), and programmable trim for ±0.2% FLL accuracy over temperature.
Its peripheral set includes a 24-channel 12-bit ADC (2.5 µs conversion), two analog comparators with stop-mode operation, MSCAN module with five receive buffers and flexible ID filtering (2×32-bit/4×16-bit/8×8-bit), and three TPM modules (6+2+4 channels) supporting edge- and center-aligned PWM with coherency protection on register writes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS08 8-bit CPU with BGND instruction, 40-MHz max core clock, 20-MHz max bus clock |
| Memory | 128 KB on-chip Flash (program/erase in run mode), 2 KB EEPROM (in-circuit programmable), 8 KB RAM |
| ADC | 24-channel, 12-bit resolution, 2.5 µs conversion time, internal temperature sensor and bandgap reference channel |
| Clock System | MCG with FLL and PLL; supports external crystals from 31.25 kHz to 16 MHz; DIV32 and RDIV configurable for precise reference division |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B); supports standard/extended frames, remote frames, and FIFO-based 5-buffer receive |
| Power Modes | Run, Wait, Stop2, Stop3; real-time interrupt wake-up from all modes; 1-kHz internal LPO for cyclic wake without external components |
| I/O & Packaging | 87 general-purpose I/O pins + 1 input-only pin; 100-pin LQFP (14×14 mm); hysteresis, pull devices, slew rate, and drive strength configurable per pin |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Pins 1, 25, 50, 75) | Supply voltage | Primary 5.0 V power input; multiple pins reduce IR drop and improve noise immunity |
| VSS (Pins 2, 26, 51, 76) | Ground reference | Dedicated ground connections per quadrant minimize ground bounce in mixed-signal operation |
| EXTAL / PTG0 (Pin 11) | External oscillator input | Connects to crystal/resonator high-side; requires external load capacitors; used with XTAL for Pierce oscillator |
| XTAL / PTG1 (Pin 12) | External oscillator output | Crystal/resonator low-side connection; forms feedback path for MCG oscillator circuit |
| RESET (Pin 13) | Active-low reset input | Asynchronous hardware reset; internal pull-up ensures valid state during power-up; accepts 5-V tolerant signal |
| BKGD/MS (Pin 14) | Background debug / mode select | Single-wire debug interface pin; also selects boot mode (normal vs. special bootstrap); 5-V tolerant |
| TPM3CH2 / PTJ2 (Pin 14) | PWM output / timer channel | Alternate function for Pin 14 in non-debug mode; supports edge-aligned PWM with dead-time insertion capability |
Key Features
| Feature | Design Value |
|---|---|
| On-chip EEPROM emulation | 2 KB electrically erasable memory with 8-byte page erase; supports program/erase while executing Flash code |
| MSCAN with FIFO buffering | Five independent receive buffers with automatic message prioritization and flexible ID acceptance filters |
| Real-time interrupt wake-up | 1-kHz internal low-power oscillator enables periodic wake from Stop2/Stop3 without external crystal or timing component |
| ADC with internal references | Includes dedicated channel for internal bandgap (1.18–1.21 V) and temperature sensor; eliminates need for external references |
| Coherent PWM register updates | Writing to TPMxSC or TPMxCnSC automatically resets modulo/channel value coherency mechanism to prevent race conditions |
Applications
| Automotive Door Module | Industrial Motor Control |
|---|---|
|
Use Scenario: Centralized control of window lift, mirror adjustment, lock actuation, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main system controller managing CAN communication with body control module, analog sensing of switch states, and PWM-driven motor drivers. Use Value: Integrated MSCAN ensures interoperability with OEM networks; 24-channel ADC monitors potentiometers and current sense; 87 GPIOs support diverse actuator interfaces. |
Use Scenario: Closed-loop speed/torque control of BLDC or stepper motors in HVAC blowers, conveyor drives, and pump systems. IC Role / Device Role / Timing Role: Real-time motion controller generating synchronized PWM outputs, sampling current/voltage feedback, and communicating fault status via SCI/SPI. Use Value: Three TPM modules provide six independent PWM channels with center-aligned mode and dead-time control; 12-bit ADC enables precise current measurement at 2.5 µs/sample. |
| Smart Lighting Node | Building Automation Sensor Hub |
|
Use Scenario: DALI- or 0–10 V-controlled LED driver node with thermal monitoring and dimming profile storage. IC Role / Device Role / Timing Role: Local intelligence unit executing lighting algorithms, storing calibration data in EEPROM, and interfacing with analog dimming inputs and thermal sensors. Use Value: On-chip EEPROM retains dimming curves across power cycles; internal temperature sensor and bandgap reference eliminate external components; LIN-capable SCI supports master-slave lighting networks. |
Use Scenario: Multi-sensor aggregation node collecting temperature, humidity, occupancy, and CO₂ data for HVAC optimization in commercial buildings. IC Role / Device Role / Timing Role: Low-power sensor fusion processor with RTC-based scheduling, I²C/SPI peripheral expansion, and CAN backbone connectivity. Use Value: Stop3 mode draws < 1 µA while maintaining RTC and wake-on-interrupt capability; dual I²C interfaces manage multiple sensor ICs; CAN interface reports aggregated data to central BMS. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ96F2MLLR | 96 KB Flash, 6 KB RAM, same pinout and peripheral set; lacks 2 KB EEPROM | Lower memory footprint suitable for cost-sensitive body control units with reduced feature sets | Select when application logic fits within 96 KB Flash and no EEPROM persistence is required |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core; 128 KB Flash, 16 KB RAM; different architecture, instruction set, and debug interface | Higher performance, richer peripheral set (e.g., USB, more timers), but requires software migration and PCB layout changes | Choose for new designs needing scalable performance, future-proofing, or ARM ecosystem compatibility |
Compared with MC9S08DZ96F2MLLR, S9S08DZ128F2MLLR provides 32 KB additional Flash and 2 KB EEPROM for firmware updates and parameter storage; versus S9KEAZ128AMLH, it offers pin-compatible legacy support and lower power in Stop3 mode but lacks ARM-level toolchain integration and advanced peripherals like USB.
Availability
S9S08DZ128F2MLLR is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor controllers, smart lighting nodes, and building automation sensor hubs requiring stable component supply, long-term lifecycle assurance, and automotive-grade qualification.
Supply support for S9S08DZ128F2MLLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontrollers dating back to Motorola and Freescale.
The S9S08DZ128F2MLLR belongs to the HCS08 DZ-series, engineered specifically for cost-effective, high-reliability automotive body control modules where CAN integration, analog sensing, and ultra-low-power stop modes are critical design requirements.
FAQ
What is the maximum bus frequency supported by the S9S08DZ128F2MLLR?
The S9S08DZ128F2MLLR supports a maximum bus frequency of 20 MHz, achieved using the internal PLL with appropriate configuration of the MCG registers (e.g., RDIV and VDIV). This allows deterministic real-time operation for time-critical automotive and industrial tasks while maintaining compatibility with legacy 5-V logic families.
Does the S9S08DZ128F2MLLR include a CAN controller, and what protocol versions does it support?
Yes, the S9S08DZ128F2MLLR integrates the MSCAN module compliant with ISO 11898-1, supporting CAN 2.0A (standard frames) and CAN 2.0B (extended frames), including remote transmission requests and flexible identifier filtering configurations. The S9S08DZ128F2MLLR's MSCAN operates independently of CPU load via dedicated receive buffers and FIFO handling.
Can the S9S08DZ128F2MLLR operate from a 16 MHz crystal, and how is it configured?
Yes, the S9S08DZ128F2MLLR supports external crystals up to 16 MHz in high-range oscillator mode (RANGE = 1, HGO = 1). Configuration requires setting MCGC2[EREFS] = 1, MCGC2[RANGE] = 1, and MCGC2[HGO] = 1, then selecting PEE mode via MCGC3[PLLS] = 1 and adjusting RDIV/DIV32 to ensure the reference clock falls within 1–2 MHz for PLL lock - as confirmed in Table A-11 of the datasheet.
What power-saving modes are available on the S9S08DZ128F2MLLR, and which retain RTC functionality?
The S9S08DZ128F2MLLR offers Run, Wait, Stop2, and Stop3 modes. Only Stop2 and Stop3 retain RTC operation - Stop3 uses the internal 1-kHz low-power oscillator to maintain timekeeping and enable wake-up events without external components, drawing less than 1 µA typical. The S9S08DZ128F2MLLR's RTC remains active and functional in both Stop2 and Stop3.
Is there on-chip EEPROM in the S9S08DZ128F2MLLR, and how is it managed?
Yes, the S9S08DZ128F2MLLR includes 2 KB of EEPROM implemented in Flash memory with dedicated erase sectors (8-byte single-page or 4-byte dual-page). It supports in-circuit programming and erasure while executing code from other Flash blocks. The S9S08DZ128F2MLLR's EEPROM is accessed via standard Flash command sequences and protected by block-protection bits to prevent accidental overwrite.
S9S08DZ128F2MLLR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 87
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DZ128F2MLLR FAQ
1.How can I place an order for S9S08DZ128F2MLLR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DZ128F2MLLR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DZ128F2MLLR reliable?
The price and inventory of S9S08DZ128F2MLLR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ128F2MLLR is usually 5 days.
3.What payment methods are accepted for S9S08DZ128F2MLLR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DZ128F2MLLR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08DZ128F2MLLR?
S9S08DZ128F2MLLR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08DZ128F2MLLR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08DZ128F2MLLR?
For technical support, including S9S08DZ128F2MLLR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ128F2MLLR requirements.
6.How does Aetrix verify that S9S08DZ128F2MLLR is sourced from the original manufacturer or authorized distributors?
All S9S08DZ128F2MLLR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ128F2MLLR meets industry standards.
7.What is the process for return or replacement of S9S08DZ128F2MLLR?
All S9S08DZ128F2MLLR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ128F2MLLR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DZ128F2MLLR part is unused and in its original packaging.
Return procedure for S9S08DZ128F2MLLR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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