NXP Semiconductors S9S08DZ60F2MLF
- Part No.:
- S9S08DZ60F2MLF
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
S9S08DZ60F2MLF.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 48LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08DZ60F2MLF from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller designed for automotive and industrial embedded control. It features a 40-MHz CPU (20-MHz bus), 60 KB on-chip Flash, 4 KB RAM, and integrated CAN 2.0A/B controller, 24-channel 12-bit ADC, and dual SCI/LIN interfaces - deployed in engine control modules and body electronics requiring real-time deterministic response.
For engineers reviewing the S9S08DZ60F2MLF datasheet, S9S08DZ60F2MLF pinout, S9S08DZ60F2MLF application, or S9S08DZ60F2MLF equivalent, key selection criteria include CAN protocol compliance, Flash memory size, stop-mode power consumption, ADC resolution and channel count, and background debug interface support.
Technical Context
The S9S08DZ60F2MLF implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) provides FLL- and PLL-based clock synthesis with ±1.5% accuracy using internal temperature compensation and factory-trimmed reference.
On-chip peripherals include MSCAN with five receive buffers and programmable identifier filters (2×32-bit, 4×16-bit, or 8×8-bit), two SCIs compliant with LIN 2.0 and SAE J2602, and a 6-channel + 2-channel TPM system supporting input capture, output compare, and edge-aligned PWM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core, 40-MHz operation (20-MHz bus speed) - enables deterministic real-time control with sub-μs interrupt latency |
| Flash Memory | 60 KB on-chip Flash, read/program/erase over full voltage/temperature range - supports field firmware updates without external programming hardware |
| RAM | 4 KB SRAM - sufficient for stack, variables, and real-time data buffering in automotive sensor fusion applications |
| ADC | 24-channel, 12-bit SAR ADC with 2.5 μs conversion time and internal temperature sensor - enables high-precision analog monitoring of engine parameters |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B), with five FIFO receive buffers and flexible ID filtering - meets automotive network node requirements |
| I/O Pins | 53 general-purpose I/O pins + 1 input-only pin, with configurable pull, slew rate, and drive strength - supports direct connection to sensors, actuators, and LIN transceivers |
| Debug Interface | Single-wire background debug (BDM) - allows in-circuit emulation, real-time bus capture, and non-intrusive firmware debugging |
Pinout & Package
Package: 64-pin LQFP (10 × 10 mm), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual-supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) - enable noise-isolated ADC operation |
| XTAL, EXTAL | Crystal oscillator inputs | Support 1–16 MHz crystal or ceramic resonator - provides stable timing source for CAN bit timing and RTC |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication and reset-triggered entry into active background mode - eliminates need for dedicated JTAG header |
| VREFH, VREFL | ADC reference inputs | Accept external precision reference or internal bandgap - ensures consistent 12-bit ADC accuracy across temperature and supply variation |
| CANH, CANL | CAN differential bus interface | Direct connection to ISO 11898-compliant transceiver - enables robust 1 Mbps automotive network node implementation |
| SCI1_TX, SCI1_RX | LIN 2.0 serial interface | Hardware-supported LIN master/slave operation with extended break generation/detection - satisfies SAE J2602 physical layer requirements |
Key Features
| Feature | Design Value |
|---|---|
| Two very low-power stop modes (Stop2/Stop3) | Enables <1 μA current draw during vehicle sleep mode while retaining RAM and wake-up capability via RTC or CAN activity |
| Real-time counter (RTC) with 1 kHz internal oscillator | Provides autonomous cyclic wake-up without external crystal - reduces BOM cost and board space in battery-backed modules |
| On-chip EEPROM (2 KB) | Supports 8-byte single-page or 4-byte dual-page erase - enables reliable storage of calibration data and fault logs with wear leveling |
| Watchdog COP with backup 1-kHz clock | Guarantees fail-safe reset even if main clock fails - critical for ASIL-B–compliant safety mechanisms |
| Flash block protection and security | Prevents unauthorized read-out or reprogramming of firmware - satisfies OEM requirements for intellectual property and cybersecurity protection |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
Use Scenario: Real-time acquisition of crankshaft position, throttle angle, and coolant temperature; closed-loop fuel injection timing control. IC Role / Device Role / Timing Role: Primary MCU executing control algorithms, managing CAN diagnostics, and synchronizing actuator outputs with engine cycle timing. Use Value: 20-MHz bus speed and deterministic interrupt latency ensure sub-degree spark timing accuracy; MSCAN and dual SCI support OBD-II and LIN-sensor networks. | Use Scenario: Centralized management of door locks, lighting, wipers, and HVAC via distributed LIN nodes and CAN backbone. IC Role / Device Role / Timing Role: System coordinator with CAN message routing, LIN master arbitration, and real-time PWM dimming control. Use Value: 53 GPIOs drive relays and LEDs directly; RTC enables scheduled interior light fade-out; Flash size accommodates multi-variant firmware builds. |
| Transmission Control Module (TCM) | Advanced Driver Assistance Systems (ADAS) Sensor Interface |
Use Scenario: Monitoring gear selector position, turbine speed, and solenoid valve status; implementing shift logic and torque converter clutch control. IC Role / Device Role / Timing Role: Safety-critical controller interfacing with CAN bus, analog pressure sensors, and PWM-controlled hydraulic valves. Use Value: ASIL-B–capable watchdog, Flash security, and redundant ADC channels ensure functional safety compliance; 60 KB Flash hosts complex shift maps and diagnostic routines. | Use Scenario: Signal conditioning and preprocessing of radar/LiDAR proximity sensor outputs before forwarding to central ADAS ECU. IC Role / Device Role / Timing Role: Edge-node signal aggregator with analog front-end, CAN gateway, and low-power wake-on-event capability. Use Value: 24-channel ADC resolves multiple sensor inputs simultaneously; Stop3 mode draws <1 μA during standby; CAN filtering isolates relevant object detection messages. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ48F2MLF | 48 KB Flash, otherwise identical peripheral set and pinout | Reduced firmware footprint requirement; suitable for simpler BCM or LIN gateway functions | Select when application code size fits within 48 KB and cost optimization is prioritized |
| S9S08DZ32F2MLF | 32 KB Flash, same package and core architecture | Targeted at entry-level body electronics with minimal feature sets and no OTA update requirement | Choose for cost-sensitive modules where 32 KB Flash suffices and CAN+ADC+LIN concurrency is not required |
Compared with MC9S08DZ48F2MLF and S9S08DZ32F2MLF, the S9S08DZ60F2MLF provides 12 KB and 28 KB more Flash respectively - enabling larger control algorithms, bootloader + application separation, and future firmware expansion without hardware redesign.
Availability
S9S08DZ60F2MLF is available at Aetrix Electronics and suitable for automotive engine control, body electronics, and transmission systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified silicon.
Supply support for S9S08DZ60F2MLF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontroller innovation through its acquisition of Freescale.
The S9S08DZ60F2MLF belongs to the HCS08 DZ-series, engineered specifically for cost-sensitive, functionally safe automotive body and powertrain control applications demanding CAN, LIN, high-resolution ADC, and ultra-low-power stop modes.
FAQ
What is the maximum operating frequency of the S9S08DZ60F2MLF CPU core?
The S9S08DZ60F2MLF features an HCS08 CPU core rated for up to 40 MHz, delivering a 20-MHz bus clock frequency. This performance level supports real-time execution of automotive control loops with predictable timing behavior, and is validated across the full industrial temperature range (−40°C to +125°C) per the official datasheet specifications.
Does the S9S08DZ60F2MLF support CAN FD or only classical CAN?
The S9S08DZ60F2MLF integrates the MSCAN module compliant exclusively with ISO 11898-1 CAN 2.0A/B (classical CAN), supporting standard and extended frames up to 1 Mbps. It does not implement CAN FD features such as flexible data-rate or enhanced payload length - those require later-generation S32K or MagniV families.
How much EEPROM is available on the S9S08DZ60F2MLF, and what are its erase characteristics?
The S9S08DZ60F2MLF includes 2 KB of on-chip EEPROM with sector-based erase: 8-byte single-page or 4-byte dual-page granularity. Erase operations can be aborted, and both program and erase execute while Flash code runs - enabling safe logging of calibration data or fault records without halting application execution.
Is the S9S08DZ60F2MLF pin-compatible with other members of the DZ-series like the S9S08DZ48F2MLF?
Yes - the S9S08DZ60F2MLF in the 64-pin LQFP package shares identical pinout, electrical characteristics, and peripheral register mapping with S9S08DZ48F2MLF and S9S08DZ32F2MLF. This allows hardware reuse across variants, where firmware differentiation is managed solely by Flash capacity and optional feature enablement.
What debug interface does the S9S08DZ60F2MLF use, and is JTAG supported?
The S9S08DZ60F2MLF uses a single-wire background debug (BDM) interface for programming and real-time emulation - not JTAG. This interface operates via the BKGD/MS pin and supports non-intrusive breakpoints, memory inspection, and on-chip ICE with bus capture, as documented in the Freescale HCS08 BDM specification and S9S08DZ60F2MLF reference manuals.
S9S08DZ60F2MLF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DZ60F2MLF FAQ
1.How can I place an order for S9S08DZ60F2MLF through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DZ60F2MLF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DZ60F2MLF reliable?
The price and inventory of S9S08DZ60F2MLF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ60F2MLF is usually 5 days.
3.What payment methods are accepted for S9S08DZ60F2MLF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DZ60F2MLF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08DZ60F2MLF?
S9S08DZ60F2MLF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08DZ60F2MLF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08DZ60F2MLF?
For technical support, including S9S08DZ60F2MLF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ60F2MLF requirements.
6.How does Aetrix verify that S9S08DZ60F2MLF is sourced from the original manufacturer or authorized distributors?
All S9S08DZ60F2MLF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ60F2MLF meets industry standards.
7.What is the process for return or replacement of S9S08DZ60F2MLF?
All S9S08DZ60F2MLF units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ60F2MLF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DZ60F2MLF part is unused and in its original packaging.
Return procedure for S9S08DZ60F2MLF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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