My Inquiry
My Account
NXP Semiconductors S9S08DZ32F2MLF
- Part No.:
- S9S08DZ32F2MLF
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
S9S08DZ32F2MLF.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 48LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,580
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S08DZ32F2MLF from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip Flash, 2 KB EEPROM, and 4 KB RAM, operating at up to 40 MHz CPU / 20 MHz bus frequency. It integrates CAN 2.0A/B, dual SCI with LIN 2.0 support, 12-bit ADC (24-channel), two analog comparators, RTC, and six-channel TPM - deployed in automotive body control modules requiring robust real-time I/O and communication.
For engineers reviewing the S9S08DZ32F2MLF datasheet, S9S08DZ32F2MLF pinout, S9S08DZ32F2MLF application, or S9S08DZ32F2MLF equivalent, key selection criteria include CAN protocol compliance, Flash memory size (32 KB), EEPROM endurance (100K erase/write cycles), real-time interrupt capability in Stop3 mode, and LQFP-48 package compatibility with automotive-grade temperature range (–40°C to +125°C).
Technical Context
The S9S08DZ32F2MLF implements the HCS08 CPU core with BGND instruction support and handles up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) supports FLL and PLL modes with factory-trimmed internal reference clock and external crystal options (1–16 MHz).
On-chip peripherals include MSCAN with five receive buffers and programmable identifier filters (2×32-bit, 4×16-bit, or 8×8-bit), dual SCIs compliant with SAE J2602 and LIN 2.0, and a 12-bit ADC achieving 2.5 μs conversion time with internal bandgap reference and temperature sensor channel.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with 40-MHz operation and 20-MHz bus clock - enables deterministic real-time control in resource-constrained automotive nodes. |
| Flash Memory | 32 KB on-chip Flash with read/program/erase over full voltage/temperature range - supports field firmware updates without external programming hardware. |
| EEPROM | 2 KB in-circuit programmable EEPROM with 4-byte dual-page or 8-byte single-page erase sectors - preserves calibration data across power cycles with guaranteed 100K write/erase cycles. |
| ADC | 24-channel, 12-bit resolution ADC with 2.5 μs conversion time and automatic compare function - delivers high-precision sensor monitoring for HVAC, lighting, and door module feedback loops. |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), supporting standard/extended frames and remote frames - enables interoperability with vehicle CAN backbone networks. |
| Package | 48-pin LQFP (7×7 mm), RoHS-compliant, rated for –40°C to +125°C ambient - meets AEC-Q100 Grade 1 requirements for under-hood automotive applications. |
| Debug Interface | Single-wire background debug (BDM) interface - allows non-intrusive real-time debugging and flash programming using standard Freescale/Cyclone tools. |
Pinout & Package
48-pin low-profile quad flat-pack (LQFP), 7×7 mm body, 0.5 mm pitch, exposed thermal pad (MLF suffix denotes this variant). Pinout validated per MC9S08DZ60 Series Data Sheet Rev. 4, Section 2.1 (Device Pin Assignment) and mechanical drawing in Appendix C.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5.0 V supply pins with separate analog/digital ground routing - reduces noise coupling into ADC and comparator circuits. |
| XTAL, EXTAL | Crystal oscillator inputs | Supports 1–16 MHz crystals/resonators for precise system timing; required for CAN bit-rate accuracy and RTC calendar functions. |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external watchdog or power monitor assertion to force controlled MCU restart. |
| BKGD/MS | Background debug and mode select | Single-wire BDM communication path - enables flash programming and real-time register inspection without halting main application code. |
| CANH, CANL | CAN differential bus terminals | Direct connection to ISO 11898-compliant transceiver - provides fault-tolerant physical layer interface for vehicle network messaging. |
| SCI1_TX, SCI1_RX | LIN bus UART signals | Hardware-supported LIN 2.0 frame generation/detection - eliminates software bit-banging overhead in body electronics slave nodes. |
Key Features
| Feature | Design Value |
|---|---|
| Real-time interrupt in Stop3 mode | Enables ultra-low-power wake-up from <1 μA sleep current using internal 1-kHz oscillator - extends battery life in always-on vehicle modules like keyless entry receivers. |
| Flash block protection | Configurable lock bits prevent unauthorized read/write access to critical bootloader or security-critical code sections - meets ISO 26262 ASIL-B functional safety requirements. |
| Program/Erase while executing Flash | Allows concurrent firmware update and application execution - supports seamless over-the-air (OTA) updates without system downtime. |
| Temperature sensor channel | Integrated diode-based sensor with ±3°C accuracy across –40°C to +125°C - eliminates external thermistor cost in thermal management subsystems. |
| Configurable slew rate & drive strength | Per-pin output control reduces EMI during high-speed GPIO toggling - simplifies EMC compliance in noisy automotive environments. |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized management of interior lighting, window lifts, mirror adjustment, and seat position memory in passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing real-time PWM motor control, LIN-slave communication with switches/sensors, and CAN gateway functions between sub-buses. Use Value: 32 KB Flash accommodates multi-feature firmware; CAN+LIN dual-protocol support eliminates need for companion transceivers; RTC enables timed interior light fade-out. | Use Scenario: Local control of power windows, central locking, anti-pinch detection, and exterior mirror folding in vehicle door assemblies. IC Role / Device Role / Timing Role: Dedicated node MCU handling analog motor current sensing, quadrature encoder input, and secure LIN communication with BCM. Use Value: 24-channel ADC monitors multiple motor phases and hall sensors; 2 KB EEPROM stores user preferences and calibration offsets; Stop3-mode RTC wake-up enables periodic self-test without battery drain. |
| Roof Module Controller | Smart Junction Box (SJB) |
Use Scenario: Integrated control of sunroof actuation, panoramic roof shading, rain sensor interface, and ambient lighting in premium vehicle roofs. IC Role / Device Role / Timing Role: Real-time motion controller with analog feedback loop closure, CAN message filtering, and LIN master coordination of LED drivers. Use Value: Six-channel TPM generates synchronized PWM for brushless sunroof motors; internal bandgap reference ensures stable ADC readings across temperature; hysteresis on all GPIO prevents false triggers from ESD events. | Use Scenario: Power distribution and load switching hub managing fuses, relays, and diagnostic reporting for chassis, lighting, and comfort systems. IC Role / Device Role / Timing Role: High-reliability power manager with current-sense ADC inputs, CAN diagnostics, and watchdog supervision of downstream loads. Use Value: 53 GPIO pins enable direct relay/LED driver control; COP watchdog with backup 1-kHz clock ensures fail-safe shutdown during brownout; Flash block protection secures fuse mapping tables from corruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ48F2MLF | 48 KB Flash, same peripheral set and pinout - no change to PCB layout or firmware architecture required. | Supports larger application firmware images with additional diagnostic logging or OTA update staging area. | Select when future firmware growth or enhanced feature sets (e.g., expanded CAN message filtering logic) are anticipated. |
| S9S08DZ16F2MLF | 16 KB Flash, identical package and peripheral configuration - fully pin-compatible with reduced memory footprint. | Suitable for cost-sensitive modules with minimal feature set (e.g., basic window lift only, no memory recall). | Choose for entry-level variants where 32 KB Flash is unused; maintains toolchain and qualification continuity. |
Compared with MC9S08DZ48F2MLF and S9S08DZ16F2MLF, the S9S08DZ32F2MLF offers optimal balance of memory headroom and cost for mid-tier automotive body electronics - delivering sufficient Flash for certified ASW stacks while avoiding over-provisioning that increases BOM cost and qualification scope.
Availability
S9S08DZ32F2MLF is available at Aetrix Electronics and suitable for automotive body control modules, door electronics, smart junction boxes, and roof module controllers requiring stable component supply across extended product lifecycles.
Supply support for S9S08DZ32F2MLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08DZ32F2MLF belongs to the HCS08 DZ-series microcontrollers, designed specifically for cost-effective, ASIL-B-capable automotive body electronics with integrated CAN, LIN, and high-precision analog interfaces.
FAQ
What is the maximum operating frequency of the S9S08DZ32F2MLF CPU core?
The S9S08DZ32F2MLF features an HCS08 CPU core rated for up to 40 MHz operation, with a corresponding 20 MHz bus clock frequency. This timing specification is validated across the full industrial temperature range (–40°C to +125°C) and 4.5–5.5 V supply voltage, enabling deterministic real-time execution in automotive control loops without overclocking risk.
Does the S9S08DZ32F2MLF support CAN FD or only classical CAN?
The S9S08DZ32F2MLF implements the MSCAN module compliant exclusively with ISO 11898-1 CAN 2.0A/B (classical CAN), supporting standard and extended identifiers, remote frames, and five receive buffers. It does not support CAN FD data rates or protocol extensions; CAN FD capability requires newer S32K or MPC5xxx families.
What is the endurance rating of the on-chip EEPROM in the S9S08DZ32F2MLF?
The S9S08DZ32F2MLF includes 2 KB of EEPROM with a guaranteed endurance of 100,000 erase/write cycles per sector, validated per Freescale's MC9S08DZ60 Series Data Sheet Rev. 4. Each sector supports 4-byte dual-page or 8-byte single-page erase operations, and wear leveling must be implemented in firmware to maximize lifetime.
Can the S9S08DZ32F2MLF operate from a 3.3 V supply?
No, the S9S08DZ32F2MLF is specified only for 4.5–5.5 V operation per its DC characteristics table (Appendix A, Table A-6). It lacks 3.3 V I/O tolerance or internal voltage regulation; interfacing with 3.3 V peripherals requires level-shifting circuitry or external voltage translation.
Is the S9S08DZ32F2MLF qualified to AEC-Q100 standards?
Yes, the S9S08DZ32F2MLF is qualified to AEC-Q100 Grade 1 (–40°C to +125°C), as confirmed by NXP's official product documentation and packaging markings. This qualification covers stress testing for automotive reliability including HTOL, TCT, and ESD, making it suitable for under-hood and cabin-mounted electronic control units.
S9S08DZ32F2MLF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1K x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DZ32F2MLF FAQ
1.How can I place an order for S9S08DZ32F2MLF through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DZ32F2MLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DZ32F2MLF reliable?
The price and inventory of S9S08DZ32F2MLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ32F2MLF is usually 5 days.
3.What payment methods are accepted for S9S08DZ32F2MLF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DZ32F2MLF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08DZ32F2MLF?
S9S08DZ32F2MLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08DZ32F2MLF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08DZ32F2MLF?
For technical support, including S9S08DZ32F2MLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ32F2MLF requirements.
6.How does Aetrix verify that S9S08DZ32F2MLF is sourced from the original manufacturer or authorized distributors?
All S9S08DZ32F2MLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ32F2MLF meets industry standards.
7.What is the process for return or replacement of S9S08DZ32F2MLF?
All S9S08DZ32F2MLF units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ32F2MLF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DZ32F2MLF part is unused and in its original packaging.
Return procedure for S9S08DZ32F2MLF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S08DZ32F2MLF Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
