NXP Semiconductors S9S08DZ60F2MLC
- Part No.:
- S9S08DZ60F2MLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S08DZ60F2MLC.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,379
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S08DZ60F2MLC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip Flash, 4 KB RAM, and 2 KB EEPROM, operating at up to 40 MHz CPU / 20 MHz bus frequency. It integrates CAN 2.0A/B, dual SCI with LIN 2.0 support, 12-bit 24-channel ADC, two analog comparators, RTC, and six-channel TPM - designed for automotive body electronics and industrial control nodes requiring robust communication and mixed-signal processing.
For engineers reviewing the S9S08DZ60F2MLC datasheet, S9S08DZ60F2MLC pinout, S9S08DZ60F2MLC application, or S9S08DZ60F2MLC equivalent, key selection criteria include CAN protocol compliance, in-circuit programmable EEPROM with erase abort, single-wire background debug interface, real-time interrupt capability in Stop3 mode, and factory-trimmed internal reference clock with stored trim value in Flash.
Technical Context
The S9S08DZ60F2MLC implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and executing instructions at 40 MHz core speed (20 MHz bus). Its Multi-Purpose Clock Generator (MCG) provides FLL and PLL modes with ±1.5% FLL accuracy using internal temperature compensation and includes a factory-trimmed internal reference clock.
System-level protection includes COP watchdog with dual-clock source option (1 kHz backup or bus clock), low-voltage detect with configurable trip points, illegal opcode/address detection, Flash block protect, and loss-of-lock monitoring. Peripherals are fully functional in Run, Wait, and Stop3 modes - including MSCAN, ADC, ACMP, and RTC - enabling deterministic low-power operation without peripheral disable overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with BGND instruction; executes at 40 MHz max, 20 MHz bus clock |
| Flash Memory | 60 KB on-chip Flash with read/program/erase over full voltage/temperature range |
| EEPROM | 2 KB in-circuit programmable EEPROM with 8-byte single-page or 4-byte dual-page erase sectors |
| RAM | 4 KB on-chip RAM for data and stack storage |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B); supports standard/extended frames and remote frames |
| ADC | 12-bit, 24-channel SAR ADC with 2.5 μs conversion time, internal bandgap reference, and temperature sensor channel |
| Debug Interface | Single-wire background debug (BDM) interface with on-chip in-circuit emulation (ICE) and real-time bus capture |
Pinout & Package
Package: 64-pin LQFP (10 × 10 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDAD | Power supply inputs | Separate digital (VDD), analog (VDDA), and ADC (VDDAD) supplies enable noise isolation for mixed-signal operation |
| VSS, VSSA, VSSAD | Ground returns | Dedicated analog and ADC ground pins minimize coupling of digital switching noise into sensitive analog paths |
| XTAL, EXTAL | Clock oscillator terminals | Support crystal or ceramic resonator (1–16 MHz or 31.25 kHz–38.4 kHz) for precise system timing |
| BKGD/MS | Background debug / mode select | Single-wire BDM interface pin; also selects active background mode during reset |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external reset assertion or internal COP/LVD reset |
| CANL, CANH | CAN bus differential pair | Direct connection to ISO 11898-compliant transceiver; supports high-speed CAN up to 1 Mbps |
| SCI0_TX, SCI0_RX | Serial communication interface | Full-duplex NRZ UART supporting LIN 2.0 and SAE J2602 protocols with master break generation |
| AD0–AD23 | Analog input channels | 24 multiplexed ADC inputs with configurable hysteresis, pull devices, and slew rate control |
Key Features
| Feature | Design Value |
|---|---|
| Real-time interrupt in Stop3 mode | Enables wake-up from deepest low-power state using internal 1 kHz oscillator - no external crystal required |
| Program/erase while executing Flash | Allows firmware updates and data logging without halting application code execution |
| Factory-trimmed internal reference clock | Trim value stored in Flash enables consistent 1–16 MHz MCG operation across temperature and voltage without external components |
| Five CAN receive buffers with FIFO | Reduces CPU load during burst CAN traffic; supports flexible identifier filtering (2×32-bit, 4×16-bit, or 8×8-bit) |
| Temperature sensor channel | Integrated diode-based sensor with calibration data in Flash enables accurate ambient temperature measurement without external components |
Applications
| Automotive Body Control Module | Industrial CAN Node Controller |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in 12 V vehicle platforms. IC Role / Device Role / Timing Role: Main MCU managing CAN message routing, PWM motor control, analog sensor acquisition (e.g., ambient light, temperature), and LIN slave communication with actuators. Use Value: Integrated MSCAN, dual SCI (for LIN), and 24-channel ADC eliminate need for external interface ICs and reduce BOM count by ≥3 components. | Use Scenario: Distributed I/O node in factory automation systems communicating via CANopen or DeviceNet. IC Role / Device Role / Timing Role: Real-time controller acquiring analog process signals (4–20 mA loop inputs), driving relay outputs, and maintaining synchronized CAN messaging with deterministic latency. Use Value: 2 KB EEPROM with sector erase abort ensures reliable parameter storage during power interruption; Stop3-mode RTC wake-up enables periodic sensor polling without external timer. |
| Smart HVAC Actuator | Off-Road Equipment Monitor |
Use Scenario: Motorized damper and valve control in commercial HVAC systems with CAN-based building management integration. IC Role / Device Role / Timing Role: Closed-loop position controller using TPM PWM outputs, ADC feedback from potentiometers, and CAN status reporting. Use Value: On-chip 12-bit ADC with automatic compare function triggers immediate PWM correction on position error - reducing software latency by 12–18 μs vs. polled implementation. | Use Scenario: Diagnostic and telemetry unit in agricultural or construction machinery monitoring engine parameters, hydraulic pressure, and battery health. IC Role / Device Role / Timing Role: Fault-tolerant data logger with COP watchdog, low-voltage detect interrupt, and CAN message buffering during transient brownouts. Use Value: Dual-clock COP (bus + 1 kHz internal) guarantees fail-safe reset even during severe supply dips; 60 KB Flash accommodates dual-application firmware images for field update rollback. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ48F2MLC | 48 KB Flash, identical peripherals, package, and pinout; same MCG, ADC, CAN, and debug architecture | Reduced firmware footprint requirement; suitable when application code size < 48 KB and EEPROM/RAM needs unchanged | Select when cost optimization is prioritized and feature set remains sufficient |
| S9S08DZ32F2MLC | 32 KB Flash, same core, memory architecture, and peripheral register map; shares identical 64-pin LQFP package | Targeted at simpler control tasks with minimal communication stack overhead (e.g., basic CAN gateway without diagnostics) | Choose for entry-level implementations where CAN message filtering depth and ADC channel count can be reduced |
Compared with S9S08DZ60F2MLC, the S9S08DZ48F2MLC and S9S08DZ32F2MLC offer identical peripheral functionality and pin compatibility but scale Flash capacity downward - enabling direct migration within the same PCB layout while reducing non-recurring engineering cost for derivative designs.
Availability
S9S08DZ60F2MLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN nodes, smart HVAC actuators, and off-road equipment monitors requiring stable component supply across extended temperature ranges (−40°C to +125°C) and long product lifecycles.
Supply support for S9S08DZ60F2MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The S9S08DZ60F2MLC belongs to the legacy HCS08 DZ-series microcontrollers, designed specifically for cost-sensitive, reliability-critical automotive body electronics and industrial control applications requiring integrated CAN, LIN, and mixed-signal peripherals.
FAQ
What is the maximum operating frequency of the S9S08DZ60F2MLC CPU core?
The S9S08DZ60F2MLC CPU core operates at a maximum frequency of 40 MHz, while the system bus runs at up to 20 MHz. This performance is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, with factory-trimmed internal reference clock support. The S9S08DZ60F2MLC maintains this timing across its full industrial temperature range (−40°C to +125°C) and supply voltage range (2.7–5.5 V).
Does the S9S08DZ60F2MLC support CAN FD or only classical CAN?
The S9S08DZ60F2MLC supports only classical CAN per ISO 11898-1 (CAN 2.0A/B), not CAN FD. Its MSCAN module implements standard and extended data frames, remote frames, five receive buffers with FIFO, and flexible identifier filtering - all compliant with CAN 2.0 specification. CAN FD features such as variable bit rates and extended data length are absent in the S9S08DZ60F2MLC hardware architecture.
How much EEPROM does the S9S08DZ60F2MLC include, and what are its erase characteristics?
The S9S08DZ60F2MLC includes 2 KB of on-chip EEPROM with in-circuit programmability. Erase operations support 8-byte single-page or 4-byte dual-page sectors, and erase abort is supported. The S9S08DZ60F2MLC allows simultaneous program/erase while executing Flash code - enabling robust data logging and parameter storage without halting application execution.
Is the S9S08DZ60F2MLC pin-compatible with other members of the DZ-series?
Yes, the S9S08DZ60F2MLC in the 64-pin LQFP package is pin-compatible with MC9S08DZ48F2MLC and MC9S08DZ32F2MLC in the same package variant. All share identical peripheral pin mappings, power/ground assignments, and debug interface signaling - enabling hardware reuse across firmware variants with different Flash sizes. Pin compatibility does not extend to 48-pin or 32-pin LQFP variants.
What debug interface does the S9S08DZ60F2MLC use, and is JTAG supported?
The S9S08DZ60F2MLC uses a single-wire background debug (BDM) interface, not JTAG. It supports on-chip in-circuit emulation (ICE) with real-time bus capture, breakpoint setting, and memory access via the BKGD/MS pin. JTAG is not implemented; all debug and programming functions are handled exclusively through the BDM protocol, which requires compatible Freescale/NXP debug probes such as the OSBDM or standalone BDM interfaces.
S9S08DZ60F2MLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 25
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DZ60F2MLC FAQ
1.How can I place an order for S9S08DZ60F2MLC through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DZ60F2MLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DZ60F2MLC reliable?
The price and inventory of S9S08DZ60F2MLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ60F2MLC is usually 5 days.
3.What payment methods are accepted for S9S08DZ60F2MLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DZ60F2MLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08DZ60F2MLC?
S9S08DZ60F2MLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08DZ60F2MLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08DZ60F2MLC?
For technical support, including S9S08DZ60F2MLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ60F2MLC requirements.
6.How does Aetrix verify that S9S08DZ60F2MLC is sourced from the original manufacturer or authorized distributors?
All S9S08DZ60F2MLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ60F2MLC meets industry standards.
7.What is the process for return or replacement of S9S08DZ60F2MLC?
All S9S08DZ60F2MLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ60F2MLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DZ60F2MLC part is unused and in its original packaging.
Return procedure for S9S08DZ60F2MLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S08DZ60F2MLC Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

