My Inquiry
My Account
NXP Semiconductors S9S08DZ60F2CLF
- Part No.:
- S9S08DZ60F2CLF
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
S9S08DZ60F2CLF.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 48LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,275
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S08DZ60F2CLF from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller designed for automotive and industrial embedded control. It features a 40-MHz CPU (20-MHz bus), 60 KB on-chip Flash, 4 KB RAM, and integrated CAN 2.0A/B controller. Used in body control modules, sensor interface units, and motor actuation systems requiring real-time deterministic response.
For engineers reviewing the S9S08DZ60F2CLF datasheet, S9S08DZ60F2CLF pinout, S9S08DZ60F2CLF application, or S9S08DZ60F2CLF equivalent, key selection criteria include its 53 GPIOs with configurable slew rate and pull devices, dual SCI supporting LIN 2.0/SAE J2602, and on-chip RTC with 1-kHz low-power oscillator for cyclic wake-up without external components.
Technical Context
The S9S08DZ60F2CLF implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides PLL and FLL modes with ±1.5% frequency deviation using internal temperature compensation and factory-trimmed internal reference clock.
Peripherals include a 24-channel 12-bit ADC (2.5 μs conversion), two analog comparators with bandgap reference option, MSCAN module with five receive buffers and programmable identifier filters (2×32-bit, 4×16-bit, or 8×8-bit), and dual TPM modules (6-channel + 2-channel) supporting input capture, output compare, and edge-aligned PWM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core, 40-MHz operation (20-MHz bus speed) |
| Flash Memory | 60 KB on-chip Flash with program/erase during execution and block protection |
| RAM | 4 KB on-chip RAM for data and stack operations |
| EEPROM | 2 KB in-circuit programmable EEPROM with 4- or 8-byte erase sectors |
| ADC | 24-channel, 12-bit resolution, 2.5 μs conversion time, internal temperature sensor and bandgap reference channel |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), supports standard/extended frames and remote frames |
| I/O Pins | 53 general-purpose I/O pins + 1 input-only pin; all support configurable pull, hysteresis, slew rate, and drive strength |
Pinout & Package
Package: 64-pin LQFP (10 × 10 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: digital (VDD/VSS) and analog (VDDAD/VSSAD); separate decoupling required |
| XTAL, EXTAL | Crystal/resonator connection | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals; feeds MCG for system clock generation |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset signals or watchdog timeout |
| BKGD/MS | Background debug and mode select | Single-wire BDM interface for programming and real-time emulation; also selects boot mode |
| VREFH, VREFL | Analog reference inputs | Define ADC full-scale range; can be tied to AVDD/AVSS or driven externally for precision measurement |
| PTA0–PTA7, PTB0–PTB7, etc. | General-purpose I/O ports | 53 GPIOs mapped across Ports A–G; each pin individually configurable as input/output with interrupt capability |
| CANRX, CANTX | CAN transceiver interface | Differential CAN bus physical layer interface; requires external transceiver (e.g., MC33883, TJA1040) |
| SCI1_TX, SCI1_RX | Serial communication interface | Full-duplex NRZ UART supporting LIN 2.0 and SAE J2602 protocols with master/slave break generation/detection |
Key Features
| Feature | Design Value |
|---|---|
| Real-time interrupt wake-up | 1-kHz on-chip low-power oscillator enables precise periodic wake-up from Stop3/Stop2 modes without external crystal |
| In-system programmability | Flash and EEPROM support in-circuit reprogramming via single-wire BDM; no UV erasure or socketing needed |
| Robust system protection | Watchdog (COP) with dual-clock source (bus or 1-kHz backup), low-voltage detect with reset/interrupt, illegal opcode/address detection, and flash block protect |
| Flexible clock architecture | MCG supports multiple modes: FEI (FLL Engaged Internal), FBE (FLL Bypassed External), PBE (PLL Bypassed External), and PEI (PLL Engaged Internal) |
| Peripheral integration | Integrated MSCAN, dual SCI, SPI, I²C, dual TPM, RTC, ADC, ACMP, and real-time counter eliminate need for discrete timing and interface ICs |
Applications
| Automotive Body Control Module | Industrial Sensor Hub |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in 12 V vehicle platforms. IC Role / Device Role / Timing Role: Main system controller executing real-time CAN message handling, GPIO-driven actuator sequencing, and LIN-based sub-node communication. Use Value: Integrated MSCAN and dual SCI reduce BOM count; 60 KB Flash accommodates firmware updates and diagnostic stacks; RTC enables timed event logging without external RTC IC. | Use Scenario: Aggregation and preprocessing of analog sensor data (temperature, pressure, humidity) in factory automation nodes. IC Role / Device Role / Timing Role: Signal acquisition controller performing 12-bit ADC sampling, comparator-based threshold detection, and CAN-based telemetry transmission. Use Value: 24-channel ADC with internal temperature sensor and bandgap reference eliminates external signal conditioning; EEPROM stores calibration coefficients across power cycles. |
| Motor Actuation Interface | Smart Power Distribution Unit |
Use Scenario: Closed-loop DC motor control in HVAC blowers, seat adjusters, and sunroof drives. IC Role / Device Role / Timing Role: PWM generator and feedback processor using TPM channels for 6-channel complementary PWM and ADC for current sensing. Use Value: Six-channel TPM supports three-phase motor control with dead-time insertion; fast 2.5 μs ADC enables current loop update at >100 kHz. | Use Scenario: Intelligent fuse replacement in commercial vehicle power distribution centers with load monitoring and fault reporting. IC Role / Device Role / Timing Role: System supervisor monitoring voltage/current via ADC, detecting overcurrent via ACMP, and communicating faults over CAN bus. Use Value: Dual analog comparators with internal bandgap reference provide fast overvoltage/overcurrent trip; flash block protection prevents unauthorized firmware modification in safety-critical paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ48F2CLF | 48 KB Flash, otherwise identical peripheral set, pin-compatible in 64-pin LQFP package | Reduced firmware footprint requirement; suitable where bootloader + application fit within 48 KB | Select when code size is constrained and no additional Flash headroom is needed for field upgrades |
| S9S08DZ32F2CLF | 32 KB Flash, same core/peripherals, pin-compatible in 64-pin LQFP package | Lower-cost variant for cost-sensitive applications with minimal feature set and smaller firmware | Choose for legacy designs migrating from MC9S08DZ16/DZ32 where pin compatibility is mandatory but Flash demand is ≤32 KB |
Compared with S9S08DZ60F2CLF, the S9S08DZ48F2CLF and S9S08DZ32F2CLF offer identical I/O count, peripheral functionality, and package footprint but trade Flash capacity for lower unit cost - enabling tiered product variants without PCB redesign.
Availability
S9S08DZ60F2CLF is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor interfaces, motor actuation systems, and smart power distribution requiring stable component supply across extended temperature ranges (–40°C to +125°C).
Supply support for S9S08DZ60F2CLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08DZ60F2CLF belongs to the HCS08 DZ-series microcontrollers, engineered specifically for cost-sensitive, high-reliability automotive body electronics and industrial control applications demanding CAN, LIN, and robust analog integration.
FAQ
What is the maximum operating frequency of the S9S08DZ60F2CLF CPU core?
The S9S08DZ60F2CLF features an HCS08 CPU core rated for up to 40 MHz operation, delivering a 20 MHz bus clock speed. This frequency is achievable across the full industrial temperature range (–40°C to +125°C) when powered at 5.0 V, as confirmed in the electrical characteristics table of the Rev. 4 datasheet. The MCG module must be configured in appropriate mode (e.g., PEI or FEI) to sustain this performance.
Does the S9S08DZ60F2CLF support in-circuit debugging and programming?
Yes, the S9S08DZ60F2CLF includes a single-wire background debug (BDM) interface compliant with the HCS08 BDM specification. This allows full-speed real-time emulation, flash programming, register inspection, and breakpoint setting without halting system operation. Debug access requires only the BKGD/MS pin and ground, minimizing board routing overhead.
What are the supported CAN protocol versions and frame types on the S9S08DZ60F2CLF?
The S9S08DZ60F2CLF integrates the MSCAN module supporting CAN protocol version 2.0A and 2.0B, including both standard (11-bit ID) and extended (29-bit ID) data frames. It also supports remote transmission requests (RTR) and implements five receive buffers with FIFO behavior and flexible identifier filtering configurations (2×32-bit, 4×16-bit, or 8×8-bit acceptance masks).
How much EEPROM memory does the S9S08DZ60F2CLF include, and what are its erase characteristics?
The S9S08DZ60F2CLF includes 2 KB of on-chip EEPROM memory. Erase operations are performed in 4-byte dual-page or 8-byte single-page sectors. The EEPROM supports program and erase while executing Flash code, and erase abort functionality is available to halt ongoing sector erases without data corruption.
Is the S9S08DZ60F2CLF pin-compatible with other members of the DZ-series such as the S9S08DZ48F2CLF?
Yes, the S9S08DZ60F2CLF in the 64-pin LQFP package is pin-compatible with the S9S08DZ48F2CLF and S9S08DZ32F2CLF in the same package variant. All share identical pin assignments, electrical characteristics, and peripheral mapping - enabling hardware reuse across firmware variants differentiated only by Flash size and part number marking.
S9S08DZ60F2CLF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DZ60F2CLF FAQ
1.How can I place an order for S9S08DZ60F2CLF through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DZ60F2CLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DZ60F2CLF reliable?
The price and inventory of S9S08DZ60F2CLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ60F2CLF is usually 5 days.
3.What payment methods are accepted for S9S08DZ60F2CLF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DZ60F2CLF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08DZ60F2CLF?
S9S08DZ60F2CLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08DZ60F2CLF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08DZ60F2CLF?
For technical support, including S9S08DZ60F2CLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ60F2CLF requirements.
6.How does Aetrix verify that S9S08DZ60F2CLF is sourced from the original manufacturer or authorized distributors?
All S9S08DZ60F2CLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ60F2CLF meets industry standards.
7.What is the process for return or replacement of S9S08DZ60F2CLF?
All S9S08DZ60F2CLF units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ60F2CLF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DZ60F2CLF part is unused and in its original packaging.
Return procedure for S9S08DZ60F2CLF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S08DZ60F2CLF Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
