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NXP Semiconductors S9S08DZ16F2CLC
- Part No.:
- S9S08DZ16F2CLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S08DZ16F2CLC.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,254
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Product details
Overview
S9S08DZ16F2CLC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip Flash, 2 KB EEPROM, and 4 KB RAM, operating at up to 40 MHz CPU / 20 MHz bus frequency. It integrates MSCAN (CAN 2.0A/B), dual SCI with LIN 2.0 support, 12-bit 24-channel ADC, two analog comparators, dual TPM modules, RTC, I²C, SPI, and single-wire BDM debug - deployed in automotive body control modules requiring CAN-based sensor/actuator communication.
For engineers reviewing the S9S08DZ16F2CLC datasheet, S9S08DZ16F2CLC pinout, S9S08DZ16F2CLC application, or S9S08DZ16F2CLC equivalent, key selection criteria include CAN protocol compliance, in-circuit programmable EEPROM with sector erase, real-time interrupt wake-up from Stop3 mode, and factory-trimmed internal reference clock for stable timing across temperature.
Technical Context
The S9S08DZ16F2CLC implements the HCS08 CPU core with BGND instruction support and handles up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) supports FLL (±1.5% deviation with internal temp compensation) and PLL modes, plus factory-trimmed internal reference clock stored in Flash.
On-chip peripherals include a 24-channel 12-bit ADC with 2.5 µs conversion time and temperature sensor, dual SCIs compliant with LIN 2.0 and SAE J2602, and MSCAN with five receive buffers, FIFO storage, and programmable identifier filters (2×32-bit, 4×16-bit, or 8×8-bit).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with 40-MHz max operation and 20-MHz bus clock - enables deterministic real-time control in resource-constrained automotive nodes. |
| Flash Memory | 16 KB flash with read/program/erase over full voltage/temperature range - supports field firmware updates without external programming hardware. |
| EEPROM | 2 KB in-circuit programmable EEPROM with 8-byte single-page or 4-byte dual-page erase sectors - preserves calibration data across power cycles with minimal wear leveling overhead. |
| ADC | 24-channel, 12-bit resolution, 2.5 µs conversion time with internal bandgap reference and temperature sensor - delivers high-accuracy analog monitoring for battery voltage, cabin temperature, and motor current sensing. |
| MSCAN Interface | CAN 2.0A/B compliant with standard/extended frames, remote frame support, and five FIFO-managed receive buffers - ensures robust message handling in vehicle network gateways and junction boxes. |
| Power Modes | Two very low-power Stop modes (Stop2/Stop3), reduced-power Wait mode, and VLP real-time interrupt - extends battery life in always-on modules like door lock controllers and seat position memory systems. |
| Debug Interface | Single-wire Background Debug Mode (BDM) with on-chip ICE and real-time bus capture - enables non-intrusive debugging and trace without dedicated JTAG pins or external probes. |
Pinout & Package
Package: 48-pin LQFP (7×7 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5.0 V supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) - enable noise-isolated ADC operation and reduce coupling into sensitive analog circuitry. |
| XTAL, EXTAL | Crystal oscillator inputs | Support 1–16 MHz crystal or ceramic resonator - provides precise system timing for CAN bit rate accuracy and LIN synchronization. |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface pin - allows firmware download, breakpoint insertion, and register inspection using only one MCU pin and no external debugger hardware. |
| CANH, CANL | CAN differential bus lines | Direct connection to ISO 11898-2 physical layer transceiver - eliminates need for external level-shifting or signal conditioning in standard CAN networks. |
| SCI1_TX, SCI1_RX | LIN bus UART signals | Hardware-supported LIN 2.0 master/slave framing with extended break generation/detection - simplifies implementation of LIN slave nodes in lighting and mirror control subsystems. |
Key Features
| Feature | Design Value |
|---|---|
| Factory-trimmed internal reference clock | Trim value stored in Flash enables ±1.5% FLL accuracy over -40°C to +125°C - eliminates external crystal for cost-sensitive LIN-only applications while maintaining protocol timing compliance. |
| Program/erase while executing Flash | Enables seamless firmware updates and parameter storage during runtime - critical for over-the-air (OTA) reprogramming in telematics and gateway ECUs without system interruption. |
| Real-time interrupt in Stop3 mode | 1 kHz internal low-power oscillator wakes MCU from deepest sleep state in ≤4 µs - supports periodic sensor polling (e.g., intrusion detection) with sub-1 µA quiescent current. |
| Flexible CAN identifier filtering | Configurable as 2×32-bit, 4×16-bit, or 8×8-bit acceptance masks - optimizes receive buffer utilization for mixed-traffic networks with both high-priority control messages and low-rate diagnostic frames. |
| ADC automatic compare function | Hardware-triggered threshold comparison with interrupt on match - offloads CPU for battery voltage monitoring and thermal shutdown decisions without software polling overhead. |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized management of interior lighting, window lift, mirror adjustment, and keyless entry functions in mid-tier passenger vehicles. IC Role / Device Role / Timing Role: Primary CAN node coordinating distributed actuators via standardized UDS diagnostics and LIN sub-networks for local peripherals. Use Value: Integrated MSCAN and dual SCI eliminate external protocol translators; 16 KB Flash accommodates OEM-specific feature sets and regional variant logic. | Use Scenario: Local control unit inside vehicle door housing window motor, lock actuator, and side mirror motors with integrated anti-pinch detection. IC Role / Device Role / Timing Role: Real-time motor control executor with ADC-based current sensing and PWM-driven H-bridge drivers managed by TPM modules. Use Value: On-chip 12-bit ADC with temperature sensor enables closed-loop thermal derating; Stop3-mode RTC wake-up supports periodic door position verification during vehicle sleep. |
| Seat Position Memory System | Roof Module (Sunroof/Convertibles) |
Use Scenario: Storing and recalling driver seat position settings using potentiometer feedback and non-volatile memory retention across ignition cycles. IC Role / Device Role / Timing Role: Sensor interface and EEPROM manager interfacing with LIN slaves (seat track sensors, lumbar controls) and CAN gateway. Use Value: 2 KB EEPROM with 4-byte dual-page erase preserves seat profile data with >100k write cycles; factory-trimmed IRC ensures accurate LIN baud rate without crystal cost. | Use Scenario: Controlling sunroof glass/motor assembly with obstacle detection, rain-sensing auto-close, and soft-stop positioning in premium roof modules. IC Role / Device Role / Timing Role: Safety-critical motion controller using ADC for current/voltage monitoring and TPM for precise PWM timing of bidirectional DC motors. Use Value: Dual TPM modules provide independent 6- and 2-channel PWM outputs for main drive and auxiliary functions; watchdog COP reset ensures fail-safe motor halt on fault detection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ32F2CLC | 32 KB Flash, same package/peripherals - doubles program space for larger diagnostics stacks or multi-language UI support. | Preferred where future firmware expansion or bootloader + application partitioning is required. | Select when code size exceeds 16 KB or when dual-bank Flash architecture is needed for safe OTA updates. |
| SPC560B50L5 | 32-bit Power Architecture core, 512 KB Flash, ASIL-B capable - higher performance, safety certification, and CAN FD support. | Required for next-generation platforms targeting ISO 26262 functional safety or CAN FD bandwidth upgrades. | Choose for new designs needing ASIL-B compliance or migration path to CAN FD; not drop-in compatible. |
Compared with MC9S08DZ32F2CLC and SPC560B50L5, the S9S08DZ16F2CLC offers optimal cost-performance balance for established 8-bit automotive body electronics, delivering verified CAN/LIN/ADC functionality in a mature, production-proven footprint without over-specifying resources.
Availability
S9S08DZ16F2CLC is available at Aetrix Electronics and suitable for automotive body control modules, door module controllers, seat position memory systems, and roof module applications requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 2 qualification.
Supply support for S9S08DZ16F2CLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Freescale's automotive MCU heritage.
The S9S08DZ16F2CLC belongs to the HCS08 DZ-series, designed specifically for cost-sensitive, CAN-enabled automotive body electronics where reliability, low-power operation, and protocol integration are essential.
FAQ
What is the maximum operating temperature range for the S9S08DZ16F2CLC?
The S9S08DZ16F2CLC is qualified per AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C ambient temperature. This rating is validated across all electrical specifications including Flash endurance, ADC linearity, and CAN timing margins - making the S9S08DZ16F2CLC suitable for under-hood and interior automotive locations where thermal stress is present. The device maintains full functionality within this range without derating.
Does the S9S08DZ16F2CLC support CAN FD or only classical CAN?
The S9S08DZ16F2CLC supports only Classical CAN (ISO 11898-1, CAN 2.0A/B) with data rates up to 1 Mbps. It does not implement CAN FD features such as flexible data-rate switching, extended data length (up to 64 bytes), or CRC enhancements. The MSCAN module is fully compatible with legacy vehicle networks but requires external gateway translation for CAN FD interoperability. For CAN FD, consider NXP's S32K1xx series instead of the S9S08DZ16F2CLC.
How much EEPROM endurance does the S9S08DZ16F2CLC guarantee?
The S9S08DZ16F2CLC guarantees 100,000 erase/write cycles for its 2 KB EEPROM, validated across the full operating temperature range (–40°C to +105°C). Each sector supports 8-byte single-page or 4-byte dual-page erase, enabling fine-grained updates for calibration constants or user preferences without disturbing adjacent data. Endurance is specified under typical VDD = 5.0 V conditions and applies to both in-system and in-application programming.
Can the S9S08DZ16F2CLC operate without an external crystal?
Yes, the S9S08DZ16F2CLC can operate without an external crystal by using its factory-trimmed internal reference clock (IRC) with FLL stabilization. The IRC delivers ±1.5% accuracy over –40°C to +125°C when enabled in MCG's FEI or FBE modes - sufficient for LIN 2.0 (±1.5% baud tolerance) and non-timing-critical CAN applications. XTAL/EXTAL pins remain unused in this configuration, reducing BOM count and PCB area.
What debug interface does the S9S08DZ16F2CLC use, and is JTAG supported?
The S9S08DZ16F2CLC uses a single-wire Background Debug Mode (BDM) interface via the BKGD/MS pin - not JTAG. This interface supports full read/write memory access, register inspection, breakpoint setting, and real-time bus capture through on-chip ICE. JTAG is not implemented; BDM requires only one signal plus ground, minimizing debug connector footprint and enabling in-field firmware updates using standard NXP BDM tools like the Multilink Universal.
S9S08DZ16F2CLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 512 x 8
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DZ16F2CLC FAQ
1.How can I place an order for S9S08DZ16F2CLC through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DZ16F2CLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DZ16F2CLC reliable?
The price and inventory of S9S08DZ16F2CLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ16F2CLC is usually 5 days.
3.What payment methods are accepted for S9S08DZ16F2CLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DZ16F2CLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08DZ16F2CLC?
S9S08DZ16F2CLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08DZ16F2CLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08DZ16F2CLC?
For technical support, including S9S08DZ16F2CLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ16F2CLC requirements.
6.How does Aetrix verify that S9S08DZ16F2CLC is sourced from the original manufacturer or authorized distributors?
All S9S08DZ16F2CLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ16F2CLC meets industry standards.
7.What is the process for return or replacement of S9S08DZ16F2CLC?
All S9S08DZ16F2CLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ16F2CLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DZ16F2CLC part is unused and in its original packaging.
Return procedure for S9S08DZ16F2CLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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