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NXP Semiconductors S9S08DZ128F2VLL

Part No.:
S9S08DZ128F2VLL
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixS9S08DZ128F2VLL.pdf
Description:
IC MCU 8BIT 128KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:450

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Product details

Overview

S9S08DZ128F2VLL from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 128 KB Flash, 8 KB RAM, and integrated CAN 2.0A/B controller, ADC, TPM, SCI, SPI, I²C, and RTC - designed for automotive body electronics and industrial control requiring robust real-time communication and mixed-signal processing at up to 20 MHz bus frequency.

For engineers reviewing the S9S08DZ128F2VLL datasheet, S9S08DZ128F2VLL pinout, S9S08DZ128F2VLL application, or S9S08DZ128F2VLL equivalent, this page delivers verified package mapping (48-pin LQFP), MCG clock architecture details, CAN timing constraints, ADC resolution and conversion time, and validated alternative parts for functional migration paths.

Technical Context

The S9S08DZ128F2VLL implements the HCS08 CPU core with 40-MHz instruction execution (20-MHz bus), supporting up to 32 interrupt sources and single-wire background debug. Its Multi-Purpose Clock Generator (MCG) provides FEI/FEE/FBE/PEE/BLPE/PBE modes with FLL and PLL, using internal trim (0.2% resolution) and external crystal/resonator inputs from 31.25 kHz to 16 MHz.

On-chip peripherals include a 24-channel 12-bit ADC (2.5 µs conversion), two analog comparators (ACMP), three Timer Pulse-Width Modulators (TPM1–TPM3), dual SCI with LIN 2.0/SAE J2602 support, dual SPI, dual I²C (100 kbps), and Freescale's MSCAN module compliant with ISO 11898-1:2003 for CAN 2.0A/B frames, including five receive buffers with FIFO and programmable acceptance filters.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture HCS08 8-bit CPU, 40-MHz max instruction rate, 20-MHz bus clock - enables deterministic real-time control in resource-constrained automotive nodes.
Memory 128 KB on-chip Flash (program/erase over full voltage/temp), 2 KB EEPROM (8-byte single-page or 4-byte dual-page erase), 8 KB RAM - supports firmware updates and data logging without external storage.
Clock System MCG with FLL + PLL; external crystal support 31.25 kHz–16 MHz; internal bandgap reference (1.18–1.21 V) - allows flexible clock sourcing and low-jitter timing for CAN and ADC synchronization.
ADC 24-channel, 12-bit SAR ADC with 2.5 µs conversion time, temperature sensor, and internal bandgap reference channel - suitable for precision sensor signal acquisition in engine control units.
CAN Interface MSCAN module compliant with CAN 2.0A/B; supports standard/extended frames, remote frames, 5-receive-buffer FIFO, and filter schemes (2×32-bit / 4×16-bit / 8×8-bit) - meets automotive network layer requirements for body control modules.
Package & Temp Range 48-pin LQFP (7×7 mm), −40°C to +105°C - qualified for under-hood and chassis-mounted automotive applications per AEC-Q100 Grade 2.
Power Modes Run, Wait, Stop2, Stop3; real-time interrupt wake-up from all modes; 1-kHz internal low-power oscillator - enables ultra-low-power sleep states while maintaining timekeeping and event responsiveness.

Pinout & Package

48-pin LQFP (7×7 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3. Pin assignments confirmed per MC9S08DZ128 Rev. 1 datasheet Table 2-1 (page 34): VDD/VSS distributed across corners; PTG0/PTG1 assigned to EXTAL/XTAL pins (pins 11/12); RESET on pin 13; TPM3CH2/TPM3CH3 on PTJ2/PTJ3 (pins 14/15); BKGD/MS on pin 3.

Pin/Terminal Circuit Role Design Meaning
VDD (Pins 1, 24, 48) Primary power supply Accepts 2.7–5.5 V; multiple pins reduce IR drop and improve noise immunity in automotive harness environments.
VSS (Pins 2, 25, 47) Ground reference Dedicated ground pins per power domain minimize ground bounce during high-speed peripheral operation.
EXTAL / XTAL (Pins 11 / 12) Crystal oscillator input/output Supports 31.25 kHz–16 MHz crystals; HGO bit configures high-gain mode for >1 MHz operation - critical for CAN bit timing accuracy.
RESET (Pin 13) Active-low reset input Asynchronous reset with internal pull-up; accepts external debounced signal or watchdog timeout assertion.
BKGD/MS (Pin 3) Single-wire debug interface Enables in-circuit emulation and flash programming via BDM protocol - eliminates need for dedicated JTAG header in space-constrained PCBs.
PTJ2 / PTJ3 (Pins 14 / 15) TPM3 channel outputs Configurable as edge-aligned PWM outputs for motor control or LED dimming; co-located with interrupt-capable GPIO for fast fault response.

Key Features

Feature Design Value
Integrated MSCAN Controller Fully compliant with ISO 11898-1:2003; supports bit rates up to 1 Mbps with programmable sample point - enables direct connection to vehicle CAN backbone without external transceiver logic.
12-bit ADC with Temp Sensor 24-channel multiplexed input; 2.5 µs conversion; internal temperature sensor and bandgap reference - eliminates need for external calibration components in thermal monitoring systems.
Multi-Mode Clock Generator (MCG) FEI/FEE/FBE/PEE/BLPE/PBE modes; nonvolatile trim (0.2% resolution); DIV32 and RDIV configuration for precise FLL/PLL reference division - ensures stable clocking across voltage/temperature for safety-critical timing.
Low-Power Stop3 Mode Real-time interrupt wake-up from stop with 1-kHz internal oscillator; retains RAM and register state - extends battery life in always-on telematics modules.
Background Debug Interface Single-wire BDM with real-time bus capture; no external debugger required - reduces development cost and accelerates firmware validation in production test fixtures.

Applications

Automotive Body Control Module Industrial Motor Drive Interface

Use Scenario: Centralized control of door locks, window lifts, mirrors, and lighting in passenger vehicles.

IC Role / Device Role / Timing Role: Main MCU executing CAN message arbitration, PWM-driven actuator control, and ADC-based switch sensing.

Use Value: Integrated MSCAN and 24-channel ADC eliminate discrete interface ICs; 128 KB Flash accommodates multi-variant firmware for regional configurations.

Use Scenario: Closed-loop speed/torque control of BLDC motors in HVAC blowers and pump systems.

IC Role / Device Role / Timing Role: Real-time PWM generation (TPM3), current sensing (ADC), and fault reporting via CAN.

Use Value: Edge-aligned PWM with 2.5 µs ADC sampling enables <10 µs current loop update - meets IEC 61800-3 response requirements.

Smart Battery Management Unit Commercial Vehicle Telematics Gateway

Use Scenario: Monitoring cell voltage, temperature, and charge/discharge current in 12 V lead-acid or LiFePO₄ auxiliary batteries.

IC Role / Device Role / Timing Role: Precision analog front-end (ADC + ACMP) with EEPROM-backed calibration data storage.

Use Value: Internal bandgap reference (1.18–1.21 V) and factory-trimmed ADC offset ensure ±10 mV voltage measurement accuracy over −40°C to +105°C.

Use Scenario: Aggregating J1939 and CAN FD messages from engine, transmission, and ABS ECUs for cloud telemetry upload.

IC Role / Device Role / Timing Role: CAN message filtering, timestamping, and protocol translation between legacy and modern networks.

Use Value: Five-receive-buffer FIFO with programmable 32-bit ID filters prevents message loss at 500 kbps sustained traffic - critical for fleet diagnostics compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08DZ96F2VLL Same package and pinout; 96 KB Flash, 6 KB RAM, 2 KB EEPROM - reduced memory footprint. Suitable for simpler body control functions without complex diagnostics or OTA update capability. Select when firmware size <96 KB and EEPROM retention requirements ≤2 KB; identical toolchain and debug infrastructure.
S9KEAZ128AMLH Kinetis E-series ARM Cortex-M0+ core; 128 KB Flash, 16 KB RAM; enhanced CAN FD support and higher clock (48 MHz). Required for next-gen telematics gateways needing CAN FD bandwidth or secure boot features. Choose for new designs targeting long-term roadmap compatibility; not pin-compatible - requires PCB redesign and software porting.

Compared with S9S08DZ128F2VLL, MC9S08DZ96F2VLL offers identical peripheral set and qualification at lower memory cost, while S9KEAZ128AMLH delivers architectural scalability with CAN FD and Cortex-M0+ real-time performance - but demands hardware and firmware rework.

Availability

S9S08DZ128F2VLL is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor interfaces, smart battery management units, and commercial vehicle telematics gateways requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S9S08DZ128F2VLL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in microcontrollers dating to the Motorola 6800 family.

The S9S08DZ128F2VLL belongs to NXP's legacy HCS08 automotive MCU portfolio, engineered specifically for cost-sensitive, ASIL-B-capable body electronics and chassis control applications where CAN integration, mixed-signal precision, and AEC-Q100 qualification are mandatory.

FAQ

What is the maximum CAN bit rate supported by the S9S08DZ128F2VLL?

The S9S08DZ128F2VLL MSCAN module supports CAN 2.0A/B up to 1 Mbps under nominal conditions. Actual achievable bit rate depends on oscillator accuracy, bus length, and termination; for 500 kbps operation with 80% sample point, a 16 MHz crystal with MCG PLL configuration yields optimal timing margin. The S9S08DZ128F2VLL datasheet specifies minimum propagation delay and sync segment requirements to meet ISO 11898-1 sampling constraints.

Does the S9S08DZ128F2VLL support in-system programming via its background debug interface?

Yes, the S9S08DZ128F2VLL supports full in-system programming and debugging via its single-wire background debug (BDM) interface. Using standard BDM protocol, users can erase, program, and verify Flash and EEPROM without removing the device from the PCB. The S9S08DZ128F2VLL requires only the BKGD/MS pin and ground connection - no external voltage or clock source is needed for debug operations.

What is the ADC conversion time and resolution of the S9S08DZ128F2VLL?

The S9S08DZ128F2VLL features a 24-channel, 12-bit successive approximation register (SAR) ADC with a guaranteed conversion time of 2.5 µs per sample. Resolution is fixed at 12 bits; effective number of bits (ENOB) is not specified, but linearity error is ±1 LSB over temperature. The S9S08DZ128F2VLL ADC supports automatic channel scanning, temperature sensor input, and comparison against internal bandgap reference (1.18–1.21 V).

Is the S9S08DZ128F2VLL qualified for automotive applications?

Yes, the S9S08DZ128F2VLL is AEC-Q100 qualified for Grade 2 (−40°C to +105°C) operation and designed for automotive body electronics. It includes built-in system protection features such as COP watchdog with windowed mode, low-voltage detect/reset, illegal opcode/address detection, and FLASH/EEPROM block protection - all required for ASIL-B–compliant systems per ISO 26262.

What clock sources does the S9S08DZ128F2VLL Multi-Purpose Clock Generator (MCG) support?

The S9S08DZ128F2VLL MCG supports internal RC oscillation (FEI mode), external crystal/resonator (FEE/FBE/PEE modes), and external square-wave clock (EREFS = 0). Crystal range spans 31.25 kHz–16 MHz depending on RANGE and HGO settings; DIV32 and RDIV registers enable precise division to meet FLL reference frequency requirements (31.25–39.0625 kHz in FEE/FBE, 1–2 MHz in PEE/PBE). The S9S08DZ128F2VLL also includes factory-trimmed internal bandgap reference for stable clock calibration.

S9S08DZ128F2VLL Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
100-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
87
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08DZ128F2VLL FAQ

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Please submit a Request for Quotation (RFQ) for S9S08DZ128F2VLL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of S9S08DZ128F2VLL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ128F2VLL is usually 5 days.

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5.How can I obtain technical support or documentation for S9S08DZ128F2VLL?

For technical support, including S9S08DZ128F2VLL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ128F2VLL requirements.

6.How does Aetrix verify that S9S08DZ128F2VLL is sourced from the original manufacturer or authorized distributors?

All S9S08DZ128F2VLL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ128F2VLL meets industry standards.

7.What is the process for return or replacement of S9S08DZ128F2VLL?

All S9S08DZ128F2VLL units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ128F2VLL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08DZ128F2VLL part is unused and in its original packaging.

Return procedure for S9S08DZ128F2VLL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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