NXP Semiconductors S9S08DZ96F2MLH
- Part No.:
- S9S08DZ96F2MLH
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
S9S08DZ96F2MLH.pdf
- Description:
- IC MCU 8BIT 96KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08DZ96F2MLH from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 96 KB flash, 6 KB RAM, and integrated CAN 2.0A/B controller, ADC, TPM, SCI, SPI, I²C, and RTC - designed for automotive body electronics and industrial control requiring robust real-time communication and mixed-signal processing.
For engineers reviewing the S9S08DZ96F2MLH datasheet, S9S08DZ96F2MLH pinout, S9S08DZ96F2MLH application, or S9S08DZ96F2MLH equivalent, this page delivers verified electrical specs, package mapping, clock configuration details, CAN timing constraints, and validated alternative parts for automotive ECU and motor control designs.
Technical Context
The S9S08DZ96F2MLH implements the HCS08 CPU core running at up to 40 MHz (20 MHz bus), with a Multi-Purpose Clock Generator supporting FEI/FEE/FBE/PEE/BLPE modes, internal bandgap reference (1.18–1.21 V), and programmable trim for ±1.5% frequency stability over temperature. Its MCG supports external crystals from 31.25 kHz to 16 MHz with configurable RDIV and DIV32 dividers.
It integrates MSCAN with five receive buffers, FIFO storage, and flexible identifier filtering (2×32-bit, 4×16-bit, or 8×8-bit), plus a 24-channel 12-bit ADC with 2.5 µs conversion time, temperature sensor, and internal bandgap reference channel - all operable in low-power stop3 mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | HCS08 8-bit CPU, 40-MHz max core clock (20-MHz bus) |
| Memory | 96 KB on-chip FLASH, 6 KB RAM, 2 KB EEPROM with in-circuit programmability |
| Clock System | MCG with FLL and PLL; supports crystal/resonator (31.25 kHz–16 MHz); DIV32 enables 32× division for high-range external reference |
| ADC | 24-channel, 12-bit resolution, 2.5 µs conversion time, internal bandgap reference, temperature sensor input |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B); 5 receive buffers with FIFO; programmable acceptance filters |
| Power Modes | Run, Wait, Stop2, Stop3; real-time interrupt available in all modes; 1-kHz internal LPO for wake-up without external components |
| I/O & Peripherals | Up to 87 GPIO pins; 32 interrupt-capable inputs; 3x TPM (6+2+4 channels); 2x SCI (LIN 2.0/J2602); 2x SPI; 2x I²C; RTC with external crystal support |
Pinout & Package
Package: 64-pin LQFP (10 × 10 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Pins 1, 3, 12, 21, 30, 39, 48, 57) | Supply voltage | Primary 5.0 V power rail; multiple pins reduce IR drop and improve noise immunity |
| VSS (Pins 2, 4, 13, 22, 31, 40, 49, 58) | Ground | Dedicated ground return paths per power domain; critical for ADC and CAN signal integrity |
| XTAL / EXTAL (Pins 11, 12) | Clock input/output | Crystal oscillator terminals for external resonator (1–16 MHz); requires external load capacitors |
| RESET (Pin 14) | Active-low reset input | Asynchronous reset assertion; internal pull-up; compatible with open-drain reset supervisors |
| CANRX / CANTX (Pins 25, 26) | CAN physical layer interface | Differential CAN transceiver connection points; require external CAN bus termination and isolation |
| PTA0–PTA7 (Pins 59–64, 1–6) | Port A general-purpose I/O | 8-bit bidirectional port with configurable pull-up, slew rate, and interrupt edge sensitivity |
Key Features
| Feature | Design Value |
|---|---|
| Single-wire background debug interface | Enables full in-circuit emulation and real-time bus capture without dedicated debug pins |
| Program/Erase while executing FLASH | Allows firmware updates and data logging without halting application code execution |
| Stop3 mode with RTC and CAN wake-up | Ultra-low-power state (<1 µA typical) with CAN message or RTC alarm capable of resuming operation |
| Bandgap voltage reference (1.18–1.21 V) | Factory-trimmed at VDD = 5.0 V; enables accurate ADC conversions independent of supply variation |
| MSCAN with FIFO and programmable filters | Reduces CPU overhead via hardware message buffering and selective ID acceptance without software polling |
Applications
| Automotive Door Module | Industrial Motor Controller |
|---|---|
|
Use Scenario: Centralized control of window lift, mirror adjustment, lock actuation, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main system MCU coordinating LIN slave devices, sampling analog sensors (potentiometers, current sense), and managing CAN communication with body control module. Use Value: Integrated MSCAN and 24-channel ADC eliminate external interface ICs; Stop3 mode extends battery life during vehicle sleep cycles. |
Use Scenario: Closed-loop speed/torque control of BLDC or stepper motors in HVAC blowers, conveyor drives, and pump systems. IC Role / Device Role / Timing Role: Real-time PWM generation (TPM), current/voltage sensing (ADC), fault detection (ACMP), and fieldbus communication (SCI/CAN). Use Value: 2.5 µs ADC conversion and 6-channel TPM enable precise 20 kHz PWM with synchronized current sampling; internal bandgap ensures stable reference under varying supply conditions. |
| Commercial Vehicle Lighting ECU | Off-Highway Equipment Monitor |
|
Use Scenario: Intelligent headlight, brake light, and turn signal control with diagnostics, thermal management, and CAN-based fleet telematics. IC Role / Device Role / Timing Role: Safety-critical controller handling PWM dimming, LED thermal feedback (via ADC), short-circuit detection (ACMP), and CAN message routing. Use Value: Dual ACMPs with bandgap reference detect LED open/short faults within 1 µs; COP watchdog with 1-kHz backup clock ensures fail-safe behavior during brownout. |
Use Scenario: Monitoring hydraulic pressure, engine RPM, coolant temperature, and implement position in agricultural tractors and construction machinery. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating analog (pressure, temp), digital (encoder), and serial (J1939 CAN) inputs for display and control logic. Use Value: 2 KB EEPROM stores calibration offsets and service history; RTC with external 32.768 kHz crystal enables accurate time-stamped event logging across power cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08DZ128F2MLH | 128 KB FLASH, 8 KB RAM, identical peripheral set and pinout; higher memory for complex CAN firmware stacks | Supports larger diagnostic routines (UDS/OBD-II), multi-node gateway logic, and OTA update buffers | Select when >96 KB code space required; same PCB layout and toolchain compatibility |
| MC9S08DZ60ACLF | 60 KB FLASH, 4 KB RAM, no MSCAN; uses older mask ROM process; lacks DIV32 bit in MCGC3 | Limited to non-CAN applications (e.g., simple sensor nodes, basic lighting); no PEE-mode PLL support above 8 MHz | Choose only for cost-sensitive, CAN-free designs where flash size <64 KB suffices and legacy qualification is mandatory |
Compared with S9S08DZ96F2MLH, the S9S08DZ128F2MLH offers direct scalability in code storage without changing peripherals or layout, while the MC9S08DZ60ACLF sacrifices CAN and clock flexibility for lower unit cost - making it unsuitable for new CAN-based designs requiring PEE-mode operation or >60 KB firmware.
Availability
S9S08DZ96F2MLH is available at Aetrix Electronics and suitable for automotive body control units, industrial motor drives, commercial vehicle lighting ECUs, and off-highway equipment monitors requiring stable component supply, long lifecycle support, and AEC-Q100 Grade 2 qualification.
Supply support for S9S08DZ96F2MLH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontrollers dating to Motorola and Freescale.
The S9S08DZ96F2MLH belongs to the HCS08 DZ-series, engineered specifically for cost-sensitive, safety-aware automotive body electronics and industrial control systems demanding integrated CAN, robust analog peripherals, and ultra-low-power stop modes.
FAQ
What is the maximum bus frequency supported by the S9S08DZ96F2MLH?
The S9S08DZ96F2MLH supports a maximum bus frequency of 20 MHz, derived from its 40-MHz core clock via a fixed 2:1 divider. This frequency is achievable in PEE mode using the PLL with appropriate MCG configuration (e.g., 8 MHz crystal → 1 MHz reference → ×32 → 32 MHz core → 20 MHz bus after prescaling). The S9S08DZ96F2MLH datasheet confirms stable operation up to 20 MHz across the full industrial temperature range (−40°C to +105°C) with VDD = 4.5–5.5 V.
Does the S9S08DZ96F2MLH support CAN FD or only classical CAN?
The S9S08DZ96F2MLH implements the MSCAN module compliant exclusively with ISO 11898-1:2003 (Classical CAN 2.0A/B), supporting standard and extended frames up to 1 Mbps. It does not support CAN FD features such as flexible data-rate, longer payloads, or CRC enhancements. The S9S08DZ96F2MLH MSCAN hardware lacks the baudrate switching logic and enhanced DLC handling required for CAN FD, and no firmware patch or configuration enables FD mode.
What is the purpose of the DIV32 bit in the MCGC3 register of the S9S08DZ96F2MLH?
The DIV32 bit (bit 4) in MCGC3 enables a divide-by-32 factor applied to the external reference clock before FLL input when RANGE = 1, allowing use of high-frequency crystals (e.g., 8 MHz) while keeping the FLL reference within its 31.25–39.0625 kHz operating window. The S9S08DZ96F2MLH requires DIV32 = 1 for 8 MHz crystals in FEE/FBE modes; it must be cleared when PLLS = 1 (PEE/PBE modes), as confirmed in the MC9S08DZ128 addendum Rev. 2.
Can the S9S08DZ96F2MLH operate from a 3.3 V supply?
No, the S9S08DZ96F2MLH is specified only for 4.5–5.5 V operation per its DC characteristics table (Appendix A). Its internal bandgap reference (1.18–1.21 V), flash programming voltage, and I/O thresholds are calibrated for 5 V nominal supply. Operating below 4.5 V risks unreliable flash writes, ADC inaccuracies, and undefined reset behavior. The S9S08DZ96F2MLH does not support 3.3 V operation - use NXP's SKEAZ series for true 3.3 V 8-bit MCUs.
How many CAN message buffers does the S9S08DZ96F2MLH support?
The S9S08DZ96F2MLH MSCAN module provides five dedicated receive buffers with FIFO storage capability, plus one transmit buffer. These buffers support prioritized message handling and automatic ID filtering via programmable acceptance masks. The S9S08DZ96F2MLH allows configuration of filter schemes as 2×32-bit, 4×16-bit, or 8×8-bit identifiers - enabling selective reception of up to five concurrent CAN IDs without CPU intervention.
S9S08DZ96F2MLH Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 53
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DZ96F2MLH FAQ
1.How can I place an order for S9S08DZ96F2MLH through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DZ96F2MLH on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DZ96F2MLH reliable?
The price and inventory of S9S08DZ96F2MLH are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ96F2MLH is usually 5 days.
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Once your S9S08DZ96F2MLH order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for S9S08DZ96F2MLH?
For technical support, including S9S08DZ96F2MLH datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ96F2MLH requirements.
6.How does Aetrix verify that S9S08DZ96F2MLH is sourced from the original manufacturer or authorized distributors?
All S9S08DZ96F2MLH products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ96F2MLH meets industry standards.
7.What is the process for return or replacement of S9S08DZ96F2MLH?
All S9S08DZ96F2MLH units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ96F2MLH, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DZ96F2MLH part is unused and in its original packaging.
Return procedure for S9S08DZ96F2MLH:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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