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NXP Semiconductors S9S08EL16F1VTJR

Part No.:
S9S08EL16F1VTJR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08EL16F1VTJR.pdf
Description:
IC MCU 8BIT 16KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,000

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Product details

Overview

S9S08EL16F1VTJR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB flash, 1 KB RAM, and integrated LIN/SCI/SPI/I²C peripherals. It features a 40-MHz CPU, on-chip EEPROM, real-time counter, 10-bit ADC with temperature sensor, and two analog comparators. Designed for automotive body electronics and industrial control nodes requiring LIN 2.0 compliance and low-power operation.

For engineers reviewing the S9S08EL16F1VTJR datasheet, S9S08EL16F1VTJR pinout, S9S08EL16F1VTJR application, or S9S08EL16F1VTJR equivalent, key selection criteria include LIN protocol support, stop3-mode current consumption (1.5 µA), 22 GPIO with configurable slew rate, and 28-TSSOP package compatibility with board-level space constraints.

Technical Context

The S9S08EL16F1VTJR implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±2% over voltage/temperature) to generate bus frequencies from 2–20 MHz.

Peripherals include a 16-channel 10-bit ADC (2.5 µs conversion), dual analog comparators with bandgap reference option, SLIC module compliant with LIN 2.0 and SAE J2602, and TPM modules supporting edge-aligned PWM. All critical analog and timing peripherals remain functional in stop3 mode.

Key Specifications

ParameterValue and Actual Design Meaning
CoreHCS08 8-bit CPU, 40-MHz max operation - enables deterministic real-time control at sub-25 ns instruction cycle
Flash Memory16 KB on-chip FLASH - supports in-circuit reprogramming and block protection for firmware updates in field
RAM1 KB SRAM with security lock - prevents unauthorized access to runtime variables and stack data
ADC16-channel, 10-bit, 2.5 µs conversion - sufficient resolution and speed for battery monitoring and sensor interfacing
LIN InterfaceSLIC module compliant with LIN 2.0 and SAE J2602 - handles full message buffering, checksum verification, and automatic sync without CPU overhead
Low-Power ModesStop3 mode draws 1.5 µA - enables multi-year battery life in wake-on-LIN applications
Package28-pin TSSOP (4.4 mm × 9.7 mm) - surface-mount compatible with automated assembly and thermal performance suitable for under-hood environments

Pinout & Package

28-pin Thin Shrink Small Outline Package (TSSOP), lead pitch 0.65 mm, body width 4.4 mm, total length 9.7 mm. RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual power domains: VDD (2.7–5.5 V) powers digital logic; separate VDDAD/VSSAD pins isolate analog section for ADC noise immunity
XTAL, EXTALClock input/outputSupports external crystal (1–16 MHz) or ceramic resonator; enables precise timing for LIN baud rate generation
BKGD/MSSingle-wire debug interfaceEnables in-circuit debugging and programming via background mode without dedicated JTAG pins
PTA0–PTA7Port A I/O8-bit general-purpose port with interrupt capability on all pins; configurable pull-up, slew rate, and drive strength
PTB0–PTB7Port B I/O8-bit port including LIN_TX/LIN_RX (PTB0/PTB1), SCI0_TX/SCI0_RX (PTB2/PTB3), and TPM1_CH0–CH3
PTC0–PTC5Port C I/O6-bit port with ADC inputs (AD0–AD15), comparator inputs (ACMP0+, ACMP0−), and RTC_CLKIN

Key Features

FeatureDesign Value
LIN 2.0-compliant SLICFull hardware implementation of LIN master/slave with automatic bit-rate detection, frame synchronization, and CRC-8 checksum handling - eliminates software overhead for protocol stack
Stop3-mode operationReal-time counter and LIN receiver remain active while CPU and most peripherals are powered down - enables wake-on-LIN with <2 µA quiescent current
On-chip EEPROM2 KB EEPROM with in-circuit programmability and erase-abort capability - allows reliable storage of calibration data and configuration parameters during field operation
Temperature sensorIntegrated silicon diode-based sensor with ±3°C accuracy across −40°C to +125°C - enables thermal monitoring without external components
Security circuitryFlash and RAM protection via security byte; prevents unauthorized read-out of firmware and sensitive data - meets basic automotive cybersecurity requirements

Applications

Automotive Door ModuleIndustrial Sensor Node

Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door panels.

IC Role / Device Role / Timing Role: Primary MCU executing LIN slave communication, ADC-based position sensing, and PWM-driven motor control.

Use Value: SLIC module ensures robust LIN 2.0 messaging at 19.2 kbps; stop3 mode extends battery backup life during vehicle sleep cycles.

Use Scenario: Wireless-capable environmental monitor measuring temperature, humidity, and ambient light in factory settings.

IC Role / Device Role / Timing Role: Sensor fusion hub collecting analog inputs, performing local thresholding, and preparing data for RF transmission.

Use Value: Integrated 10-bit ADC and temperature sensor eliminate external signal conditioning; RTC enables scheduled wake-up for periodic sampling.

Body Control Unit (BCU)Smart Actuator Controller

Use Scenario: Low-voltage subsystem managing interior lamps, wipers, and horn activation via LIN network.

IC Role / Device Role / Timing Role: LIN master coordinating multiple slave nodes; executes safety-critical diagnostics and watchdog supervision.

Use Value: COP watchdog with dedicated 1-kHz internal clock ensures fail-safe reset independent of bus clock stability.

Use Scenario: Compact valve or damper controller receiving commands over LIN and driving brushed DC motors.

IC Role / Device Role / Timing Role: Real-time actuator interface with PWM output, current-sense ADC input, and fault reporting via LIN.

Use Value: TPM modules deliver precise 16-bit edge-aligned PWM; analog comparators enable fast overcurrent detection with interrupt response <1 µs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08EL32F1VTJR32 KB flash, same peripheral set and pinout - identical architecture with doubled program memoryRequired where firmware complexity exceeds 16 KB or future-proofing for feature expansion is neededSelect when code size headroom or long-term maintainability outweighs cost sensitivity
S9S08SG48F1VTJR48 KB flash, enhanced I/O (36 pins), added CAN 2.0B controller - different peripheral complement and larger package (44-TSSOP)Suitable for systems requiring CAN bus integration alongside LIN, such as gateway modules or advanced body controllersChoose only if CAN interface is mandatory; not drop-in due to pin count and footprint mismatch

Compared with MC9S08EL32F1VTJR, the S9S08EL16F1VTJR offers identical timing, power, and peripheral behavior at lower memory cost; versus S9S08SG48F1VTJR, it trades CAN capability and I/O count for smaller footprint and lower system BOM cost in LIN-only nodes.

Availability

S9S08EL16F1VTJR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and smart actuator controllers requiring stable component supply, long lifecycle support, and AEC-Q100 qualification assurance.

Supply support for S9S08EL16F1VTJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications.

The S9S08EL16F1VTJR belongs to the HCS08 EL-series, designed specifically for cost-sensitive, low-power automotive body electronics requiring LIN protocol compliance and extended temperature operation (−40°C to +125°C).

FAQ

What is the maximum operating frequency of the S9S08EL16F1VTJR CPU core?

The S9S08EL16F1VTJR features an HCS08 CPU core rated for up to 40 MHz operation. This corresponds to a 25 ns instruction cycle time, enabling deterministic real-time response in automotive control loops. Bus frequency is derived from the internal clock source (ICS) and can be configured from 2 MHz to 20 MHz depending on FLL settings and system requirements.

Does the S9S08EL16F1VTJR support LIN 2.0 communication natively?

Yes, the S9S08EL16F1VTJR integrates a dedicated Slave LIN Interface Controller (SLIC) module that fully complies with LIN 2.0 and SAE J2602 standards. It supports automatic bit-rate detection, frame synchronization, checksum generation/verification, and full message buffering - all implemented in hardware without CPU intervention.

What low-power modes are available on the S9S08EL16F1VTJR, and what is the lowest current draw?

The S9S08EL16F1VTJR supports multiple low-power modes including wait, stop2, and stop3. In stop3 mode - the deepest sleep state - the device draws only 1.5 µA while maintaining real-time counter operation and LIN receive capability. This enables wake-on-LIN functionality essential for automotive always-on networks.

Is the S9S08EL16F1VTJR pin-compatible with other members of the HCS08 EL series?

Yes, the S9S08EL16F1VTJR is pin-compatible with the MC9S08EL32F1VTJR and MC9S08EL8F1VTJR in the same 28-TSSOP package. They share identical pin assignments, electrical characteristics, and peripheral mapping - allowing hardware reuse across memory variants during design scaling or cost optimization.

What development tools are supported for the S9S08EL16F1VTJR?

The S9S08EL16F1VTJR supports Freescale's (now NXP) CodeWarrior Development Studio with P&E Micro or OSJTAG debug interfaces. Its single-wire background debug (BKGD) interface enables full in-circuit debugging, flash programming, and breakpoint execution without requiring additional debug headers or JTAG connectors.

S9S08EL16F1VTJR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08EL16F1VTJR FAQ

1.How can I place an order for S9S08EL16F1VTJR through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08EL16F1VTJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08EL16F1VTJR reliable?

The price and inventory of S9S08EL16F1VTJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08EL16F1VTJR is usually 5 days.

3.What payment methods are accepted for S9S08EL16F1VTJR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08EL16F1VTJR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08EL16F1VTJR?

S9S08EL16F1VTJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08EL16F1VTJR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08EL16F1VTJR?

For technical support, including S9S08EL16F1VTJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08EL16F1VTJR requirements.

6.How does Aetrix verify that S9S08EL16F1VTJR is sourced from the original manufacturer or authorized distributors?

All S9S08EL16F1VTJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08EL16F1VTJR meets industry standards.

7.What is the process for return or replacement of S9S08EL16F1VTJR?

All S9S08EL16F1VTJR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08EL16F1VTJR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08EL16F1VTJR part is unused and in its original packaging.

Return procedure for S9S08EL16F1VTJR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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