Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors S9S08DZ16F2MLF

Part No.:
S9S08DZ16F2MLF
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixS9S08DZ16F2MLF.pdf
Description:
IC MCU 8BIT 16KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,300

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S9S08DZ16F2MLF from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller designed for automotive and industrial embedded control. It features a 40-MHz CPU core (20-MHz bus), 16 KB on-chip Flash, 2 KB EEPROM, and 4 KB RAM. Integrated peripherals include MSCAN v2.0B, dual SCI with LIN 2.0 support, 24-channel 12-bit ADC, two analog comparators, and RTC - enabling use in body control modules and sensor interface units.

For engineers reviewing the S9S08DZ16F2MLF datasheet, S9S08DZ16F2MLF pinout, S9S08DZ16F2MLF application, or S9S08DZ16F2MLF equivalent, key selection criteria include CAN 2.0B compliance, in-circuit programmable EEPROM with 4-byte dual-page erase, real-time interrupt wake-up from Stop3 mode, and single-wire background debug interface for space-constrained automotive ECUs.

Technical Context

The S9S08DZ16F2MLF implements the HCS08 CPUV3 core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with ±1.5% FLL accuracy using factory-trimmed internal reference and optional external crystal (1–16 MHz).

On-chip memory includes 16 KB Flash with block protection and security features, 2 KB EEPROM supporting program/erase while executing Flash, and 4 KB RAM. Peripheral integration centers on automotive-grade functions: MSCAN with five receive buffers and flexible identifier filtering, dual SCI with LIN 2.0 and SAE J2602 compliance, and 12-bit ADC with temperature sensor and internal bandgap reference.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core HCS08 CPUV3 running at 40 MHz (20 MHz bus); executes HC08 ISA with BGND instruction for debug entry.
Flash Memory 16 KB on-chip Flash with read/program/erase over full voltage/temperature range; supports block protection and security.
EEPROM 2 KB in-circuit programmable EEPROM; 4-byte dual-page or 8-byte single-page erase sectors; program/erase while executing Flash.
ADC 24-channel, 12-bit resolution ADC with 2.5 µs conversion time; includes temperature sensor and internal bandgap reference channel.
MSCAN Freescale Controller Area Network module compliant with CAN 2.0A/B; supports standard/extended frames, remote frames, and five FIFO receive buffers.
Package 48-pin LQFP (7×7 mm); RoHS-compliant; lead-free; moisture sensitivity level 3 (MSL3).
Operating Voltage 2.7 V to 5.5 V supply range; supports automotive battery transient conditions without external regulation.

Pinout & Package

48-pin low-profile quad flat-pack (LQFP), 7×7 mm body, 0.5 mm pitch. Pinout validated per MC9S08DZ60 Series Data Sheet Rev. 4 (2008), Section 2.1 "Device Pin Assignment" - applies identically to S9S08DZ16F2MLF as member of MC9S08DZ16 family.

Pin/Terminal Circuit Role Design Meaning
VDD, VDDA, VDDAD Power supply inputs Separate digital (VDD), analog (VDDA), and ADC (VDDAD) supplies enable noise isolation for mixed-signal operation.
VSS, VSSA, VSSAD Ground returns Dedicated ground pins per domain minimize coupling between digital switching noise and analog/ADC paths.
XTAL, EXTAL Crystal oscillator terminals Support 1–16 MHz crystal or ceramic resonator; connect to MCG for precision clock generation.
BKGD/MS Background debug / mode select Single-wire debug interface pin; also selects boot mode during reset; requires weak pull-up for normal operation.
RESET Active-low reset input Asynchronous reset assertion clears CPU registers and initializes peripherals; supports external watchdog or power-on reset circuits.
CANH, CANL CAN bus differential pair Direct connection to ISO 11898-2 compliant transceiver; integrated CAN controller handles protocol framing and error handling.
SCI1_TX, SCI1_RX UART transmit/receive Full-duplex NRZ serial interface supporting LIN 2.0 master/slave and SAE J2602; includes extended break generation/detection.

Key Features

Feature Design Value
Real-time interrupt wake-up from Stop3 Enables ultra-low-power sleep (sub-1 µA) with precise periodic wake-up using on-chip 1 kHz oscillator - no external crystal required.
In-circuit programmable EEPROM 2 KB EEPROM supports field firmware updates and parameter storage with 4-byte granularity and erase abort capability.
MSCAN with flexible ID filtering Five receive buffers + programmable filters (2×32-bit, 4×16-bit, or 8×8-bit) reduce CPU overhead in multi-node CAN networks.
Temperature sensor + bandgap reference Integrated 12-bit ADC channel with calibrated temperature sensor and internal 1.2 V bandgap reference enables self-monitoring without external components.
Single-wire background debug Reduces debug footprint to one pin (BKGD/MS); supports full ICE functionality including real-time bus capture and non-intrusive breakpoints.

Applications

Body Control Module (BCM) Door Module Control

Use Scenario: Centralized control of lighting, window lifts, mirror adjustment, and door lock actuators in passenger vehicles.

IC Role / Device Role / Timing Role: Main system controller coordinating CAN messaging, PWM motor drive, and analog sensor feedback.

Use Value: MSCAN v2.0B ensures interoperability with vehicle-wide CAN network; 24-channel ADC monitors potentiometers, thermistors, and current sense resistors.

Use Scenario: Localized control unit inside vehicle door managing window regulator, power lock, and side mirror positioning.

IC Role / Device Role / Timing Role: Standalone node executing local actuator control while communicating status via CAN to BCM.

Use Value: Real-time interrupt wake-up from Stop3 enables <1 µA standby current; dual SCI supports LIN slave communication for mirror position feedback.

Engine Coolant Temperature Sensor Interface Seat Occupancy Detection System

Use Scenario: Signal conditioning and linearization of NTC thermistor output for engine management systems.

IC Role / Device Role / Timing Role: Analog front-end processor converting thermistor voltage to calibrated temperature value for CAN broadcast.

Use Value: Integrated 12-bit ADC with internal bandgap reference eliminates need for external voltage reference; temperature sensor enables self-calibration.

Use Scenario: Capacitive sensing interface for detecting occupant presence and weight classification in automotive seats.

IC Role / Device Role / Timing Role: Signal acquisition and preprocessing unit feeding digitized capacitance data to main airbag ECU.

Use Value: Two analog comparators with selectable edge-triggered interrupts detect rapid capacitance changes; 2 KB EEPROM stores calibration offsets per seat position.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08DZ32F2MLF 32 KB Flash, same package and peripheral set; identical pinout and register map. Supports larger firmware images and more complex state machines without changing PCB layout. Select when future firmware growth or additional diagnostic features require >16 KB code space.
SPC560B50L5 32-bit Power Architecture core, 512 KB Flash, CAN FD, higher performance but larger footprint (64-pin LQFP). Targets next-generation ECUs requiring CAN FD, ASIL-B compliance, and faster signal processing. Choose for new designs needing functional safety certification or migration path beyond 8-bit constraints.

Compared with MC9S08DZ32F2MLF, S9S08DZ16F2MLF offers identical peripheral functionality at lower Flash density and cost; versus SPC560B50L5, it delivers proven 8-bit reliability in legacy-compatible footprints but lacks CAN FD and ASIL support.

Availability

S9S08DZ16F2MLF is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and CAN-based control systems requiring stable component supply across extended product lifecycles.

Supply support for S9S08DZ16F2MLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division; it acquired Freescale Semiconductor in 2015, integrating its automotive MCU portfolio.

The S9S08DZ16F2MLF belongs to the legacy HCS08 DZ-series, designed specifically for cost-sensitive, high-reliability automotive body control applications with CAN, LIN, and mixed-signal integration requirements.

FAQ

What is the maximum operating frequency of the S9S08DZ16F2MLF CPU core?

The S9S08DZ16F2MLF features an HCS08 CPUV3 core rated for up to 40 MHz operation, delivering a 20 MHz bus clock. This frequency is supported across the full specified voltage range (2.7–5.5 V) and temperature range (−40°C to +125°C), making it suitable for under-hood automotive environments where thermal stability is critical. The S9S08DZ16F2MLF achieves this performance using the on-chip Multi-Purpose Clock Generator with FLL or PLL modes.

Does the S9S08DZ16F2MLF support CAN 2.0B protocol?

Yes, the S9S08DZ16F2MLF integrates the Freescale Controller Area Network (MSCAN) module compliant with ISO 11898-1 CAN 2.0B specification. It supports both standard (11-bit) and extended (29-bit) identifiers, remote transmission requests, and five receive buffers with configurable acceptance filters. This capability is confirmed in the MC9S08DZ60 Series Data Sheet Rev. 4, which explicitly covers the S9S08DZ16F2MLF as a family member.

What is the EEPROM endurance and retention specification for the S9S08DZ16F2MLF?

The S9S08DZ16F2MLF provides 2 KB of in-circuit programmable EEPROM with guaranteed endurance of 100,000 erase/write cycles and data retention of 10 years at +85°C (or 20 years at +25°C). Erase operations are performed in 4-byte dual-page or 8-byte single-page sectors, and erase abort functionality allows interruption without data corruption - critical for robust firmware update routines in automotive applications.

Can the S9S08DZ16F2MLF operate from a 3.3 V supply?

Yes, the S9S08DZ16F2MLF operates across a supply voltage range of 2.7 V to 5.5 V, fully supporting 3.3 V nominal systems. All I/O pins are 5 V tolerant when configured as inputs, and internal regulators ensure stable core and analog operation at 3.3 V. This flexibility allows direct interfacing with 3.3 V sensors and communication transceivers without level-shifting circuitry.

Is the S9S08DZ16F2MLF pin-compatible with other devices in the MC9S08DZxx series?

Yes, the S9S08DZ16F2MLF in the 48-pin LQFP package shares identical pinout, electrical characteristics, and register mapping with MC9S08DZ32F2MLF and MC9S08DZ48F2MLF. This allows hardware reuse across variants - for example, a single PCB can support 16 KB, 32 KB, or 48 KB Flash versions by changing only the programmed firmware and part marking, simplifying inventory and design scalability.

S9S08DZ16F2MLF Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
48-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08DZ16F2MLF FAQ

1.How can I place an order for S9S08DZ16F2MLF through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08DZ16F2MLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08DZ16F2MLF reliable?

The price and inventory of S9S08DZ16F2MLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ16F2MLF is usually 5 days.

3.What payment methods are accepted for S9S08DZ16F2MLF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DZ16F2MLF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08DZ16F2MLF?

S9S08DZ16F2MLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08DZ16F2MLF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08DZ16F2MLF?

For technical support, including S9S08DZ16F2MLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ16F2MLF requirements.

6.How does Aetrix verify that S9S08DZ16F2MLF is sourced from the original manufacturer or authorized distributors?

All S9S08DZ16F2MLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ16F2MLF meets industry standards.

7.What is the process for return or replacement of S9S08DZ16F2MLF?

All S9S08DZ16F2MLF units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ16F2MLF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08DZ16F2MLF part is unused and in its original packaging.

Return procedure for S9S08DZ16F2MLF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S9S08DZ16F2MLF Tags

  • S9S08DZ16F2MLF
  • S9S08DZ16F2MLF PDF
  • S9S08DZ16F2MLF Datasheet
  • S9S08DZ16F2MLF Specifications
  • S9S08DZ16F2MLF Images
  • NXP Semiconductors
  • NXP Semiconductors S9S08DZ16F2MLF
  • Buy S9S08DZ16F2MLF
  • S9S08DZ16F2MLF Price
  • S9S08DZ16F2MLF Distributor
  • S9S08DZ16F2MLF Supplier
  • S9S08DZ16F2MLF Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER