NXP Semiconductors S9S08DZ60F2CLC
- Part No.:
- S9S08DZ60F2CLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S08DZ60F2CLC.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,497
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Product details
Overview
S9S08DZ60F2CLC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip Flash, 4 KB RAM, and 2 KB in-circuit programmable EEPROM. It integrates CAN 2.0A/B, dual SCI with LIN 2.0/SAE J2602 support, 24-channel 12-bit ADC, two analog comparators, and RTC - designed for automotive body electronics and industrial control nodes requiring robust communication and mixed-signal processing.
For engineers reviewing the S9S08DZ60F2CLC datasheet, S9S08DZ60F2CLC pinout, S9S08DZ60F2CLC application, or S9S08DZ60F2CLC equivalent, key selection criteria include its 64-pin LQFP package, 20 MHz bus frequency, CAN + LIN dual-protocol capability, integrated temperature sensor, and stop-mode real-time interrupt wake-up without external crystal.
Technical Context
The S9S08DZ60F2CLC implements the HCS08 CPU core with 40-MHz instruction execution (20-MHz bus), HC08 instruction set plus BGND, and support for up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL and PLL modes with factory-trimmed internal reference clock and ±1.5% FLL accuracy using temperature compensation.
System protection includes COP watchdog with dual-clock source (1 kHz internal or bus clock), low-voltage detect with configurable trip points, illegal opcode/address detection, and Flash block protection. Development is enabled via single-wire background debug interface and on-chip ICE with real-time bus capture.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz max instruction rate (20-MHz bus) |
| Flash Memory | 60 KB program/erase over full voltage/temperature range; supports program/erase while executing |
| RAM | 4 KB on-chip SRAM for data and stack operations |
| EEPROM | 2 KB in-circuit programmable; 4-byte dual-page or 8-byte single-page erase sectors |
| ADC | 24-channel, 12-bit resolution, 2.5 μs conversion time; includes internal bandgap reference and temperature sensor channel |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B); supports standard/extended frames, five FIFO receive buffers |
| Communication | Dual SCI supporting LIN 2.0 and SAE J2602; SPI; I²C up to 100 kbps; TPM timers with PWM/capture/compare |
| Package | 64-pin LQFP (10 × 10 mm), RoHS-compliant, lead-free |
Pinout & Package
64-pin low-profile quad flat-pack (LQFP), 10 × 10 mm body, 0.5 mm pitch, exposed pad (no thermal pad connection required). Pinout validated per MC9S08DZ60 Rev. 4 datasheet Chapter 2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5.0 V supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD); separate pins reduce noise coupling into ADC |
| XTAL, EXTAL | Crystal oscillator input/output | Supports 1–16 MHz crystals or ceramic resonators; enables precise timing for CAN bit timing and RTC |
| BKGD/MS | Background debug / mode select | Single-wire debug interface pin; also selects active background mode during reset |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset signals or power-on reset assertion |
| VREFH, VREFL | ADC reference voltage inputs | Enable external precision reference (e.g., 2.5 V) or internal bandgap (1.2 V); critical for ADC accuracy in sensor interfaces |
| PTE0–PTE7, PTB0–PTB7, etc. | General-purpose I/O ports | 53 GPIO + 1 input-only pin; all support configurable pull, slew rate, drive strength, and edge-triggered interrupts |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN 2.0A/B controller | Enables direct connection to automotive CAN networks without external transceiver logic; supports remote frames and flexible ID filtering |
| LIN 2.0 + SAE J2602 compliant SCI | Allows interoperability with LIN slave nodes and diagnostic tools in body control modules; includes master break generation and slave break detection |
| Real-time interrupt in Stop3 mode | Wakes CPU from ultra-low-power stop state using internal 1-kHz oscillator - no external crystal needed for periodic wake-up |
| On-chip temperature sensor | Provides calibrated die temperature measurement (±3°C accuracy) for thermal monitoring in motor control or battery management |
| Flash security and block protection | Prevents unauthorized read-out or overwrite of firmware; protects bootloader and calibration data sections independently |
| Single-wire background debug | Reduces debug footprint to one pin; supports full memory access, register inspection, and breakpoint execution without halting peripherals |
Applications
| Automotive Door Module | Industrial Motor Control Node |
|---|---|
Use Scenario: Centralized control of window lift, mirror adjustment, lock actuation, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main system MCU coordinating LIN slaves (switches, sensors) and CAN gateway; manages PWM for motor drivers and ADC for position feedback. Use Value: Integrated LIN+CAN eliminates need for external protocol translators; 24-channel ADC monitors multiple potentiometers and current sense resistors simultaneously. | Use Scenario: Standalone BLDC motor controller for HVAC blowers or conveyor drives in factory automation systems. IC Role / Device Role / Timing Role: Real-time motor commutation engine using TPM PWM outputs and ADC current/voltage sampling; RTC schedules maintenance alerts. Use Value: 2.5 μs ADC conversion enables high-frequency current loop sampling; stop-mode RTC wake-up reduces average power below 10 μA. |
| Commercial Vehicle Body Controller | Smart Lighting Control Unit |
Use Scenario: Power distribution and load monitoring across cab, chassis, and trailer interfaces in heavy-duty trucks. IC Role / Device Role / Timing Role: CAN network node managing relay drivers, fuse diagnostics, and battery voltage telemetry; uses ACMP for overvoltage detection. Use Value: Dual analog comparators with internal bandgap reference provide hardware-level overvoltage cutoff without CPU intervention. | Use Scenario: Adaptive LED headlight control with ambient light sensing, thermal derating, and CAN-based dimming commands. IC Role / Device Role / Timing Role: Sensor fusion MCU reading photodiodes and thermistors via ADC, driving constant-current LED drivers via PWM, and reporting status over CAN. Use Value: On-chip temperature sensor enables closed-loop thermal compensation; 2 KB EEPROM stores calibration offsets across power cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ48F2CLC | 48 KB Flash, identical peripheral set and pinout; same 64-pin LQFP package and electrical specs | Reduced firmware capacity limits complex diagnostics or OTA update partitions | Select when application firmware fits within 48 KB and cost optimization is prioritized over future scalability |
| S9S08DZ32F2CLC | 32 KB Flash, 2 KB RAM, same core/peripherals; pin-compatible but reduced memory resources | Insufficient for applications requiring simultaneous CAN/LIN stacks plus secure boot and logging | Choose only for legacy designs migrating from DZ32 or where memory footprint is strictly constrained |
Compared with S9S08DZ48F2CLC and S9S08DZ32F2CLC, the S9S08DZ60F2CLC provides 12 KB and 28 KB more Flash respectively - enabling larger safety-certified code, dual-bank firmware updates, and extended diagnostic data logging without external memory.
Availability
S9S08DZ60F2CLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor control nodes, commercial vehicle body controllers, and smart lighting control units requiring stable component supply and long-term lifecycle support.
Supply support for S9S08DZ60F2CLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08DZ60F2CLC belongs to NXP's legacy HCS08 microcontroller family, engineered specifically for cost-sensitive, ASIL-B-capable automotive body electronics where CAN/LIN integration, mixed-signal capability, and ultra-low-power stop modes are essential.
FAQ
What is the maximum bus frequency supported by the S9S08DZ60F2CLC?
The S9S08DZ60F2CLC supports a maximum bus frequency of 20 MHz, derived from its 40-MHz HCS08 CPU core via a 2:1 divider. This frequency is fully operational across the rated voltage (4.5–5.5 V) and temperature (–40°C to +125°C) ranges, and is used for peripheral timing including CAN bit rate calculation and ADC sampling clocks.
Does the S9S08DZ60F2CLC include a hardware CAN controller?
Yes, the S9S08DZ60F2CLC integrates the MSCAN module, a full-featured CAN 2.0A/B controller compliant with ISO 11898-1. It supports standard and extended identifiers, five receive buffers with FIFO operation, and programmable acceptance filters - all implemented in hardware without CPU overhead.
Can the S9S08DZ60F2CLC operate in ultra-low-power modes with CAN listening enabled?
Yes, the S9S08DZ60F2CLC supports CAN wake-up from Stop2 mode via the MSCAN module's automatic bus activity detection. In Stop2, the CAN module remains powered and can detect dominant bits on the bus, triggering a wake-up interrupt while consuming less than 30 μA total system current.
What is the purpose of the BKGD/MS pin on the S9S08DZ60F2CLC?
The BKGD/MS pin serves dual functions: it acts as the single-wire background debug interface for programming and real-time debugging, and as the mode-select input during reset to enter active background mode. No external pull-up is required - an internal weak pull-up ensures default operation unless actively driven low.
Is the internal temperature sensor on the S9S08DZ60F2CLC factory-calibrated?
Yes, the S9S08DZ60F2CLC includes a factory-calibrated on-die temperature sensor accessible via ADC channel AN23. Calibration data is stored in flash memory and used by the ADC to deliver ±3°C accuracy across the –40°C to +125°C operating range without external compensation.
S9S08DZ60F2CLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DZ60F2CLC FAQ
1.How can I place an order for S9S08DZ60F2CLC through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DZ60F2CLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DZ60F2CLC reliable?
The price and inventory of S9S08DZ60F2CLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ60F2CLC is usually 5 days.
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Once your S9S08DZ60F2CLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08DZ60F2CLC?
For technical support, including S9S08DZ60F2CLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ60F2CLC requirements.
6.How does Aetrix verify that S9S08DZ60F2CLC is sourced from the original manufacturer or authorized distributors?
All S9S08DZ60F2CLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ60F2CLC meets industry standards.
7.What is the process for return or replacement of S9S08DZ60F2CLC?
All S9S08DZ60F2CLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ60F2CLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DZ60F2CLC part is unused and in its original packaging.
Return procedure for S9S08DZ60F2CLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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