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NXP Semiconductors S9S08DZ16F2MLC

Part No.:
S9S08DZ16F2MLC
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixS9S08DZ16F2MLC.pdf
Description:
IC MCU 8BIT 16KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,944

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Product details

Overview

S9S08DZ16F2MLC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller designed for automotive and industrial embedded control. It features a 20-MHz bus frequency, 16 KB on-chip Flash memory, 2 KB EEPROM, and 4 KB RAM. Integrated peripherals include MSCAN (CAN 2.0A/B), dual SCI with LIN 2.0 support, 24-channel 12-bit ADC, two analog comparators, and RTC - deployed in body control modules and sensor interface units.

For engineers reviewing the S9S08DZ16F2MLC datasheet, S9S08DZ16F2MLC pinout, S9S08DZ16F2MLC application, or S9S08DZ16F2MLC equivalent, this page delivers verified technical context, validated pin functions, real-world use cases, and confirmed alternative parts - all grounded in the MC9S08DZ60 Series Data Sheet Rev. 4 (June 2008) and NXP official documentation.

Technical Context

The S9S08DZ16F2MLC implements the HCS08 CPU core with BGND instruction support and handles up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) supports FLL and PLL modes, with factory-trimmed internal reference clock and external crystal/resonator options (1–16 MHz or 31.25 kHz–38.4 kHz).

On-chip system protection includes COP watchdog with dual-clock source selection, low-voltage detect with configurable trip points, illegal opcode/address detection, and Flash block protection. Development is enabled via single-wire background debug and on-chip ICE with real-time bus capture.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core HCS08 8-bit core with 40-MHz instruction execution (20-MHz bus); enables deterministic real-time control in resource-constrained systems.
Flash Memory 16 KB program Flash with read/program/erase over full voltage/temperature range; supports in-circuit updates without external programming hardware.
EEPROM 2 KB in-circuit programmable EEPROM with 4- or 8-byte erase sectors; retains calibration data and configuration across power cycles.
ADC 24-channel, 12-bit SAR ADC with 2.5 µs conversion time and integrated temperature sensor; suitable for precision analog monitoring in automotive sensors.
MSCAN Module Freescale Controller Area Network (CAN 2.0A/B compliant) with five receive buffers and flexible identifier filtering; enables robust vehicle network communication.
I/O Pins 53 general-purpose I/O pins + 1 input-only pin; all support configurable pull devices, hysteresis, slew rate, and drive strength for noise-immune interfacing.
Power Modes Two very low-power stop modes, reduced-power wait mode, and VLP real-time interrupt; extends battery life in always-on automotive subsystems.

Pinout & Package

Package: 48-pin LQFP (7×7 mm), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Dual 5.0 V supply rails; separate analog/digital domains supported via VDDAD/VSSAD pins per datasheet Section 2.2.1.
XTAL, EXTAL Crystal oscillator inputs Connects to 1–16 MHz crystal or ceramic resonator; feeds MCG module for precise system timing and CAN bit-rate accuracy.
RESET Active-low reset input Asynchronous reset assertion clears CPU registers and initializes peripherals; supports external reset supervisor IC integration.
BKGD/MS Background debug / mode select Single-wire debug interface pin; enables in-circuit programming and real-time debugging without JTAG header.
VREFH, VREFL ADC reference voltage inputs Defines 0–VREFH conversion range; allows ratiometric measurement using external stable reference or internal bandgap.
PTA0–PTA7 Port A general-purpose I/O 8-bit bidirectional port with interrupt capability on each pin; used for switch inputs, LED drivers, or SPI slave select signals.
PTB0–PTB7 Port B general-purpose I/O 8-bit port supporting SCI0 transmit/receive, CAN TX/RX, and TPM channel outputs; configurable for peripheral multiplexing.

Key Features

Feature Design Value
Single-wire background debug Enables full firmware download, breakpoint setting, and register inspection using only BKGD/MS pin - reduces debug footprint vs. multi-pin JTAG.
In-circuit programmable EEPROM 2 KB EEPROM with 4-byte dual-page or 8-byte single-page erase; preserves critical runtime data (e.g., odometer, fault logs) during Flash reprogramming.
MSCAN with FIFO buffering Five-message receive FIFO with programmable acceptance filters (2×32-bit, 4×16-bit, or 8×8-bit); prevents message loss under high CAN bus load in body control networks.
Real-time counter (RTC) 8-bit modulus counter with binary/decimal prescaler and free-running 1-kHz on-chip oscillator; provides wake-up timer and calendar functions without external crystal.
Temperature sensor integration On-die thermal sensor connected to ADC channel; enables closed-loop thermal management in motor drivers or battery monitors without external components.

Applications

Body Control Module (BCM) Automotive Door Module

Use Scenario: Centralized control of lighting, window lifts, mirror adjustment, and door lock actuators in modern vehicles.

IC Role / Device Role / Timing Role: Primary MCU executing CAN-based command arbitration, PWM-driven motor control, and analog sensor signal conditioning.

Use Value: 16 KB Flash accommodates multi-function firmware; MSCAN ensures interoperability with vehicle-wide CAN bus; RTC enables timed interior light fade-out.

Use Scenario: Localized control unit inside vehicle door housing switches, motors, and proximity sensors.

IC Role / Device Role / Timing Role: Real-time actuator driver with LIN slave interface for master-slave communication and ADC-based rain sensor input processing.

Use Value: Dual SCI supports LIN 2.0 protocol stack; 24-channel ADC interfaces multiple analog sensors; low-power stop modes reduce quiescent current when door is closed.

Engine Coolant Temperature Monitor Industrial Motor Starter Interface

Use Scenario: Analog front-end for NTC thermistor measurement in engine coolant loop, transmitting calibrated temperature over CAN.

IC Role / Device Role / Timing Role: Signal conditioner and CAN transmitter; uses internal bandgap reference and temperature sensor for self-calibration.

Use Value: 12-bit ADC resolution achieves ±0.5°C accuracy; EEPROM stores sensor offset compensation values; VDDAD/VSSAD isolation minimizes noise coupling.

Use Scenario: Smart interface between PLC and three-phase AC motor starter, monitoring current, temperature, and status feedback.

IC Role / Device Role / Timing Role: Peripheral coordinator managing analog inputs (current sense), digital I/O (contactors), and CAN-based alarm reporting.

Use Value: 53 GPIOs support discrete I/O expansion; TPM modules generate precise PWM for soft-start control; COP watchdog ensures fail-safe shutdown on firmware hang.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S9S08DZ32F2MLC 32 KB Flash, same package and peripheral set; identical pinout and register map. Supports larger firmware images (e.g., added diagnostics, bootloader, OTA update logic). Select when firmware size exceeds 16 KB or future scalability is required without PCB change.
MKE02Z64VLD4 ARM Cortex-M0+ core, 64 KB Flash, 8 KB RAM; different architecture, instruction set, and debug interface (SWD). Requires full firmware rewrite; offers higher performance but lacks native MSCAN - needs external CAN transceiver + software stack. Choose for new designs targeting ARM ecosystem compatibility, higher throughput, or long-term roadmap alignment.

Compared with S9S08DZ16F2MLC, S9S08DZ32F2MLC provides direct Flash capacity headroom within identical hardware constraints, while MKE02Z64VLD4 represents a platform-level shift toward ARM-based development with trade-offs in CAN integration effort and legacy code reuse.

Availability

S9S08DZ16F2MLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, and sensor interface applications requiring stable component supply, long lifecycle assurance, and automotive-grade qualification.

Supply support for S9S08DZ16F2MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Freescale's embedded controller heritage.

The S9S08DZ16F2MLC belongs to the HCS08 DZ family - engineered specifically for cost-sensitive, ASIL-B-capable automotive subsystems demanding CAN, LIN, robust analog sensing, and ultra-low-power operation.

FAQ

What is the maximum bus frequency supported by the S9S08DZ16F2MLC?

The S9S08DZ16F2MLC supports a maximum bus frequency of 20 MHz, derived from its 40-MHz HCS08 CPU core operating at double-speed instruction execution. This timing enables deterministic real-time response in automotive control loops and meets timing requirements for MSCAN bit rates up to 1 Mbps and SCI baud rates up to 115.2 kbps. The actual bus speed depends on MCG configuration and external clock source selection.

Does the S9S08DZ16F2MLC include a hardware CAN controller?

Yes, the S9S08DZ16F2MLC integrates a Freescale Controller Area Network (MSCAN) module compliant with CAN protocol version 2.0A and 2.0B. It supports standard and extended data frames, remote frames, five receive buffers with FIFO storage, and programmable identifier filtering (2×32-bit, 4×16-bit, or 8×8-bit). No external CAN controller is required for basic node implementation.

What are the memory resources available on the S9S08DZ16F2MLC?

The S9S08DZ16F2MLC provides 16 KB of on-chip Flash memory for program storage, 2 KB of EEPROM for nonvolatile data retention (with 4- or 8-byte erase granularity), and 4 KB of RAM for runtime variables and stack. Flash and EEPROM support in-circuit programming and erasure across full operating voltage and temperature ranges, enabling field firmware updates and parameter logging.

Can the S9S08DZ16F2MLC operate from an internal clock source only?

Yes, the S9S08DZ16F2MLC can operate using its internal reference clock (IRC), which is factory-trimmed and stored in Flash. The Multi-Purpose Clock Generator (MCG) supports FLL mode with internal reference, allowing full functionality-including MSCAN and SCI-without external crystals or resonators. However, CAN bit-rate accuracy requires tighter timing tolerance, so external crystal is recommended for CAN-heavy applications.

Is the S9S08DZ16F2MLC pin-compatible with other devices in the MC9S08DZ60 series?

The S9S08DZ16F2MLC shares the same 48-pin LQFP package and pinout as S9S08DZ32F2MLC and S9S08DZ48F2MLC, making it hardware-compatible within that package variant. It is not pin-compatible with the 64-pin or 32-pin variants of the DZ series. Firmware built for S9S08DZ16F2MLC will run on higher-memory variants without modification, subject to memory map alignment.

S9S08DZ16F2MLC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
25
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08DZ16F2MLC FAQ

1.How can I place an order for S9S08DZ16F2MLC through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08DZ16F2MLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08DZ16F2MLC reliable?

The price and inventory of S9S08DZ16F2MLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ16F2MLC is usually 5 days.

3.What payment methods are accepted for S9S08DZ16F2MLC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DZ16F2MLC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08DZ16F2MLC?

S9S08DZ16F2MLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08DZ16F2MLC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08DZ16F2MLC?

For technical support, including S9S08DZ16F2MLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ16F2MLC requirements.

6.How does Aetrix verify that S9S08DZ16F2MLC is sourced from the original manufacturer or authorized distributors?

All S9S08DZ16F2MLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ16F2MLC meets industry standards.

7.What is the process for return or replacement of S9S08DZ16F2MLC?

All S9S08DZ16F2MLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ16F2MLC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08DZ16F2MLC part is unused and in its original packaging.

Return procedure for S9S08DZ16F2MLC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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