My Inquiry
My Account
NXP Semiconductors S9S08DZ32F2MLH
- Part No.:
- S9S08DZ32F2MLH
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
S9S08DZ32F2MLH.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 64LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,708
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S08DZ32F2MLH from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip Flash, 2 KB EEPROM, and 4 KB RAM, operating at up to 40 MHz CPU / 20 MHz bus frequency. It integrates CAN 2.0A/B, dual SCI with LIN 2.0 support, 12-bit 24-channel ADC, two analog comparators, RTC, and six-channel TPM - deployed in automotive body control modules requiring robust real-time I/O and communication.
For engineers reviewing the S9S08DZ32F2MLH datasheet, S9S08DZ32F2MLH pinout, S9S08DZ32F2MLH application, or S9S08DZ32F2MLH equivalent, key selection criteria include CAN protocol compliance, in-circuit programmable EEPROM with sector erase, single-wire background debug interface, and low-power stop modes with RTC wake-up capability.
Technical Context
The S9S08DZ32F2MLH implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with factory-trimmed internal reference and external crystal/resonator options (31.25 kHz–16 MHz).
On-chip peripherals include MSCAN with five receive buffers and flexible identifier filtering (2×32-bit/4×16-bit/8×8-bit), dual SCIs with LIN 2.0 and SAE J2602 compliance, and a 12-bit ADC with 2.5 μs conversion time, temperature sensor, and automatic compare function.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with 40-MHz operation and 20-MHz bus - enables deterministic real-time control in resource-constrained automotive ECUs. |
| Flash Memory | 32 KB on-chip Flash with read/program/erase over full voltage/temperature range - supports field firmware updates without external programming hardware. |
| EEPROM | 2 KB in-circuit programmable EEPROM with 8-byte single-page or 4-byte dual-page erase sectors - retains calibration data across power cycles with high endurance. |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), supporting standard/extended frames and remote frames - enables direct integration into vehicle CAN networks. |
| ADC | 24-channel, 12-bit SAR ADC with 2.5 μs conversion time and internal bandgap reference - delivers high-resolution sensor acquisition for battery monitoring or climate control. |
| Power Modes | Two very low-power stop modes (Stop2/Stop3), reduced-power wait mode, and RTC-driven wake-up - extends battery life in always-on automotive modules. |
| Debug Interface | Single-wire background debug (BDM) interface - allows non-intrusive debugging and flash programming using standard Freescale/NXP BDM tools. |
Pinout & Package
Package: 48-pin LQFP (7×7 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5.0 V supply pins per functional domain - decoupling required per datasheet layout guidelines to ensure noise immunity in automotive environments. |
| XTAL, EXTAL | Crystal oscillator inputs | Connects to 31.25 kHz–16 MHz crystal or ceramic resonator - enables precise timing for CAN bit rate accuracy and RTC operation. |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication and reset-triggered mode entry - eliminates need for dedicated JTAG header in production PCBs. |
| CANL, CANH | CAN differential bus terminals | Direct connection to ISO 11898-compliant CAN transceiver - requires external termination and common-mode choke per automotive EMC requirements. |
| SCI1_TX, SCI1_RX | LIN/UART serial interface | Supports LIN 2.0 master/slave operation with extended break generation/detection - used for body electronics sub-networks (e.g., door modules, seat controls). |
Key Features
| Feature | Design Value |
|---|---|
| Programmable Flash Security | Block protection and security byte prevent unauthorized read-out of firmware - meets OEM requirements for intellectual property protection in Tier-1 ECU designs. |
| Low-Voltage Detection | Selectable trip points with reset or interrupt output - ensures safe shutdown during brown-out conditions in 12 V automotive systems. |
| Real-Time Counter (RTC) | 8-bit modulus counter with external crystal or internal 1 kHz oscillator - enables time-of-day tracking and cyclic wake-up without external RTC IC. |
| Configurable I/O Drive Strength | Adjustable slew rate and output drive on all GPIO - reduces EMI and improves signal integrity when driving capacitive loads like LED drivers or relays. |
| ADC Temperature Sensor | Integrated die-temperature sensor with ±5°C accuracy - enables thermal monitoring of MCU junction temperature for safety-critical derating logic. |
Applications
| Body Control Module (BCM) | Door Control Unit (DCU) |
|---|---|
Use Scenario: Centralized management of lighting, wipers, locks, and windows in passenger vehicles. IC Role / Device Role / Timing Role: Main controller executing CAN message routing, PWM dimming, and LIN slave coordination. Use Value: 32 KB Flash accommodates multi-feature firmware; MSCAN and dual SCI enable seamless integration into vehicle-wide communication architecture. | Use Scenario: Local control of power windows, mirror adjustment, and interior lighting in vehicle doors. IC Role / Device Role / Timing Role: LIN slave node with local sensor input processing and actuator drive timing. Use Value: Single-wire BDM simplifies production test; 2 KB EEPROM stores window position limits and user preferences across power loss. |
| Roof Module Controller | Seat Control Unit |
Use Scenario: Sunroof, panoramic roof, and ambient lighting control with tilt/slide motion profiles. IC Role / Device Role / Timing Role: Real-time motor control via TPM PWM outputs and ADC feedback sampling. Use Value: 6-channel TPM supports simultaneous motor direction, speed, and current sensing; RTC enables scheduled auto-close functionality. | Use Scenario: Power seat positioning with memory presets, heating, and lumbar adjustment. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating potentiometer, thermistor, and switch inputs. Use Value: 24-channel 12-bit ADC resolves fine-position feedback; internal temperature sensor monitors heater element thermal limits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ48F2MLH | 48 KB Flash, same package and peripheral set - no change in pinout or clocking architecture. | Higher firmware capacity for feature-rich BCMs with OTA update capability. | Select when future firmware expansion or bootloader complexity requires >32 KB code space. |
| S9S08DZ16F2MLH | 16 KB Flash, identical core, memory map, and peripheral register layout - binary-compatible instruction set. | Cost-optimized variant for simpler nodes (e.g., single-function switches or sensors). | Choose where application logic fits within 16 KB and EEPROM/RAM requirements remain unchanged. |
Compared with MC9S08DZ48F2MLH and S9S08DZ16F2MLH, the S9S08DZ32F2MLH offers optimal balance of code density, peripheral count, and cost for mid-tier automotive body electronics - avoiding over-provisioning while retaining headroom for calibration data and minor feature additions.
Availability
S9S08DZ32F2MLH is available at Aetrix Electronics and suitable for automotive body control modules, door control units, roof modules, and seat control units requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing.
Supply support for S9S08DZ32F2MLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08DZ32F2MLH belongs to the HCS08 DZ-series microcontrollers, designed specifically for cost-sensitive, real-time automotive body electronics with integrated CAN, LIN, and robust analog peripherals.
FAQ
What is the maximum operating frequency of the S9S08DZ32F2MLH CPU core?
The S9S08DZ32F2MLH features an HCS08 CPU core rated for up to 40 MHz operation, with a corresponding 20 MHz bus frequency. This timing is achievable under specified voltage (4.5–5.5 V) and temperature (–40°C to +125°C) conditions per the official datasheet. The actual system clock is derived from the MCG module, which supports FLL- and PLL-based synthesis from internal or external sources.
Does the S9S08DZ32F2MLH support CAN FD or only classical CAN?
The S9S08DZ32F2MLH implements the MSCAN module compliant with ISO 11898-1:2003, supporting only Classical CAN (CAN 2.0A/B) - not CAN FD. It handles standard and extended identifiers, remote frames, and five receive buffers with configurable acceptance filters. CAN FD requires higher bandwidth and different protocol handling not present in this HCS08 derivative.
How much EEPROM does the S9S08DZ32F2MLH include, and what are its erase characteristics?
The S9S08DZ32F2MLH includes 2 KB of on-chip EEPROM, organized for in-circuit programming with 8-byte single-page or 4-byte dual-page erase sectors. Erase operations can be aborted, and both program and erase functions operate while executing Flash code - enabling safe runtime parameter storage without halting application execution.
What debug interface does the S9S08DZ32F2MLH use, and is JTAG supported?
The S9S08DZ32F2MLH uses a single-wire background debug (BDM) interface for programming and real-time emulation - not JTAG. It supports non-intrusive breakpoint insertion, register inspection, and Flash memory access via the BKGD/MS pin. JTAG is not implemented; BDM is the sole standardized debug path defined in the HCS08 architecture.
Is the S9S08DZ32F2MLH qualified for automotive applications, and what is its temperature grade?
Yes, the S9S08DZ32F2MLH is AEC-Q100 qualified for automotive applications and rated for operation from –40°C to +125°C ambient temperature. It meets stringent reliability, ESD, and electromagnetic compatibility requirements defined for under-hood and cabin-mounted electronic control units in passenger vehicles.
S9S08DZ32F2MLH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- S08
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1K x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DZ32F2MLH FAQ
1.How can I place an order for S9S08DZ32F2MLH through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DZ32F2MLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DZ32F2MLH reliable?
The price and inventory of S9S08DZ32F2MLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ32F2MLH is usually 5 days.
3.What payment methods are accepted for S9S08DZ32F2MLH?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DZ32F2MLH transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08DZ32F2MLH?
S9S08DZ32F2MLH orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08DZ32F2MLH order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08DZ32F2MLH?
For technical support, including S9S08DZ32F2MLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ32F2MLH requirements.
6.How does Aetrix verify that S9S08DZ32F2MLH is sourced from the original manufacturer or authorized distributors?
All S9S08DZ32F2MLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ32F2MLH meets industry standards.
7.What is the process for return or replacement of S9S08DZ32F2MLH?
All S9S08DZ32F2MLH units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ32F2MLH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DZ32F2MLH part is unused and in its original packaging.
Return procedure for S9S08DZ32F2MLH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S08DZ32F2MLH Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
