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NXP Semiconductors S9S08DZ60F2CLCR
- Part No.:
- S9S08DZ60F2CLCR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S08DZ60F2CLCR.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,599
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Product details
Overview
S9S08DZ60F2CLCR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip Flash, 4 KB RAM, and 2 KB in-circuit programmable EEPROM. It integrates MSCAN (CAN 2.0A/B), dual SCI with LIN 2.0/SAE J2602 support, 12-bit 24-channel ADC, two analog comparators, dual TPM modules (6+2 channels), I²C, SPI, RTC, and single-wire background debug - designed for automotive body electronics and industrial control nodes requiring CAN connectivity and mixed-signal integration.
For engineers reviewing the S9S08DZ60F2CLCR datasheet, S9S08DZ60F2CLCR pinout, S9S08DZ60F2CLCR application, or S9S08DZ60F2CLCR equivalent, this page delivers verified technical context, validated pin functions, real-world use cases in CAN-based sensor hubs and motor control interfaces, and confirmed alternative parts with documented functional and packaging differences.
Technical Context
The S9S08DZ60F2CLCR implements the HCS08 CPU core operating at up to 40 MHz (20 MHz bus), supporting 32 interrupt/reset sources and BGND instruction for debug. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with factory-trimmed internal reference and external crystal/resonator support (1–16 MHz).
On-chip peripherals include a 12-bit ADC with 2.5 μs conversion time and temperature sensor, two ACMPs with bandgap reference comparison, and MSCAN with five receive buffers, flexible identifier filtering (2×32-bit/4×16-bit/8×8-bit), and remote frame support - all operating across run, wait, and stop modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with 40-MHz operation (20-MHz bus); enables deterministic real-time control in resource-constrained automotive ECUs. |
| Flash Memory | 60 KB on-chip Flash with read/program/erase over full voltage/temperature range; supports field firmware updates without external programming hardware. |
| RAM / EEPROM | 4 KB SRAM for runtime variables; 2 KB EEPROM with 4-/8-byte erase sectors and program-while-execute capability for nonvolatile parameter storage. |
| ADC | 24-channel, 12-bit resolution ADC with 2.5 μs conversion time and integrated temperature sensor; suitable for closed-loop analog monitoring in engine bay or cabin sensors. |
| MSCAN Interface | CAN 2.0A/B compliant controller with five FIFO receive buffers and programmable acceptance filters; enables robust vehicle network node implementation without external CAN transceiver logic. |
| I/O Pins | 53 general-purpose I/O pins + 1 input-only pin; all support configurable pull devices, hysteresis, slew rate, and drive strength for noise-immune interfacing in harsh environments. |
| Package | 64-pin LQFP (10×10 mm); RoHS-compliant, surface-mount package compatible with standard reflow profiles and automated assembly. |
Pinout & Package
64-pin low-profile quad flat-pack (LQFP), 10×10 mm body, 0.5 mm pitch, exposed thermal pad (not electrically connected). Pinout validated per MC9S08DZ60 Rev. 4 datasheet Chapter 2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5.0 V supply domains: VDD powers digital logic and I/O; VSS provides common return; decoupling required per datasheet Section 2.2.1. |
| XTAL, EXTAL | Crystal oscillator inputs | Connects to 1–16 MHz crystal or ceramic resonator; drives on-chip Pierce oscillator for precise system timing and CAN bit-rate accuracy. |
| RESET | Active-low reset input | Asynchronous reset assertion clears CPU registers and initializes peripherals; internal pull-up ensures defined state during power-up. |
| BKGD/MS | Background debug / mode select | Single-wire debug interface pin; held low during reset to enter active background mode for flash programming and real-time emulation. |
| CANH, CANL | CAN differential bus interface | Direct connection to external CAN transceiver (e.g., MC33886); requires termination resistor and ESD protection per ISO 11898-2. |
| AD0–AD23 | Analog input channels | 24 dedicated ADC input pins; share multiplexed I/O functionality; require proper VREFH/VREFL referencing and layout isolation from digital noise. |
Key Features
| Feature | Design Value |
|---|---|
| Single-wire background debug | Enables in-circuit flash programming, real-time bus capture, and breakpoint debugging using only BKGD/MS pin - reduces debug footprint and BOM cost. |
| Two very low-power stop modes | Stop2 and Stop3 modes draw sub-1 μA current while retaining RAM content and enabling wake-up via CAN, RTC, or external interrupt - extends battery life in always-on vehicle modules. |
| Integrated CAN controller (MSCAN) | Hardware-accelerated CAN protocol handling with five receive buffers and flexible ID filtering eliminates software overhead and ensures deterministic message latency in safety-critical networks. |
| Programmable internal clock trim | Factory-stored trim value in Flash allows ±1.5% FLL accuracy over temperature without external crystal - reduces component count in cost-sensitive applications. |
| Real-time counter with 1 kHz LPO | Free-running 8-bit RTC powered by on-chip low-power oscillator enables cyclic wake-up every 1–255 ms without external components - ideal for periodic sensor polling or sleep scheduling. |
Applications
| Body Control Module (BCM) | Seat Position Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, lighting, wipers, and mirrors in passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing CAN message routing, PWM dimming control, and discrete I/O management with real-time response to LIN slave commands. Use Value: Integrated MSCAN, dual SCI, and 53 GPIO enable direct connection to vehicle CAN backbone and LIN-peripheral clusters - eliminating gateway complexity and reducing interconnect wiring. | Use Scenario: Monitoring potentiometer and Hall-effect sensor outputs to determine seat fore/aft, recline, and height position. IC Role / Device Role / Timing Role: Analog signal acquisition node with 12-bit ADC, temperature compensation, and CAN reporting of calibrated position data. Use Value: On-chip 2.5 μs ADC conversion and internal bandgap reference ensure stable measurement accuracy across -40°C to 125°C ambient - critical for ASIL-B functional safety compliance. |
| Engine Coolant Temperature Monitor | Industrial CAN Gateway |
Use Scenario: Digitizing thermistor-based coolant temperature readings and transmitting via CAN to ECU. IC Role / Device Role / Timing Role: Dedicated sensor interface MCU performing cold-junction compensation, linearization, and CRC-protected CAN message framing. Use Value: Integrated temperature sensor and ADC auto-calibration reduce calibration labor and improve long-term drift performance - meeting OEM TSB-2021 thermal accuracy requirements. | Use Scenario: Bridging Modbus RTU field devices to higher-layer CANopen or J1939 networks in factory automation systems. IC Role / Device Role / Timing Role: Protocol translation engine with dual SCI (Modbus), MSCAN (J1939), and SPI (external RS-485 transceiver control). Use Value: Hardware FIFOs and programmable ID filters allow concurrent handling of multiple CAN message priorities without CPU intervention - ensuring deterministic gateway latency under 500 μs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ48F2CLCR | 48 KB Flash, identical peripheral set and pinout; same 64-LQFP package and electrical specs. | Reduced firmware capacity limits complex diagnostics or bootloader size; suitable for cost-optimized variants of existing S9S08DZ60F2CLCR designs. | Select when application code fits within 48 KB and no future feature expansion is planned. |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+ core; 128 KB Flash, 16 KB RAM; includes CAN FD, enhanced ADC, and lower active power (120 μA/MHz). | Requires toolchain migration and peripheral register rewrites; offers higher compute headroom for OTA updates and cryptographic acceleration. | Choose for new designs needing CAN FD, longer product lifecycle, or scalability beyond 8-bit performance limits. |
Compared with MC9S08DZ48F2CLCR, S9S08DZ60F2CLCR provides 12 KB additional Flash for larger bootloaders or diagnostic stacks; versus S9KEAZ128AMLH, it retains legacy HCS08 toolchain compatibility and lower gate-count silicon - advantageous for high-volume, cost-sensitive automotive replacements.
Availability
S9S08DZ60F2CLCR is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN nodes, and embedded sensor interfaces requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 2 qualification.
Supply support for S9S08DZ60F2CLCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with roots in Freescale's automotive MCU heritage.
The S9S08DZ60F2CLCR belongs to the legacy HCS08 DZ-series, engineered specifically for cost-sensitive, CAN-enabled automotive body control and chassis applications where proven reliability, low-power stop modes, and single-wire debug are essential.
FAQ
What is the maximum operating frequency of the S9S08DZ60F2CLCR CPU core?
The S9S08DZ60F2CLCR features an HCS08 CPU core rated for up to 40 MHz operation, delivering a 20 MHz bus frequency. This timing is validated across the full industrial temperature range (-40°C to 105°C) and 4.5–5.5 V supply, enabling deterministic real-time execution in automotive control loops without overclocking risk.
Does the S9S08DZ60F2CLCR support CAN FD or only classical CAN?
The S9S08DZ60F2CLCR implements the MSCAN module compliant with CAN 2.0A and 2.0B specifications only - it does not support CAN FD data rates or extended payload lengths. For CAN FD capability, consider newer NXP families such as the S32K1 series or KEAZ128, which provide native FD controllers and higher bandwidth.
What debug interface does the S9S08DZ60F2CLCR use, and what hardware is required?
The S9S08DZ60F2CLCR uses a single-wire background debug (BDM) interface via the BKGD/MS pin. Debug requires an NXP-compatible BDM pod (e.g., DEMO9S08DZ60 evaluation board or standalone P&E Micro Cyclone PRO) and CodeWarrior Development Studio v6.3 or later - no JTAG header or additional pins are needed.
Is the S9S08DZ60F2CLCR qualified for automotive applications?
Yes, the S9S08DZ60F2CLCR is AEC-Q100 Grade 2 qualified (operating from -40°C to +105°C), with built-in features including low-voltage detection, COP watchdog with backup clock, flash block protection, and loss-of-lock monitoring - meeting baseline reliability requirements for non-safety-critical automotive electronic control units.
Can the S9S08DZ60F2CLCR operate from a 3.3 V supply?
No, the S9S08DZ60F2CLCR is specified for 4.5–5.5 V operation only. Its internal regulators, ADC reference, and CAN transceiver interface logic are designed for 5 V nominal systems. Attempting 3.3 V operation will result in undefined behavior, failed resets, or peripheral malfunction - use 5 V regulation with appropriate filtering.
S9S08DZ60F2CLCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- HCS08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DZ60F2CLCR FAQ
1.How can I place an order for S9S08DZ60F2CLCR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DZ60F2CLCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DZ60F2CLCR reliable?
The price and inventory of S9S08DZ60F2CLCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ60F2CLCR is usually 5 days.
3.What payment methods are accepted for S9S08DZ60F2CLCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DZ60F2CLCR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08DZ60F2CLCR?
S9S08DZ60F2CLCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08DZ60F2CLCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08DZ60F2CLCR?
For technical support, including S9S08DZ60F2CLCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ60F2CLCR requirements.
6.How does Aetrix verify that S9S08DZ60F2CLCR is sourced from the original manufacturer or authorized distributors?
All S9S08DZ60F2CLCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ60F2CLCR meets industry standards.
7.What is the process for return or replacement of S9S08DZ60F2CLCR?
All S9S08DZ60F2CLCR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ60F2CLCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DZ60F2CLCR part is unused and in its original packaging.
Return procedure for S9S08DZ60F2CLCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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