NXP Semiconductors S9S08DZ96F2MLL
- Part No.:
- S9S08DZ96F2MLL
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
S9S08DZ96F2MLL.pdf
- Description:
- IC MCU 8BIT 96KB FLASH 100LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,544
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S08DZ96F2MLL from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 96 KB on-chip FLASH, 6 KB RAM, and 2 KB EEPROM, designed for automotive body electronics and industrial control applications requiring CAN 2.0B communication, real-time PWM, and robust low-voltage operation. It features a 40-MHz CPU core (20-MHz bus), integrated MSCAN module, 24-channel 12-bit ADC, and multi-mode clock generator supporting crystal, resonator, or external clock inputs up to 16 MHz.
For engineers reviewing the S9S08DZ96F2MLL datasheet, S9S08DZ96F2MLL pinout, S9S08DZ96F2MLL application, or S9S08DZ96F2MLL equivalent, this page delivers verified technical context, package mapping, functional alternatives, and supply-chain-ready availability details - all grounded in the official MC9S08DZ128 Series Data Sheet Rev. 1 (2008) and Addenda Rev. 1 & 2 (2011, 2015).
Technical Context
The S9S08DZ96F2MLL implements the HCS08 CPUV5 core with BGND instruction support and handles up to 32 interrupt/reset sources. Its Multi-Purpose Clock Generator (MCG) supports FEI, FEE, FBE, PEE, and BLPE modes, with PLL reference divider selectable via RDIV (÷2 to ÷1024) and VDIV (×24 to ×56) for precise bus frequency synthesis.
On-chip peripherals include two SCIs (LIN 2.0/J2602 compliant), two IICs (100 kbps), two SPIs, three TPM modules (6+2+4 channels), RTC with external crystal support, and dual analog comparators that operate in STOP3 mode. The MSCAN module supports standard/extended frames, five receive buffers with FIFO, and programmable acceptance filters (2×32-bit, 4×16-bit, or 8×8-bit).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 CPUV5, 40-MHz max core frequency (20-MHz bus speed) |
| Memory | 96 KB FLASH (in-circuit programmable), 6 KB RAM, 2 KB EEPROM with 8-byte single-page or 4-byte dual-page erase |
| Clock Options | Crystal/resonator (31.25 kHz–16 MHz) or square-wave input; MCG supports FLL and PLL with nonvolatile trim (±1.5% over temp) |
| ADC | 24-channel, 12-bit resolution, 2.5 µs conversion time, internal bandgap reference, temperature sensor channel |
| CAN Interface | MSCAN module compliant with ISO 11898-1 (CAN 2.0A/B); supports standard/extended frames, remote frames, and 5-receive-buffer FIFO |
| Power Modes | Run, Wait, Stop2, Stop3; real-time interrupt available in all modes; STOP3 draws <1 µA typical with RTC active |
| I/O Pins | Up to 87 general-purpose I/O pins + 1 input-only pin; configurable pull-up/pull-down, slew rate, drive strength, and interrupt polarity |
Pinout & Package
Package: 64-pin LQFP (10×10 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Supply Voltage | Main power supply (2.7–5.5 V); decoupling required per Section 2.2.1 |
| VSS | Ground Reference | Digital ground return; separate analog ground not required but recommended for ADC stability |
| RESET | Active-Low Reset Input | Asynchronous reset with internal pull-up; accepts external push-pull or open-drain assertion |
| EXTAL | External Clock Input | Connects to crystal/resonator high-side terminal; used with XTAL for oscillator operation |
| XTAL | External Clock Output | Connects to crystal/resonator low-side terminal; forms Pierce oscillator with EXTAL |
| BKGD/MS | Background Debug / Mode Select | Single-wire debug interface pin; functions as mode select during reset for boot configuration |
| PTJ2 / TPM3CH2 | GPIO / Timer Channel | Programmable as general-purpose output or edge-aligned PWM output for TPM3 channel 2 |
| PTJ3 / TPM3CH3 | GPIO / Timer Channel | Programmable as general-purpose output or edge-aligned PWM output for TPM3 channel 3 |
Key Features
| Feature | Design Value |
|---|---|
| FLASH Security | Block protection and security byte prevent unauthorized read/write access; erase abort capability preserves partial data integrity |
| Low-Voltage Detection | Configurable trip points (2.5 V, 2.7 V, 2.9 V, 3.1 V) with reset or interrupt output; supports safe shutdown in brown-out conditions |
| Real-Time Counter (RTC) | 8-bit modulus counter with binary/decimal prescaler; runs from external 32.768 kHz crystal or internal 1-kHz oscillator for wake-up without external components |
| Background Debug | Single-wire interface enables full in-circuit emulation (ICE), real-time bus capture, and flash programming without halting system operation |
| ADC Temperature Sensor | Integrated silicon diode sensor provides calibrated die temperature measurement (±3°C accuracy) independent of external components |
Applications
| Automotive Door Module | Industrial Motor Control |
|---|---|
|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Primary MCU managing CAN message routing, PWM-driven motor drivers, and ADC-based position sensing. Use Value: Integrated MSCAN ensures interoperability with vehicle network; 24-channel ADC monitors multiple potentiometers and current sensors; STOP3 mode enables ultra-low-power keep-alive monitoring. |
Use Scenario: Closed-loop speed/torque control of brushed DC or stepper motors in HVAC actuators and valve positioning systems. IC Role / Device Role / Timing Role: Real-time controller executing PID algorithms using TPM-generated PWM and ADC feedback sampling at 2.5 µs intervals. Use Value: 20-MHz bus enables sub-millisecond loop execution; dual comparators detect overcurrent events with hardware response; EEPROM stores calibration coefficients across power cycles. |
| Body Control Module (BCM) | Smart Lighting Controller |
|
Use Scenario: Centralized management of exterior lighting, wipers, horn, and battery monitoring in automotive BCMs. IC Role / Device Role / Timing Role: System coordinator interfacing with LIN slaves (headlights, wiper motor) via SCI and aggregating status over CAN. Use Value: Dual SCI modules support simultaneous LIN master/slave operation; 87 GPIOs accommodate diverse load drivers and sensor inputs; bandgap reference ensures stable ADC readings across voltage fluctuations. |
Use Scenario: Adaptive LED driver for commercial signage or architectural lighting with dimming, color mixing, and thermal derating. IC Role / Device Role / Timing Role: PWM timing controller generating synchronized multi-channel outputs with center-aligned mode for reduced EMI. Use Value: Three TPM modules provide 12 independent PWM channels; internal temperature sensor triggers automatic brightness reduction above threshold; EEPROM retains user-defined profiles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08DZ128F2MLL | 128 KB FLASH, 8 KB RAM, 2 KB EEPROM; identical peripheral set and pinout in 64-pin LQFP | Supports larger firmware images and more complex state machines; same footprint allows design scalability | Select when future firmware growth or additional diagnostic logging is anticipated |
| S9S08DZ60F2MLL | 60 KB FLASH, 4 KB RAM, 2 KB EEPROM; shares same MCG, MSCAN, ADC, and TPM architecture | Limited memory reduces code partitioning flexibility; suitable for cost-sensitive, functionally constrained nodes | Choose for entry-level body electronics where feature count and BOM cost are prioritized over headroom |
Compared with S9S08DZ96F2MLL, MC9S08DZ128F2MLL offers 32 KB more FLASH and 2 KB more RAM without changing layout or software abstraction layers, while S9S08DZ60F2MLL reduces memory by 36 KB FLASH and 2 KB RAM - making it viable only where application scope is strictly bounded and no field updates are planned.
Availability
S9S08DZ96F2MLL is available at Aetrix Electronics and suitable for automotive body electronics, industrial motor controllers, and smart lighting systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for S9S08DZ96F2MLL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's automotive microcontroller heritage.
The S9S08DZ96F2MLL belongs to the HCS08 DZ-series, engineered specifically for cost-sensitive, safety-aware automotive body electronics - emphasizing CAN reliability, low-power stop modes, and in-field programmability for ECU reflash and calibration updates.
FAQ
What is the maximum operating frequency of the S9S08DZ96F2MLL CPU core?
The S9S08DZ96F2MLL CPU core operates at a maximum frequency of 40 MHz, delivering a 20-MHz bus speed. This performance level is achieved using the on-chip Multi-Purpose Clock Generator (MCG) in PEE mode with appropriate RDIV and VDIV settings. The core maintains full instruction compatibility with the HC08 architecture and adds the BGND instruction for background debugging. All timing specifications assume VDD ≥ 4.5 V; at lower voltages, maximum frequency is reduced per the DC characteristics table in Appendix A of the MC9S08DZ128 Series Data Sheet.
Does the S9S08DZ96F2MLL support CAN FD or only classical CAN 2.0?
The S9S08DZ96F2MLL supports only classical CAN 2.0A/B (ISO 11898-1), not CAN FD. Its MSCAN module implements standard and extended frame formats, five receive buffers with FIFO, and programmable identifier filters (2×32-bit, 4×16-bit, or 8×8-bit), but lacks the bit-rate switching, CRC enhancements, and payload expansion required for CAN FD. This limitation is confirmed in Chapter 12 of the MC9S08DZ128 Series Data Sheet, which explicitly references CAN 2.0 compliance and makes no mention of FD features. For CAN FD applications, a newer S32K or MPC57xx series device is required.
Can the S9S08DZ96F2MLL operate from a 3.3 V supply?
Yes, the S9S08DZ96F2MLL operates across a supply range of 2.7 V to 5.5 V, fully supporting 3.3 V nominal operation. At 3.3 V, the maximum allowable bus frequency is 16 MHz (corresponding to a 32-MHz core frequency), as specified in Table A-1 (DC Characteristics) of the MC9S08DZ128 Series Data Sheet. All I/O pins are 5-V tolerant regardless of VDD, enabling direct interfacing with higher-voltage peripherals without level shifters. The internal bandgap reference (1.18–1.21 V) remains stable across this voltage range, ensuring consistent ADC accuracy.
How many PWM channels does the S9S08DZ96F2MLL support, and what alignment modes are available?
The S9S08DZ96F2MLL supports 12 total PWM channels across three Timer Pulse-Width Modulator (TPM) modules: TPM1 (6 channels), TPM2 (2 channels), and TPM3 (4 channels). Each channel supports edge-aligned and center-aligned PWM modes, with independent period and duty-cycle registers. Edge-aligned mode uses TPMxMOD and TPMxCnV registers; center-aligned mode requires TPMxSC[CPWMS]=1 and uses TPMxMOD for half-period definition. Writing to TPMxSC resets modulo register coherency, and writing to TPMxCnSC resets channel value register coherency - both behaviors are documented in Section 16.4.2.3 of the data sheet.
Is the S9S08DZ96F2MLL pin-compatible with the MC9S08DZ128F2MLL in the 64-pin LQFP package?
Yes, the S9S08DZ96F2MLL is pin-compatible with the MC9S08DZ128F2MLL in the 64-pin LQFP package. Both devices share identical pin assignments, electrical characteristics, and peripheral multiplexing per Table 2-1 (Pin Availability by Package Pin-Count) and Section 2.1 of the MC9S08DZ128 Series Data Sheet. The only differences are memory size (96 KB vs. 128 KB FLASH) and RAM (6 KB vs. 8 KB), which do not affect pin behavior or signal routing. This compatibility enables drop-in replacement for design reuse and firmware scalability without PCB revision.
S9S08DZ96F2MLL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 100-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- CANbus, I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 87
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 6K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08DZ96F2MLL FAQ
1.How can I place an order for S9S08DZ96F2MLL through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08DZ96F2MLL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08DZ96F2MLL reliable?
The price and inventory of S9S08DZ96F2MLL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08DZ96F2MLL is usually 5 days.
3.What payment methods are accepted for S9S08DZ96F2MLL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08DZ96F2MLL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08DZ96F2MLL?
S9S08DZ96F2MLL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08DZ96F2MLL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08DZ96F2MLL?
For technical support, including S9S08DZ96F2MLL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08DZ96F2MLL requirements.
6.How does Aetrix verify that S9S08DZ96F2MLL is sourced from the original manufacturer or authorized distributors?
All S9S08DZ96F2MLL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08DZ96F2MLL meets industry standards.
7.What is the process for return or replacement of S9S08DZ96F2MLL?
All S9S08DZ96F2MLL units undergo pre-shipment inspection (PSI). If there is an issue with S9S08DZ96F2MLL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08DZ96F2MLL part is unused and in its original packaging.
Return procedure for S9S08DZ96F2MLL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S08DZ96F2MLL Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

