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NXP Semiconductors S9S08EL32F1MTJ

Part No.:
S9S08EL32F1MTJ
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08EL32F1MTJ.pdf
Description:
IC MCU 8BIT 32KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,417

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Product details

Overview

S9S08EL32F1MTJ from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip FLASH, 2 KB RAM, and 1 KB EEPROM. It features a 40-MHz CPU, 10-bit 16-channel ADC with temperature sensor, dual analog comparators, LIN-capable SLIC, and real-time counter. Used in automotive body electronics for LIN node control in door modules and seat position systems.

For engineers reviewing the S9S08EL32F1MTJ datasheet, S9S08EL32F1MTJ pinout, S9S08EL32F1MTJ application, or S9S08EL32F1MTJ equivalent, key selection criteria include LIN 2.0/SAE J2602 compliance, stop3-mode operation with ADC/ACMP active, 22 GPIO with configurable slew rate and pull-ups, and single-wire background debug interface.

Technical Context

The S9S08EL32F1MTJ implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±0.2% resolution, ±2% deviation over voltage/temperature), enabling bus frequencies from 2–20 MHz.

Peripherals include a LIN-compliant Slave Interface Controller (SLIC) supporting automatic bit-rate synchronization and checksum verification, two analog comparators with bandgap reference option and TPM routing, and a 10-bit ADC with 2.5 μs conversion time that operates in stop3 mode - critical for low-power wake-up sensing in automotive applications.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core, 40-MHz max operation - enables deterministic real-time response for LIN protocol timing.
FLASH Memory32 KB on-chip FLASH with read/program/erase across full VDD and temperature range - supports field firmware updates without external programming hardware.
EEPROM1 KB in-circuit programmable EEPROM with erase-abort capability - retains calibration data and configuration settings during power loss.
ADC16-channel, 10-bit, 2.5 μs conversion time with internal temperature sensor and bandgap reference - enables accurate thermal monitoring and analog signal acquisition in stop3 mode.
SLICLIN 2.0 and SAE J2602 compliant slave controller with full message buffering and automatic frame sync - eliminates need for external LIN transceiver in basic slave nodes.
Power ModesTwo very low-power stop modes (stop2/stop3), reduced-power wait, and real-time interrupt wake-up - achieves sub-1 μA current draw in stop3 with RTC and ACMP active.
I/O Pins22 general-purpose I/O pins with configurable pull-ups, hysteresis, slew rate, and drive strength - ensures robust noise immunity and flexible interface design in automotive harness environments.

Pinout & Package

Package: 28-pin TSSOP (Thin Shrink Small Outline Package), 4.4 mm × 9.7 mm body, 0.65 mm pitch, RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual 5-V supply rails with separate analog/digital ground connections - reduces noise coupling between ADC and digital logic.
XTAL, EXTALClock input/outputCrystal/resonator interface for 31.25 kHz–16 MHz oscillators - supports precise timing for LIN baud rate generation and RTC accuracy.
BKGD/MSSingle-wire debug and mode selectShared pin for background debug communication and reset mode selection - enables in-circuit debugging with minimal PCB footprint.
PTA0–PTA7Port A general-purpose I/O8-bit bidirectional port with interrupt capability on all pins - used for LIN TX/RX, switch inputs, and LED drivers in body control units.
PTB0–PTB7Port B general-purpose I/O8-bit bidirectional port with configurable pull-ups and slew rate - supports PWM output via TPM channels and analog comparator inputs.
PTC0–PTC5Port C general-purpose I/O6-bit port with dedicated SLIC, SCI, SPI, and IIC functions - provides hardware-peripheral mapping without software bit-banging overhead.

Key Features

FeatureDesign Value
LIN Slave Interface Controller (SLIC)Fully hardware-accelerated LIN 2.0/SAE J2602 compliance with automatic bit-rate detection, checksum handling, and message buffering - reduces CPU load to <5% during LIN communication.
Stop3 Low-Power ModeReal-time interrupt wake-up with ADC, ACMP, and RTC active - enables periodic sensor sampling at 1 Hz while drawing <1.2 μA, extending battery life in always-on modules.
On-Chip Security CircuitryPrevents unauthorized access to FLASH, EEPROM, and RAM contents via security byte lock - protects proprietary LIN application code and calibration data from cloning.
Internal Clock Source (ICS)FLL-based clock generator with factory-trimmed internal reference (±0.2% resolution) - eliminates need for external crystal in cost-sensitive LIN slave nodes while maintaining ±2% bus frequency accuracy.
Single-Wire Background DebugStandardized SWD interface using BKGD/MS pin - allows full flash programming, breakpoint setting, and register inspection without JTAG header or additional PCB traces.

Applications

Automotive Door Module ControlSeat Position Monitoring System

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting via LIN network.

IC Role / Device Role / Timing Role: LIN slave node MCU managing local actuator drivers and switch inputs with synchronized command execution.

Use Value: SLIC handles LIN protocol stack in hardware, freeing CPU for motor control algorithms; stop3 mode enables periodic window anti-pinch sensor polling at <1.2 μA.

Use Scenario: Real-time tracking of seat track position, recliner angle, and lumbar support status for memory seat recall.

IC Role / Device Role / Timing Role: Sensor fusion hub aggregating potentiometer, Hall-effect, and temperature inputs; communicates position data over LIN to body control module.

Use Value: Integrated 10-bit ADC with internal temperature sensor enables direct thermal compensation of position readings; EEPROM stores seat profile offsets without external nonvolatile memory.

Roof Module Sunroof ControlSteering Column Switch Interface

Use Scenario: Bidirectional sunroof motor control with obstacle detection, rain sensor integration, and auto-close functionality.

IC Role / Device Role / Timing Role: Dedicated LIN slave executing safety-critical motion profiles and emergency stop logic with hardware watchdog supervision.

Use Value: COP watchdog with dedicated 1-kHz internal clock ensures fail-safe motor shutdown even if main clock fails; dual ACMPs monitor current-sense and rain sensor signals simultaneously.

Use Scenario: Aggregation and debouncing of multifunction steering wheel switches (cruise, audio, phone) before forwarding commands over LIN.

IC Role / Device Role / Timing Role: Input conditioning and protocol translation unit converting mechanical switch events into standardized LIN frames.

Use Value: 22 GPIO with configurable hysteresis and edge-triggered interrupts enable reliable switch scanning; SLIC's extended break detection synchronizes with master ECU timing windows.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LIN slave microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08EL16F1MTJ16 KB FLASH, 1 KB RAM, same peripheral set and pinout - identical architecture and SLIC/ADC/ACMP capabilities.Reduced code space limits complex LIN diagnostic services or multi-sensor fusion algorithms.Select when application firmware fits within 16 KB and cost optimization is prioritized over future feature expansion.
S9S08SG48F1MTJ48 KB FLASH, 4 KB RAM, adds CAN 2.0B controller and enhanced I/O drive strength - same HCS08 core and SLIC but higher integration.Supports hybrid LIN/CAN gateways or modules requiring both protocols; larger memory accommodates bootloader + application.Choose when system architecture requires CAN connectivity or when long-term firmware scalability is essential.

Compared with MC9S08EL16F1MTJ, S9S08EL32F1MTJ provides double FLASH and RAM for advanced diagnostics and sensor processing; versus S9S08SG48F1MTJ, it trades CAN capability for lower cost and power in pure LIN slave roles - making it optimal for cost-sensitive, single-protocol automotive nodes.

Availability

S9S08EL32F1MTJ is available at Aetrix Electronics and suitable for automotive body electronics, LIN-based sensor hubs, and low-power embedded control applications requiring stable component supply and long-term lifecycle support.

Supply support for S9S08EL32F1MTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S08EL32F1MTJ belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-effective, low-power LIN slave nodes in automotive body electronics where protocol offload, memory efficiency, and qualification to AEC-Q100 Grade 2 are essential.

FAQ

What is the maximum operating frequency of the S9S08EL32F1MTJ CPU core?

The S9S08EL32F1MTJ features an HCS08 CPU core rated for up to 40 MHz operation. This maximum frequency is achievable when powered at 5.0 V and operating within the specified temperature range (–40°C to +105°C). The actual bus frequency depends on the internal clock source configuration - the FLL can generate bus clocks from 2 MHz to 20 MHz using the internal reference, or up to 40 MHz when driven by an external crystal oscillator.

Does the S9S08EL32F1MTJ support LIN 2.0 protocol natively?

Yes, the S9S08EL32F1MTJ includes a dedicated Slave LIN Interface Controller (SLIC) module that fully complies with LIN 2.0 and SAE J2602 specifications. It supports automatic bit-rate detection, frame synchronization, checksum generation/verification, and full message buffering - enabling complete LIN slave functionality without external protocol assistance or software overhead.

What power-saving modes are available on the S9S08EL32F1MTJ?

The S9S08EL32F1MTJ offers multiple low-power modes: two very low-power stop modes (stop2 and stop3), a reduced-power wait mode, and a real-time interrupt capability usable in run, wait, and stop states. In stop3 mode, the RTC, ACMPs, and ADC remain operational while core logic is halted - achieving typical current consumption below 1.2 μA with wake-up capability via external pin or internal timer events.

Can the S9S08EL32F1MTJ perform analog-to-digital conversions while in low-power mode?

Yes, the S9S08EL32F1MTJ's 10-bit ADC continues to operate in stop3 mode, allowing periodic sensor measurements without waking the CPU. With a 2.5 μs conversion time and automatic compare function, it supports threshold-triggered wake-up events - for example, initiating a full system wake when temperature exceeds a programmed limit stored in EEPROM.

Is the S9S08EL32F1MTJ qualified for automotive applications?

Yes, the S9S08EL32F1MTJ is qualified to AEC-Q100 Grade 2 (–40°C to +105°C ambient temperature), making it suitable for under-hood and cabin-mounted automotive applications. Its integrated watchdog (COP), low-voltage detection, illegal opcode/address protection, and FLASH/EEPROM block security align with functional safety requirements for body electronics modules such as door controllers and seat position systems.

S9S08EL32F1MTJ Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08EL32F1MTJ FAQ

1.How can I place an order for S9S08EL32F1MTJ through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08EL32F1MTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08EL32F1MTJ reliable?

The price and inventory of S9S08EL32F1MTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08EL32F1MTJ is usually 5 days.

3.What payment methods are accepted for S9S08EL32F1MTJ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08EL32F1MTJ transactions.

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4.How is shipping managed for S9S08EL32F1MTJ?

S9S08EL32F1MTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08EL32F1MTJ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08EL32F1MTJ?

For technical support, including S9S08EL32F1MTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08EL32F1MTJ requirements.

6.How does Aetrix verify that S9S08EL32F1MTJ is sourced from the original manufacturer or authorized distributors?

All S9S08EL32F1MTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08EL32F1MTJ meets industry standards.

7.What is the process for return or replacement of S9S08EL32F1MTJ?

All S9S08EL32F1MTJ units undergo pre-shipment inspection (PSI). If there is an issue with S9S08EL32F1MTJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08EL32F1MTJ part is unused and in its original packaging.

Return procedure for S9S08EL32F1MTJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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