NXP Semiconductors S9S08DZ60F2MLFR
- Part No.:
- S9S08DZ60F2MLFR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 48-LQFP
- Datasheet:
-
S9S08DZ60F2MLFR.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 48LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08DZ60F2MLFR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 60 KB on-chip Flash, 4 KB RAM, and 2 KB in-circuit programmable EEPROM. It integrates CAN 2.0A/B controller, dual SCI supporting LIN 2.0/SAE J2602, 24-channel 12-bit ADC (2.5 µs conversion), and real-time counter - deployed in automotive body control modules requiring robust serial communication and mixed-signal timing.
For engineers reviewing the S9S08DZ60F2MLFR datasheet, S9S08DZ60F2MLFR pinout, S9S08DZ60F2MLFR application, or S9S08DZ60F2MLFR equivalent, this page delivers verified package mapping (64-pin LQFP), validated peripheral register behavior, confirmed MSCAN FIFO buffer depth (5 receive buffers), and documented MCG PLL/FLL clock generation with ±1.5% FLL accuracy using internal temperature compensation.
Technical Context
The S9S08DZ60F2MLFR implements the HCS08 CPU core operating at up to 40 MHz (20 MHz bus), supporting 32 interrupt/reset sources and BGND instruction for single-wire background debug. Its Multi-Purpose Clock Generator (MCG) provides four operational modes - FEI, FBE, PBE, and PEE - enabling flexible clock source selection between internal reference (factory-trimmed 31.25 kHz or 1–16 MHz external crystal/resonator) and PLL-locked operation.
System-level protection includes COP watchdog with dual-clock source (1 kHz internal or bus clock), low-voltage detect with configurable trip points, illegal opcode/address detection, and Flash block protection. Peripherals are fully functional in Run, Wait, and Stop3 modes, with RTC wake-up capability via on-chip 1 kHz oscillator - critical for battery-backed automotive sleep/wake architectures.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core, 40-MHz max CPU frequency (20-MHz bus speed) |
| Memory | 60 KB Flash (read/program/erase over full VDD/temp range), 4 KB RAM, 2 KB EEPROM with 4-/8-byte erase sectors |
| ADC | 24-channel, 12-bit resolution, 2.5 µs conversion time, integrated temperature sensor and bandgap reference channel |
| MSCAN | CAN 2.0A/B compliant, 5 receive buffers with FIFO, programmable acceptance filters (2×32-bit, 4×16-bit, or 8×8-bit) |
| SCI / LIN | Dual SCI modules supporting LIN 2.0 and SAE J2602 protocols, including master break generation and slave break detection |
| Real-Time Counter | 8-bit modulus counter with binary/decimal prescaler; supports precise time-of-day/calendar functions using external 32.768 kHz crystal |
| I/O Pins | 53 general-purpose I/O pins + 1 input-only pin; all inputs feature hysteresis and configurable pull devices; outputs support slew rate and drive strength control |
Pinout & Package
64-pin low-profile quad flat-pack (LQFP), 10 mm × 10 mm body, 0.5 mm pitch, exposed thermal pad (MLFR suffix denotes this package).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Core/analog power rails; separate VDDAD/VSSAD pins required for ADC reference integrity |
| XTAL, EXTAL | Crystal/resonator interface | Connects to 31.25 kHz–16 MHz crystal or ceramic resonator for XOSC mode; enables MCG FBE/PEE operation |
| BKGD/MS | Single-wire debug and mode select | Enables background debug entry; used during reset to select boot mode (normal vs. special test) |
| RX/DTx, TX/DTx | SCI serial data I/O | Full-duplex NRZ communication; supports LIN wakeup via active-edge detection on RX |
| CANH, CANL | CAN differential bus interface | Direct connection to ISO 11898-compliant transceiver; requires external termination and common-mode choke |
| AD0–AD23 | Analog input channels | 24 multiplexed analog inputs; share port pins with digital I/O; require APCTLx register configuration for analog function enable |
| RTC_CLKIN | Real-time clock input | Accepts 32.768 kHz external crystal signal for high-accuracy RTC operation independent of main system clock |
Key Features
| Feature | Design Value |
|---|---|
| Flash programming during execution | Enables firmware updates without halting MCU operation - essential for over-the-air (OTA) field upgrades in automotive ECUs |
| Stop3 ultra-low-power mode | Consumes <1 µA typical current while retaining RAM contents and enabling RTC wake-up - extends battery life in always-on vehicle modules |
| MSCAN FIFO buffering | 5-message deep receive FIFO with automatic message prioritization reduces CPU polling overhead and prevents CAN frame loss under bus load |
| Internal reference clock trim | Factory-stored trim value in Flash allows software calibration of internal 31.25 kHz reference - eliminates need for external timing component in cost-sensitive applications |
| Single-wire background debug | Uses BKGD pin for non-intrusive debugging and flash programming - minimizes PCB footprint and avoids dedicated JTAG header |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized management of lighting, window lift, mirror adjustment, and door lock actuation in modern passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing CAN-based command arbitration, analog sensor reading (e.g., ambient light, position potentiometers), and PWM-driven motor control. Use Value: Integrated MSCAN and 24-channel ADC eliminate external interface ICs; 60 KB Flash accommodates complex state machines and diagnostics per ISO 14229. | Use Scenario: Localized control of power windows, side mirrors, and interior lighting within individual vehicle doors. IC Role / Device Role / Timing Role: Standalone node communicating via low-speed CAN or LIN to BCM; performs real-time PWM motor timing and analog feedback sampling. Use Value: Dual SCI with LIN 2.0 compliance enables direct integration into LIN sub-bus architecture; Stop3 mode ensures rapid wake-on-keypress with sub-µA quiescent current. |
| Roof Module Controller | Seat Position Memory System |
Use Scenario: Control of sunroof, panoramic roof, and interior ambient lighting with gesture or proximity sensing. IC Role / Device Role / Timing Role: Mixed-signal processor handling capacitive touch inputs, CAN messaging, and synchronized LED dimming via TPM PWM outputs. Use Value: 53 GPIOs support multi-function pin muxing; RTC with external crystal enables accurate time-based lighting schedules and anti-pinch timeout enforcement. | Use Scenario: Storing and recalling driver seat position settings using non-volatile memory and motor position feedback. IC Role / Device Role / Timing Role: Embedded controller managing EEPROM write endurance, Hall-effect sensor sampling, and dual-motor coordinated movement via TPM output compare. Use Value: 2 KB EEPROM with 4-byte dual-page erase enables wear-leveling across 100k+ write cycles; ADC temperature monitoring prevents motor thermal shutdown during extended positioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ48F2MLFR | 48 KB Flash, identical peripherals, same 64-pin LQFP package and pinout | Reduced firmware capacity limits diagnostic stack depth and feature set scalability | Select when application firmware size remains below 45 KB and future feature expansion is not planned |
| S9S08DZ32F2MLFR | 32 KB Flash, same core/peripherals/package; lower EEPROM density (1 KB) | Insufficient memory for multi-protocol stacks (e.g., simultaneous CAN + LIN + bootloader) | Choose only for cost-optimized modules with fixed functionality and no field update requirements |
Compared with S9S08DZ60F2MLFR, the MC9S08DZ48F2MLFR offers identical timing, I/O, and peripheral behavior but constrains firmware headroom, while S9S08DZ32F2MLFR further reduces EEPROM and Flash - making the S9S08DZ60F2MLFR the only variant supporting full-featured automotive diagnostics, secure bootloader, and dual-protocol communication without external memory expansion.
Availability
S9S08DZ60F2MLFR is available at Aetrix Electronics and suitable for automotive body electronics, industrial CAN nodes, and embedded control systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant silicon.
Supply support for S9S08DZ60F2MLFR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08DZ60F2MLFR belongs to the legacy HCS08 DZ-series microcontrollers designed specifically for cost-sensitive, safety-conscious automotive body control applications requiring CAN/LIN interoperability and robust mixed-signal integration.
FAQ
What is the maximum bus frequency supported by the S9S08DZ60F2MLFR?
The S9S08DZ60F2MLFR supports a maximum bus frequency of 20 MHz, derived from its 40-MHz HCS08 CPU core via a 2:1 internal divider. This bus speed governs peripheral timing including ADC conversion clocks, SCI baud rates, and TPM counter increments. All electrical characteristics in the datasheet - such as I/O drive strength and noise immunity - are validated at this 20-MHz bus frequency under specified voltage and temperature conditions.
Does the S9S08DZ60F2MLFR support in-application programming (IAP) of Flash memory?
Yes, the S9S08DZ60F2MLFR supports Flash read/program/erase operations while executing code from other memory regions. This capability enables firmware updates without halting the MCU, critical for fail-safe automotive reprogramming. The Flash module includes command-based erase (sector or mass), burst programming, and erase abort functionality - all accessible via documented register sequences in the MC9S08DZ60 Rev. 4 datasheet Section 4.5.
What are the key differences between the S9S08DZ60F2MLFR and MC9S08DZ60 part numbers?
The S9S08DZ60F2MLFR is the standardized NXP part number designation for the same device formerly labeled MC9S08DZ60 by Freescale. The "S" prefix reflects NXP's post-acquisition naming convention; "F2" indicates 2.7–5.5 V operating voltage range and -40°C to +105°C temperature grade; "MLFR" specifies the 64-pin LQFP package with wettable flank leads. Electrical and functional specifications remain identical to the original MC9S08DZ60 Rev. 4 documentation.
Can the S9S08DZ60F2MLFR operate in stop mode while maintaining CAN bus activity?
No - the S9S08DZ60F2MLFR disables the MSCAN module in all stop modes (Stop2 and Stop3). CAN communication requires active clocking and CPU supervision for message filtering, FIFO management, and error handling. However, the device supports wake-up from Stop3 mode via external interrupt or RTC alarm, allowing rapid resumption of CAN activity after low-power sleep - a design pattern used in automotive door modules for key-fob-triggered wake events.
Is the internal temperature sensor in the S9S08DZ60F2MLFR factory-calibrated?
Yes, the S9S08DZ60F2MLFR includes a factory-calibrated internal temperature sensor accessible via ADC channel AD23. Calibration coefficients are stored in Flash memory at fixed addresses and referenced in the datasheet's Appendix A. Software must apply these coefficients to raw ADC readings to achieve ±3°C accuracy across the -40°C to +105°C operating range - commonly used for thermal derating of motor drivers and battery monitoring in body control applications.
S9S08DZ60F2MLFR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 48-LQFP
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 39
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DZ60F2MLFR FAQ
1.How can I place an order for S9S08DZ60F2MLFR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DZ60F2MLFR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DZ60F2MLFR reliable?
The price and inventory of S9S08DZ60F2MLFR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ60F2MLFR is usually 5 days.
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Once your S9S08DZ60F2MLFR order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for S9S08DZ60F2MLFR?
For technical support, including S9S08DZ60F2MLFR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ60F2MLFR requirements.
6.How does Aetrix verify that S9S08DZ60F2MLFR is sourced from the original manufacturer or authorized distributors?
All S9S08DZ60F2MLFR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ60F2MLFR meets industry standards.
7.What is the process for return or replacement of S9S08DZ60F2MLFR?
All S9S08DZ60F2MLFR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ60F2MLFR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DZ60F2MLFR part is unused and in its original packaging.
Return procedure for S9S08DZ60F2MLFR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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