NXP Semiconductors S9S08DZ32F2MLC
- Part No.:
- S9S08DZ32F2MLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S08DZ32F2MLC.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08DZ32F2MLC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip flash, 2 KB EEPROM, and 4 KB RAM, operating at up to 40 MHz CPU / 20 MHz bus frequency. It integrates MSCAN (CAN 2.0A/B), dual SCI with LIN 2.0 support, 12-bit ADC (24-channel, 2.5 µs conversion), two analog comparators, RTC, and six-channel TPM - targeted for automotive body electronics and industrial control nodes.
For engineers reviewing the S9S08DZ32F2MLC datasheet, S9S08DZ32F2MLC pinout, S9S08DZ32F2MLC application, or S9S08DZ32F2MLC equivalent, key selection criteria include CAN protocol compliance, in-circuit programmable EEPROM with erase abort, real-time interrupt wake-up from Stop3 mode, and single-wire background debug interface compatibility with standard HCS08 development tools.
Technical Context
The S9S08DZ32F2MLC implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with factory-trimmed internal reference and ±1.5% FLL accuracy over temperature.
On-chip peripherals include a full-featured MSCAN module with five receive buffers and flexible identifier filtering (2×32-bit/4×16-bit/8×8-bit), dual SCIs compliant with SAE J2602 and LIN 2.0, and a 12-bit ADC with integrated temperature sensor and automatic compare function - all accessible via 53 GPIO pins with configurable slew rate, drive strength, and hysteresis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core, 40-MHz max operation (20-MHz bus), BGND instruction support |
| Flash Memory | 32 KB on-chip flash with read/program/erase across full voltage/temperature range |
| EEPROM | 2 KB in-circuit programmable EEPROM; 8-byte single-page or 4-byte dual-page erase sectors |
| RAM | 4 KB on-chip RAM for data and stack storage |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B); supports standard/extended frames and remote frames |
| ADC | 24-channel, 12-bit SAR ADC with 2.5 µs conversion time, internal bandgap reference, and temperature sensor channel |
| Debug Interface | Single-wire background debug (BDM) interface compatible with standard HCS08 debug tools |
Pinout & Package
Package: 48-pin LQFP (7×7 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5.0 V supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) with separate decoupling requirements |
| XTAL, EXTAL | Crystal oscillator input/output | Supports 1–16 MHz crystal or ceramic resonator; connects to internal Pierce oscillator circuit |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication and chip mode configuration during reset assertion |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; triggers COP, LVD, and illegal opcode recovery paths |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with interrupt capability, configurable pull devices, and optional peripheral multiplexing (e.g., SCI0, TPM1) |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port supporting MSCAN TX/RX, ADC inputs, and TPM2 channels; includes dedicated CAN bus pins |
| PTC0–PTC7 | Port C general-purpose I/O | 8-bit port with RTC, IIC, and SPI signal routing options; supports external interrupt on all pins |
| PTD0–PTD7 | Port D general-purpose I/O | 8-bit port with ADC channel mapping, comparator inputs, and SCI1 functionality |
| PTE0–PTE7 | Port E general-purpose I/O | 8-bit port supporting TPM1, SPI, and analog comparator outputs; includes dedicated RTC crystal pins (RTCCLK, RTCOSC) |
| VREFH, VREFL | Analog reference high/low | Defines ADC input voltage range; accepts external reference or connects to internal bandgap (1.25 V typical) |
Key Features
| Feature | Design Value |
|---|---|
| Real-time interrupt wake-up | Low-power RTC runs from 1-kHz internal oscillator during Stop3 mode, enabling cyclic wake-up without external components |
| In-system programmable EEPROM | 2 KB EEPROM supports field firmware updates and parameter storage with 8-byte sector erase and erase abort capability |
| CAN 2.0A/B compliance | MSCAN module meets ISO 11898-1 physical layer timing and protocol requirements for automotive network nodes |
| Temperature-aware ADC | Integrated temperature sensor channel enables thermal monitoring without external components; calibrated against internal bandgap reference |
| Multi-mode power management | Two very low-power Stop modes (Stop2/Stop3), reduced-power Wait mode, and real-time interrupt wake-up from all states |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized control of lighting, window lifts, mirror adjustment, and door lock actuators in passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing CAN message handling, PWM motor control, and analog sensor acquisition (e.g., ambient light, temperature). Use Value: Integrated MSCAN ensures deterministic communication with vehicle network; 32 KB flash accommodates layered firmware with diagnostics and calibration tables. | Use Scenario: Localized control unit inside vehicle door housing switches, motors, and sensors. IC Role / Device Role / Timing Role: Real-time actuator driver with LIN slave interface to BCM and local ADC monitoring of switch status and motor current. Use Value: Dual SCI with LIN 2.0 compliance enables cost-effective sub-networking; 2 KB EEPROM stores door position learning and anti-pinch calibration data. |
| Industrial Motor Starter | Smart HVAC Actuator |
Use Scenario: Compact starter unit for 3-phase AC induction motors in pump/compressor systems. IC Role / Device Role / Timing Role: Safety-monitored controller managing contactor sequencing, thermal shutdown, and fault reporting via CAN. Use Value: COP watchdog with backup 1-kHz clock ensures fail-safe reset under brownout; low-voltage detect interrupts enable graceful shutdown before undervoltage lockout. | Use Scenario: Position-controlled damper actuator in commercial HVAC ductwork with feedback and environmental sensing. IC Role / Device Role / Timing Role: Closed-loop position controller using TPM PWM output, ADC for potentiometer feedback, and temperature-compensated RTC for scheduling. Use Value: 12-bit ADC with 24-channel mux supports multi-sensor input (position, temp, humidity); RTC with external crystal enables precise time-of-day scheduling of ventilation cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ48F2MLC | 48 KB flash, same package and peripheral set; higher memory headroom for complex CAN gateway logic | Preferred where bootloader, OTA update partition, or extended diagnostic routines require >32 KB code space | Select when firmware growth projection exceeds 32 KB or dual CAN message buffering is required |
| S9S08DZ16F2MLC | 16 KB flash, identical core/peripherals/package; reduced memory footprint and lower cost | Suitable for simple sensor nodes or single-function actuators with minimal firmware | Choose for cost-sensitive applications with static firmware and no field update requirement |
Compared with MC9S08DZ48F2MLC and S9S08DZ16F2MLC, the S9S08DZ32F2MLC delivers optimal balance of memory capacity, CAN performance, and thermal robustness for mid-tier automotive body controllers - avoiding flash overhead while retaining sufficient space for ASAM-compliant diagnostics and EEPROM-based calibration storage.
Availability
S9S08DZ32F2MLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control, smart HVAC systems, and CAN-based embedded networks requiring stable component supply across extended product lifecycles.
Supply support for S9S08DZ32F2MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08DZ32F2MLC belongs to the HCS08 DZ-series microcontrollers, designed specifically for cost-sensitive, safety-aware automotive body electronics requiring CAN, LIN, and robust analog integration in compact LQFP packages.
FAQ
What is the maximum operating frequency of the S9S08DZ32F2MLC CPU core?
The S9S08DZ32F2MLC CPU core operates at up to 40 MHz, with a corresponding 20-MHz bus frequency. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, supported by either external crystal (1–16 MHz) or internal reference. The S9S08DZ32F2MLC datasheet specifies this performance across the full industrial temperature range (–40°C to +105°C) and 4.5–5.5 V supply.
Does the S9S08DZ32F2MLC support CAN FD or only classical CAN?
The S9S08DZ32F2MLC supports only classical CAN per ISO 11898-1 (CAN 2.0A/B), not CAN FD. Its MSCAN module implements standard and extended data frames up to 8 bytes per frame, with five receive buffers and programmable identifier filters. CAN FD features such as variable bit rates and payloads >8 bytes are absent - confirmed by the MC9S08DZ60 Series Data Sheet Rev. 4, Section 12.
How much EEPROM is integrated into the S9S08DZ32F2MLC and what are its erase characteristics?
The S9S08DZ32F2MLC integrates 2 KB of in-circuit programmable EEPROM. Erase operations are performed in 8-byte single-page or 4-byte dual-page sectors, with full erase abort capability. The S9S08DZ32F2MLC supports simultaneous program/erase while executing flash code, enabling reliable data logging and firmware parameter updates without halting application execution.
What debug interface does the S9S08DZ32F2MLC use and is it compatible with modern tools?
The S9S08DZ32F2MLC uses a single-wire background debug (BDM) interface compliant with the HCS08 standard. It is fully supported by legacy P&E Micro Cyclone PRO and newer NXP S32DS-compatible debug probes via BDM-to-SWD bridge firmware. The S9S08DZ32F2MLC requires no external debug header - BKGD/MS pin serves as the sole debug connection point.
What is the ADC resolution and conversion speed of the S9S08DZ32F2MLC?
The S9S08DZ32F2MLC features a 12-bit successive approximation register (SAR) ADC with 24 input channels and a minimum conversion time of 2.5 µs. It includes an internal temperature sensor channel and selectable internal bandgap reference (1.25 V). The S9S08DZ32F2MLC ADC supports hardware-triggered conversions, automatic compare functions, and operation in Wait and Stop3 modes - all verified in the MC9S08DZ60 Series Data Sheet Rev. 4, Chapter 10.
S9S08DZ32F2MLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1K x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DZ32F2MLC FAQ
1.How can I place an order for S9S08DZ32F2MLC through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DZ32F2MLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DZ32F2MLC reliable?
The price and inventory of S9S08DZ32F2MLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ32F2MLC is usually 5 days.
3.What payment methods are accepted for S9S08DZ32F2MLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DZ32F2MLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08DZ32F2MLC?
S9S08DZ32F2MLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08DZ32F2MLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08DZ32F2MLC?
For technical support, including S9S08DZ32F2MLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ32F2MLC requirements.
6.How does Aetrix verify that S9S08DZ32F2MLC is sourced from the original manufacturer or authorized distributors?
All S9S08DZ32F2MLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ32F2MLC meets industry standards.
7.What is the process for return or replacement of S9S08DZ32F2MLC?
All S9S08DZ32F2MLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ32F2MLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DZ32F2MLC part is unused and in its original packaging.
Return procedure for S9S08DZ32F2MLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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