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NXP Semiconductors S9S08DZ60F2MLC

Part No.:
S9S08DZ60F2MLC
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixS9S08DZ60F2MLC.pdf
Description:
IC MCU 8BIT 60KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,379

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Product details

Overview

S9S08DZ60F2MLC from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip Flash, 4 KB RAM, and 2 KB EEPROM, operating at up to 40 MHz CPU / 20 MHz bus frequency. It integrates CAN 2.0A/B, dual SCI with LIN 2.0 support, 12-bit 24-channel ADC, two analog comparators, RTC, and six-channel TPM - designed for automotive body electronics and industrial control nodes requiring robust communication and mixed-signal processing.

For engineers reviewing the S9S08DZ60F2MLC datasheet, S9S08DZ60F2MLC pinout, S9S08DZ60F2MLC application, or S9S08DZ60F2MLC equivalent, key selection criteria include CAN protocol compliance, in-circuit programmable EEPROM with erase abort, single-wire background debug interface, real-time interrupt capability in Stop3 mode, and factory-trimmed internal reference clock with stored trim value in Flash.

Technical Context

The S9S08DZ60F2MLC implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and executing instructions at 40 MHz core speed (20 MHz bus). Its Multi-Purpose Clock Generator (MCG) provides FLL and PLL modes with ±1.5% FLL accuracy using internal temperature compensation and includes a factory-trimmed internal reference clock.

System-level protection includes COP watchdog with dual-clock source option (1 kHz backup or bus clock), low-voltage detect with configurable trip points, illegal opcode/address detection, Flash block protect, and loss-of-lock monitoring. Peripherals are fully functional in Run, Wait, and Stop3 modes - including MSCAN, ADC, ACMP, and RTC - enabling deterministic low-power operation without peripheral disable overhead.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core with BGND instruction; executes at 40 MHz max, 20 MHz bus clock
Flash Memory60 KB on-chip Flash with read/program/erase over full voltage/temperature range
EEPROM2 KB in-circuit programmable EEPROM with 8-byte single-page or 4-byte dual-page erase sectors
RAM4 KB on-chip RAM for data and stack storage
CAN InterfaceMSCAN module compliant with ISO 11898-1 (CAN 2.0A/B); supports standard/extended frames and remote frames
ADC12-bit, 24-channel SAR ADC with 2.5 μs conversion time, internal bandgap reference, and temperature sensor channel
Debug InterfaceSingle-wire background debug (BDM) interface with on-chip in-circuit emulation (ICE) and real-time bus capture

Pinout & Package

Package: 64-pin LQFP (10 × 10 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDADPower supply inputsSeparate digital (VDD), analog (VDDA), and ADC (VDDAD) supplies enable noise isolation for mixed-signal operation
VSS, VSSA, VSSADGround returnsDedicated analog and ADC ground pins minimize coupling of digital switching noise into sensitive analog paths
XTAL, EXTALClock oscillator terminalsSupport crystal or ceramic resonator (1–16 MHz or 31.25 kHz–38.4 kHz) for precise system timing
BKGD/MSBackground debug / mode selectSingle-wire BDM interface pin; also selects active background mode during reset
RESETActive-low reset inputAsynchronous reset with internal pull-up; accepts external reset assertion or internal COP/LVD reset
CANL, CANHCAN bus differential pairDirect connection to ISO 11898-compliant transceiver; supports high-speed CAN up to 1 Mbps
SCI0_TX, SCI0_RXSerial communication interfaceFull-duplex NRZ UART supporting LIN 2.0 and SAE J2602 protocols with master break generation
AD0–AD23Analog input channels24 multiplexed ADC inputs with configurable hysteresis, pull devices, and slew rate control

Key Features

FeatureDesign Value
Real-time interrupt in Stop3 modeEnables wake-up from deepest low-power state using internal 1 kHz oscillator - no external crystal required
Program/erase while executing FlashAllows firmware updates and data logging without halting application code execution
Factory-trimmed internal reference clockTrim value stored in Flash enables consistent 1–16 MHz MCG operation across temperature and voltage without external components
Five CAN receive buffers with FIFOReduces CPU load during burst CAN traffic; supports flexible identifier filtering (2×32-bit, 4×16-bit, or 8×8-bit)
Temperature sensor channelIntegrated diode-based sensor with calibration data in Flash enables accurate ambient temperature measurement without external components

Applications

Automotive Body Control ModuleIndustrial CAN Node Controller

Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in 12 V vehicle platforms.

IC Role / Device Role / Timing Role: Main MCU managing CAN message routing, PWM motor control, analog sensor acquisition (e.g., ambient light, temperature), and LIN slave communication with actuators.

Use Value: Integrated MSCAN, dual SCI (for LIN), and 24-channel ADC eliminate need for external interface ICs and reduce BOM count by ≥3 components.

Use Scenario: Distributed I/O node in factory automation systems communicating via CANopen or DeviceNet.

IC Role / Device Role / Timing Role: Real-time controller acquiring analog process signals (4–20 mA loop inputs), driving relay outputs, and maintaining synchronized CAN messaging with deterministic latency.

Use Value: 2 KB EEPROM with sector erase abort ensures reliable parameter storage during power interruption; Stop3-mode RTC wake-up enables periodic sensor polling without external timer.

Smart HVAC ActuatorOff-Road Equipment Monitor

Use Scenario: Motorized damper and valve control in commercial HVAC systems with CAN-based building management integration.

IC Role / Device Role / Timing Role: Closed-loop position controller using TPM PWM outputs, ADC feedback from potentiometers, and CAN status reporting.

Use Value: On-chip 12-bit ADC with automatic compare function triggers immediate PWM correction on position error - reducing software latency by 12–18 μs vs. polled implementation.

Use Scenario: Diagnostic and telemetry unit in agricultural or construction machinery monitoring engine parameters, hydraulic pressure, and battery health.

IC Role / Device Role / Timing Role: Fault-tolerant data logger with COP watchdog, low-voltage detect interrupt, and CAN message buffering during transient brownouts.

Use Value: Dual-clock COP (bus + 1 kHz internal) guarantees fail-safe reset even during severe supply dips; 60 KB Flash accommodates dual-application firmware images for field update rollback.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit CAN microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08DZ48F2MLC48 KB Flash, identical peripherals, package, and pinout; same MCG, ADC, CAN, and debug architectureReduced firmware footprint requirement; suitable when application code size < 48 KB and EEPROM/RAM needs unchangedSelect when cost optimization is prioritized and feature set remains sufficient
S9S08DZ32F2MLC32 KB Flash, same core, memory architecture, and peripheral register map; shares identical 64-pin LQFP packageTargeted at simpler control tasks with minimal communication stack overhead (e.g., basic CAN gateway without diagnostics)Choose for entry-level implementations where CAN message filtering depth and ADC channel count can be reduced

Compared with S9S08DZ60F2MLC, the S9S08DZ48F2MLC and S9S08DZ32F2MLC offer identical peripheral functionality and pin compatibility but scale Flash capacity downward - enabling direct migration within the same PCB layout while reducing non-recurring engineering cost for derivative designs.

Availability

S9S08DZ60F2MLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN nodes, smart HVAC actuators, and off-road equipment monitors requiring stable component supply across extended temperature ranges (−40°C to +125°C) and long product lifecycles.

Supply support for S9S08DZ60F2MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The S9S08DZ60F2MLC belongs to the legacy HCS08 DZ-series microcontrollers, designed specifically for cost-sensitive, reliability-critical automotive body electronics and industrial control applications requiring integrated CAN, LIN, and mixed-signal peripherals.

FAQ

What is the maximum operating frequency of the S9S08DZ60F2MLC CPU core?

The S9S08DZ60F2MLC CPU core operates at a maximum frequency of 40 MHz, while the system bus runs at up to 20 MHz. This performance is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PLL or FLL mode, with factory-trimmed internal reference clock support. The S9S08DZ60F2MLC maintains this timing across its full industrial temperature range (−40°C to +125°C) and supply voltage range (2.7–5.5 V).

Does the S9S08DZ60F2MLC support CAN FD or only classical CAN?

The S9S08DZ60F2MLC supports only classical CAN per ISO 11898-1 (CAN 2.0A/B), not CAN FD. Its MSCAN module implements standard and extended data frames, remote frames, five receive buffers with FIFO, and flexible identifier filtering - all compliant with CAN 2.0 specification. CAN FD features such as variable bit rates and extended data length are absent in the S9S08DZ60F2MLC hardware architecture.

How much EEPROM does the S9S08DZ60F2MLC include, and what are its erase characteristics?

The S9S08DZ60F2MLC includes 2 KB of on-chip EEPROM with in-circuit programmability. Erase operations support 8-byte single-page or 4-byte dual-page sectors, and erase abort is supported. The S9S08DZ60F2MLC allows simultaneous program/erase while executing Flash code - enabling robust data logging and parameter storage without halting application execution.

Is the S9S08DZ60F2MLC pin-compatible with other members of the DZ-series?

Yes, the S9S08DZ60F2MLC in the 64-pin LQFP package is pin-compatible with MC9S08DZ48F2MLC and MC9S08DZ32F2MLC in the same package variant. All share identical peripheral pin mappings, power/ground assignments, and debug interface signaling - enabling hardware reuse across firmware variants with different Flash sizes. Pin compatibility does not extend to 48-pin or 32-pin LQFP variants.

What debug interface does the S9S08DZ60F2MLC use, and is JTAG supported?

The S9S08DZ60F2MLC uses a single-wire background debug (BDM) interface, not JTAG. It supports on-chip in-circuit emulation (ICE) with real-time bus capture, breakpoint setting, and memory access via the BKGD/MS pin. JTAG is not implemented; all debug and programming functions are handled exclusively through the BDM protocol, which requires compatible Freescale/NXP debug probes such as the OSBDM or standalone BDM interfaces.

S9S08DZ60F2MLC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
32-LQFP
Series:
S08
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
25
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
4K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08DZ60F2MLC FAQ

1.How can I place an order for S9S08DZ60F2MLC through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08DZ60F2MLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08DZ60F2MLC reliable?

The price and inventory of S9S08DZ60F2MLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ60F2MLC is usually 5 days.

3.What payment methods are accepted for S9S08DZ60F2MLC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DZ60F2MLC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08DZ60F2MLC?

S9S08DZ60F2MLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08DZ60F2MLC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08DZ60F2MLC?

For technical support, including S9S08DZ60F2MLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ60F2MLC requirements.

6.How does Aetrix verify that S9S08DZ60F2MLC is sourced from the original manufacturer or authorized distributors?

All S9S08DZ60F2MLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ60F2MLC meets industry standards.

7.What is the process for return or replacement of S9S08DZ60F2MLC?

All S9S08DZ60F2MLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ60F2MLC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08DZ60F2MLC part is unused and in its original packaging.

Return procedure for S9S08DZ60F2MLC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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