NXP Semiconductors S9S08EL32F1MTJR
- Part No.:
- S9S08EL32F1MTJR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08EL32F1MTJR.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 20TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08EL32F1MTJR from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip FLASH, 2 KB RAM, and 1 KB EEPROM. It features a 40-MHz CPU, 16-channel 10-bit ADC with temperature sensor, dual analog comparators, LIN-capable SLIC, and real-time counter. It targets automotive body electronics and industrial control nodes requiring low-power operation and LIN bus integration.
For engineers reviewing the S9S08EL32F1MTJR datasheet, S9S08EL32F1MTJR pinout, S9S08EL32F1MTJR application, or S9S08EL32F1MTJR equivalent, key selection criteria include its 28-TSSOP package, stop3-mode operation with peripheral wake-up capability, LIN 2.0/SAE J2602 compliance, and background debug interface for in-circuit development.
Technical Context
The S9S08EL32F1MTJR implements the HCS08 CPU core with HC08 instruction set extension including BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±0.2% resolution, ±2% deviation over voltage/temperature), enabling bus frequencies from 2–20 MHz.
Peripherals include a dedicated Slave LIN Interface Controller (SLIC) supporting full LIN 2.0 and SAE J2602 protocols at up to 120 kbps, with automatic bit-rate synchronization and checksum handling. The ADC operates in stop3 mode with 2.5 μs conversion time and internal bandgap reference, while dual ACMPs support routing to TPM for event-triggered PWM control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core running at up to 40 MHz; supports BGND instruction for single-wire debug entry |
| Memory | 32 KB FLASH (in-system programmable), 2 KB RAM, 1 KB EEPROM (program/erase during FLASH execution) |
| ADC | 16-channel, 10-bit resolution, 2.5 μs conversion time; includes temperature sensor and internal bandgap reference channel |
| LIN Interface | SLIC module compliant with LIN 2.0 and SAE J2602; full message buffering, automatic sync, checksum generation/verification |
| Power Modes | Stop3 mode with RTC and SLIC wake-up capability; two very low-power stop modes; reduced-power wait mode |
| Debug | Single-wire background debug interface; one hardware breakpoint plus two additional breakpoints in on-chip debug module |
| Package | 28-pin Thin Shrink Small Outline Package (TSSOP); 4.4 mm × 9.7 mm footprint, 0.65 mm pitch |
Pinout & Package
28-TSSOP package with exposed thermal pad (non-electrical). Pinout validated per MC9S08EL32 Rev. 3 datasheet Section 2.1 and mechanical drawing in Appendix B.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5-V supply domains: digital (VDD/VSS) and analog (VDDAD/VSSAD) for noise isolation |
| XTAL, EXTAL | Crystal oscillator inputs | Supports 31.25 kHz–38.4 kHz or 1–16 MHz crystals/resonators; optional external clock input |
| BKGD/MS | Background debug / mode select | Single-wire debug interface pin; also selects active background mode on reset |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; supports external reset assertion and low-voltage detect reset |
| PTA0–PTA7 | Port A general-purpose I/O | 8-bit port with configurable pull-ups, slew rate, drive strength, and interrupt capability on all pins |
| PTB0–PTB7 | Port B general-purpose I/O | 8-bit port with same configurability as Port A; PTA0–PTB7 collectively provide 22 GPIO pins |
| PTC0–PTC5 | Port C general-purpose I/O | 6-bit port; PTC0–PTC1 support LIN TX/RX functions when SLIC enabled |
Key Features
| Feature | Design Value |
|---|---|
| SLIC module | Hardware-accelerated LIN 2.0/SAE J2602 protocol engine with automatic frame sync and CRC handling-reduces CPU load and firmware complexity |
| Stop3 mode operation | RTC and SLIC remain active during deepest low-power state, enabling cyclic wake-up and LIN message reception without CPU intervention |
| In-circuit EEPROM | 1 KB EEPROM supports erase-abort and concurrent program/erase while executing from FLASH-enables robust data logging in automotive environments |
| ADC with temp sensor | Integrated temperature sensor and bandgap reference allow self-calibration and ambient monitoring without external components |
| Security circuitry | Prevents unauthorized access to FLASH, EEPROM, and RAM contents-meets basic automotive security requirements for ECU firmware protection |
Applications
| Automotive Door Module | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Primary MCU managing LIN slave communication with body controller, local sensor inputs, and actuator drivers. Use Value: SLIC enables deterministic LIN messaging at 10–20 kbps; stop3 mode reduces quiescent current to <10 µA during sleep, meeting OEM off-state leakage budgets. | Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and motion data in remote industrial facilities. IC Role / Device Role / Timing Role: Low-power data acquisition node with ADC, RTC, and SPI/I²C peripherals for sensor interfacing and local storage. Use Value: On-chip temperature sensor and 10-bit ADC enable accurate calibration-free sensing; stop3 + RTC allows hourly wake-up and measurement with sub-15 µA average current. |
| Smart Lighting Control | Appliance Motor Interface |
Use Scenario: DALI- or 0–10 V-controlled LED driver with dimming profile storage and thermal derating logic. IC Role / Device Role / Timing Role: Embedded controller interpreting command protocols, managing PWM output via TPM, and monitoring heatsink temperature. Use Value: Dual ACMPs compare thermal voltage against bandgap reference to trigger PWM duty reduction; EEPROM stores user-defined dimming curves across power cycles. | Use Scenario: BLDC motor commutation control in white goods using hall-effect sensors and discrete gate drivers. IC Role / Device Role / Timing Role: Timing-critical motor sequencer generating six-step commutation signals via TPM PWM outputs. Use Value: TPM1 (4-channel) and TPM2 (2-channel) provide synchronized edge-aligned PWM with dead-time insertion; ADC reads hall sensor voltages with 2.5 μs latency for real-time phase detection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08EL16F1MTJR | 16 KB FLASH, 1 KB RAM, identical peripheral set and pinout; same 28-TSSOP package | Reduced code/data capacity limits complex LIN stack or large lookup tables | Select when application firmware fits within 16 KB FLASH and cost sensitivity outweighs memory headroom needs |
| MC9S08SL16F1MTJR | Same 16 KB FLASH but lacks SLIC; replaces it with enhanced SCI and SPI; 20-TSSOP package (fewer pins) | No hardware LIN support-requires software-based LIN stack, increasing CPU load and timing uncertainty | Choose only if LIN is not required and board layout accommodates 20-pin footprint reduction |
Compared with S9S08EL16F1MTJR, the S9S08EL32F1MTJR provides double FLASH and RAM for larger firmware and data buffers; compared with MC9S08SL16F1MTJR, it delivers dedicated SLIC hardware for deterministic, low-CPU-overhead LIN communication in automotive networks.
Availability
S9S08EL32F1MTJR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart lighting controls, and appliance motor interfaces requiring stable component supply and long-term lifecycle support.
Supply support for S9S08EL32F1MTJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, now specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08EL32F1MTJR belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-sensitive, low-power automotive body electronics where LIN bus integration, EEPROM data retention, and debug reliability are critical.
FAQ
What is the maximum operating frequency of the S9S08EL32F1MTJR CPU core?
The S9S08EL32F1MTJR features an HCS08 CPU core rated for up to 40 MHz operation. Its internal clock source (ICS) supports bus frequencies from 2–20 MHz using the FLL, and the core executes instructions at the bus clock rate. External crystal or resonator options allow system clock derivation up to 40 MHz via PLL-like configurations described in the ICS functional description of the datasheet.
Does the S9S08EL32F1MTJR support LIN communication in hardware?
Yes, the S9S08EL32F1MTJR integrates a dedicated Slave LIN Interface Controller (SLIC) that fully complies with LIN 2.0 and SAE J2602 standards. This hardware module handles bit-rate synchronization, checksum generation and verification, frame buffering, and automatic break detection-offloading these tasks from the CPU and ensuring deterministic timing for automotive network communication.
What power-saving modes are available on the S9S08EL32F1MTJR?
The S9S08EL32F1MTJR offers multiple low-power modes: Run, Wait, Stop2, and Stop3. Stop3 is the deepest mode, where the CPU and most peripherals halt while the RTC and SLIC remain active for wake-up events. Two very low-power stop modes (Stop2 and Stop3) and a reduced-power Wait mode are supported, with typical stop3 current below 10 µA at 25°C and 5 V.
Can the S9S08EL32F1MTJR perform ADC conversions while in low-power mode?
Yes, the S9S08EL32F1MTJR ADC operates in Stop3 mode. With its 2.5 μs conversion time and internal bandgap reference, it can acquire sensor data-including from the integrated temperature sensor-without waking the CPU. This enables ultra-low-power periodic sensing in battery-operated applications such as industrial monitors or automotive occupancy detection.
Is the S9S08EL32F1MTJR pin-compatible with other MC9S08EL-series devices?
Yes, the S9S08EL32F1MTJR in 28-TSSOP is pin-compatible with the S9S08EL16F1MTJR (same package), sharing identical pin assignments, peripheral mappings, and electrical characteristics. This allows direct replacement for memory-scaling upgrades without PCB revision. However, it is not pin-compatible with the 20-TSSOP MC9S08SL16F1MTJR due to differing pin count and function allocation.
S9S08EL32F1MTJR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 512 x 8
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 12x10b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08EL32F1MTJR FAQ
1.How can I place an order for S9S08EL32F1MTJR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08EL32F1MTJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08EL32F1MTJR reliable?
The price and inventory of S9S08EL32F1MTJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08EL32F1MTJR is usually 5 days.
3.What payment methods are accepted for S9S08EL32F1MTJR?
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S9S08EL32F1MTJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08EL32F1MTJR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08EL32F1MTJR?
For technical support, including S9S08EL32F1MTJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08EL32F1MTJR requirements.
6.How does Aetrix verify that S9S08EL32F1MTJR is sourced from the original manufacturer or authorized distributors?
All S9S08EL32F1MTJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08EL32F1MTJR meets industry standards.
7.What is the process for return or replacement of S9S08EL32F1MTJR?
All S9S08EL32F1MTJR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08EL32F1MTJR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08EL32F1MTJR part is unused and in its original packaging.
Return procedure for S9S08EL32F1MTJR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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