NXP Semiconductors S9S08DZ32F2VLCR
- Part No.:
- S9S08DZ32F2VLCR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S08DZ32F2VLCR.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,898
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Product details
Overview
S9S08DZ32F2VLCR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB flash, 4 KB RAM, and integrated CAN 2.0A/B controller, designed for automotive body electronics and industrial control systems requiring robust real-time communication and low-power operation.
For engineers reviewing the S9S08DZ32F2VLCR datasheet, S9S08DZ32F2VLCR pinout, S9S08DZ32F2VLCR application, or S9S08DZ32F2VLCR equivalent, key selection criteria include its 24-channel 12-bit ADC with temperature sensor, dual SCI supporting LIN 2.0/SAE J2602, single-wire BDM debug interface, and support for Stop2/Stop3 ultra-low-power modes with RTC wake-up.
Technical Context
The S9S08DZ32F2VLCR implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), with instruction set compatibility to HC08 plus BGND for background debugging. It integrates a Multi-Purpose Clock Generator (MCG) supporting FLL, PLL, and internal/external reference sources with factory-trimmed 1 kHz IRC.
Its peripheral suite includes MSCAN with five receive buffers and flexible identifier filtering (2×32-bit, 4×16-bit, or 8×8-bit), two SCIs with master/slave break generation/detection, and TPM modules offering input capture, output compare, and edge-aligned PWM on six and two channels respectively.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz max core clock (20-MHz bus) |
| Flash Memory | 32 KB on-chip flash with program/erase during execution and block protection |
| RAM | 4 KB on-chip RAM for data and stack operations |
| EEPROM | 2 KB in-circuit programmable EEPROM with 4- or 8-byte erase sectors |
| ADC | 24-channel, 12-bit resolution, 2.5 µs conversion time, internal bandgap and temperature sensor channels |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), supporting standard/extended frames and remote frames |
| Power Modes | Run, Wait, Stop2, Stop3; RTC wake-up available in all modes using 1-kHz internal oscillator |
Pinout & Package
Package: 32-pin LQFP (7×7 mm), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation |
| XTAL, EXTAL | Crystal/resonator connection | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals for precise system timing |
| BKGD/MS | Single-wire background debug | Enables in-circuit emulation and programming without dedicated JTAG pins |
| RESET | Active-low reset input | Accepts external reset signal; internally pulled up; supports low-voltage detect reset |
| CANL, CANH | CAN differential bus lines | Direct interface to ISO 11898-compliant CAN transceiver; integrated CAN controller handles protocol framing |
| AD0–AD23 | Analog input channels | 24 multiplexed ADC inputs; configurable hysteresis and pull devices on all pins |
| SCI1_TX, SCI1_RX | Serial communication interface | Full-duplex NRZ UART supporting LIN 2.0 and SAE J2602 wakeup protocols |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MSCAN Controller | Eliminates need for external CAN protocol IC; supports five FIFO-based receive buffers and programmable acceptance filters |
| Real-Time Counter (RTC) | 8-bit modulus counter with binary/decimal prescaler; runs from 1-kHz internal oscillator for cyclic wake-up without external crystal |
| Low-Voltage Detection (LVD) | Configurable trip points with reset or interrupt output; enables safe brown-out response in automotive battery environments |
| Flash Security | Block-level flash protection and security byte prevent unauthorized read/write access to firmware and calibration data |
| Single-Wire BDM Debug | Reduces PCB footprint and cost vs. multi-pin debug interfaces; supports full ICE functionality including real-time bus capture |
Applications
| Body Control Module (BCM) | Automotive Door Module |
|---|---|
Use Scenario: Centralized control of lighting, windows, locks, and mirrors in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing CAN-based command arbitration, ADC-based sensor monitoring (e.g., door position, ambient light), and PWM-driven actuator control. Use Value: Integrated MSCAN and 24-channel ADC reduce component count; Stop3 mode enables <1 µA sleep current for battery-sensitive applications. | Use Scenario: Localized control unit inside vehicle door housing sensors and actuators. IC Role / Device Role / Timing Role: Real-time responder to LIN commands from BCM; manages window lift motor, mirror positioning, and anti-pinch detection via ADC and TPM PWM. Use Value: Dual SCI with LIN 2.0 support enables seamless integration into hierarchical automotive networks; built-in temperature sensor monitors motor thermal limits. |
| Industrial CAN Node | Smart Sensor Hub |
Use Scenario: Field device in factory automation communicating over industrial CAN bus. IC Role / Device Role / Timing Role: Protocol-aware node handling sensor data acquisition, CAN message assembly, and error recovery per ISO 11898. Use Value: Five receive buffers and flexible ID filtering ensure deterministic latency under heavy bus load; EEPROM stores node configuration and calibration offsets. | Use Scenario: Aggregation point for multiple analog and digital sensors in building management systems. IC Role / Device Role / Timing Role: Signal conditioner and scheduler-sampling thermistors, humidity sensors, and contact closures via ADC and GPIO, then transmitting via SCI or CAN. Use Value: 12-bit ADC with internal bandgap reference provides ±1.5 LSB INL across –40°C to 125°C; RTC enables scheduled sensor polling independent of host. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ48F2VLC | 48 KB flash, same package and peripheral set; no change in RAM, EEPROM, or clock architecture | Higher firmware capacity for complex diagnostics or bootloader features | Select when >32 KB code space required without changing PCB layout or driver software |
| S9S08DZ16F2VLCR | 16 KB flash, identical pinout and peripheral complement; reduced memory footprint only | Cost-optimized variant for simpler control tasks with minimal firmware size | Choose for legacy replacement or cost-sensitive designs where 16 KB flash suffices |
Compared with MC9S08DZ48F2VLC and S9S08DZ16F2VLCR, the S9S08DZ32F2VLCR delivers optimal balance of code storage, peripheral integration, and package compatibility-enabling reuse of hardware design while supporting mid-complexity automotive and industrial firmware.
Availability
S9S08DZ32F2VLCR is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN nodes, smart sensor hubs, and embedded control systems requiring stable component supply across extended temperature ranges (–40°C to 125°C).
Supply support for S9S08DZ32F2VLCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The S9S08DZ32F2VLCR belongs to the HCS08 DZ-series microcontrollers, engineered specifically for cost-sensitive, safety-conscious automotive body control and industrial networked devices requiring CAN, LIN, and robust analog integration.
FAQ
What is the maximum operating frequency of the S9S08DZ32F2VLCR CPU?
The S9S08DZ32F2VLCR CPU operates at a maximum core frequency of 40 MHz, with a corresponding bus frequency of 20 MHz. This timing is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, and is validated across the full industrial temperature range (–40°C to 125°C). The S9S08DZ32F2VLCR maintains this performance while supporting low-power stop modes with real-time wake-up capability.
Does the S9S08DZ32F2VLCR support CAN FD or only classical CAN?
The S9S08DZ32F2VLCR supports only classical CAN (ISO 11898-1, CAN 2.0A/B) - not CAN FD. Its MSCAN module implements standard and extended data frames up to 8 bytes per frame, with five receive buffers and programmable identifier filtering. CAN FD capability requires higher bandwidth and larger message buffers not present in the S9S08DZ32F2VLCR's hardware architecture.
What debug interface does the S9S08DZ32F2VLCR use, and is JTAG supported?
The S9S08DZ32F2VLCR uses a single-wire Background Debug Mode (BDM) interface, not JTAG. This interface supports full in-circuit emulation, flash programming, and real-time bus capture through the BKGD/MS pin. JTAG is not implemented; all development and debugging must be performed using BDM-compatible tools such as the NXP DEMO9S08DZ60 evaluation board or compatible P&E Micro debug probes.
Can the S9S08DZ32F2VLCR operate from a 3.3 V supply, or is it strictly 5 V?
The S9S08DZ32F2VLCR is specified for operation from 2.7 V to 5.5 V, making it compatible with both 3.3 V and 5 V systems. Electrical characteristics-including ADC accuracy, CAN bus timing, and I/O drive strength-are guaranteed across this full voltage range. The internal voltage regulator supplies stable core voltage regardless of VDD, enabling mixed-voltage board designs where analog peripherals may require 5 V while digital logic runs at 3.3 V.
How many I/O pins does the S9S08DZ32F2VLCR have in its 32-pin LQFP package?
The S9S08DZ32F2VLCR in the 32-pin LQFP package provides 26 general-purpose I/O pins and one dedicated input-only pin (RESET), totaling 27 usable signal terminals. Pin functions are multiplexed across peripherals including SCI, SPI, I²C, TPM, ADC, and CAN. Full pin assignment and alternate functions are documented in Section 2.1 ("Device Pin Assignment") of the MC9S08DZ60 Series Data Sheet, Rev. 4.
S9S08DZ32F2VLCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 1K x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DZ32F2VLCR FAQ
1.How can I place an order for S9S08DZ32F2VLCR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DZ32F2VLCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DZ32F2VLCR reliable?
The price and inventory of S9S08DZ32F2VLCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ32F2VLCR is usually 5 days.
3.What payment methods are accepted for S9S08DZ32F2VLCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DZ32F2VLCR transactions.
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4.How is shipping managed for S9S08DZ32F2VLCR?
S9S08DZ32F2VLCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08DZ32F2VLCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08DZ32F2VLCR?
For technical support, including S9S08DZ32F2VLCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ32F2VLCR requirements.
6.How does Aetrix verify that S9S08DZ32F2VLCR is sourced from the original manufacturer or authorized distributors?
All S9S08DZ32F2VLCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ32F2VLCR meets industry standards.
7.What is the process for return or replacement of S9S08DZ32F2VLCR?
All S9S08DZ32F2VLCR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ32F2VLCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DZ32F2VLCR part is unused and in its original packaging.
Return procedure for S9S08DZ32F2VLCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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