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NXP Semiconductors S9S08EL32F1MTL

Part No.:
S9S08EL32F1MTL
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
28-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08EL32F1MTL.pdf
Description:
IC MCU 8BIT 32KB FLASH 28TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,139

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Product details

Overview

S9S08EL32F1MTL from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 32 KB on-chip FLASH, 2 KB RAM, and 1 KB EEPROM. It features a 40-MHz CPU, 16-channel 10-bit ADC with temperature sensor, dual analog comparators, LIN-capable SLIC, and real-time counter. Used in automotive body electronics and industrial control nodes requiring low-power operation and LIN bus integration.

For engineers reviewing the S9S08EL32F1MTL datasheet, S9S08EL32F1MTL pinout, S9S08EL32F1MTL application, or S9S08EL32F1MTL equivalent, key selection criteria include its 28-TSSOP package, stop3-mode operation with ADC/ACMP active, LIN 2.0 protocol support via SLIC, and background debug interface for in-circuit development.

Technical Context

The S9S08EL32F1MTL implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources. Its internal clock source (ICS) uses a frequency-locked loop (FLL) with precision-trimmed internal reference (±0.2% resolution, ±2% deviation over voltage/temperature), enabling bus frequencies from 2–20 MHz.

Peripherals include a dedicated Slave LIN Interface Controller (SLIC) compliant with LIN 2.0 and SAE J2602, supporting up to 120 kbps with full message buffering and automatic checksum generation. The ADC operates in stop3 mode with 2.5 μs conversion time and internal bandgap reference, while two ACMPs support routing to TPM for event-triggered PWM.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core running at up to 40 MHz; executes HC08 ISA with BGND instruction for debug entry.
Memory32 KB FLASH (in-circuit programmable/erasable), 2 KB RAM, 1 KB EEPROM (programmable/erasable during FLASH execution).
ADC16-channel, 10-bit resolution, 2.5 μs conversion time; includes temperature sensor and internal bandgap reference channel; functional in stop3 mode.
SLICHardware LIN 2.0 and SAE J2602 controller; supports up to 120 kbps, automatic bit rate sync, checksum generation/verification, and UART-like byte transfer.
Power ModesTwo very low-power stop modes (stop2, stop3), reduced-power wait mode, and real-time interrupt wake-up from all modes including stop3.
Debug InterfaceSingle-wire background debug (BDM) with one hardware breakpoint; on-chip ICE module with two comparators, nine trigger modes, and eight-deep FIFO.
I/O Pins22 general-purpose I/O pins with configurable pull-ups, hysteresis, slew rate, and drive strength; 16 support pin-interrupt with selectable edge/level sensitivity.

Pinout & Package

Package: 28-pin Thin Shrink Small Outline Package (28-TSSOP), 0.65 mm pitch, body size 9.7 × 4.4 mm, lead count 28, exposed pad not present.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDA, VDDADSupply voltage inputsDigital core (VDD), analog (VDDA), and ADC-specific (VDDAD) power rails; require separate decoupling per datasheet layout guidelines.
VSS, VSSA, VSSADGround returnsDigital ground (VSS), analog ground (VSSA), and ADC ground (VSSAD); must be connected with low-impedance paths to minimize noise coupling.
XTAL, EXTALCrystal oscillator terminalsSupport external crystal/resonator (31.25 kHz–38.4 kHz or 1–16 MHz); XTAL is output, EXTAL is input; internal load capacitors configurable.
BKGD/MSBackground debug / mode selectSingle-wire BDM interface pin; also selects boot mode (normal vs. special reset behavior); requires weak pull-up for reliable operation.
RESETActive-low reset inputAsynchronous reset assertion; internal pull-up enabled; supports external reset generator or manual push-button with RC debounce.
PTA0–PTA7Port A I/O signals8-bit bidirectional port with interrupt capability on all pins; PTA0–PTA3 support alternate functions including SCI0, SPI0, IIC, TPM1, RTC, and SLIC signals.
PTB0–PTB7Port B I/O signals8-bit bidirectional port; PTB0–PTB3 support SCI1, TPM2, ACMP, and ADC channel inputs; PTB4–PTB7 are general-purpose only.
PTC0–PTC5Port C I/O signals6-bit bidirectional port; PTC0–PTC3 support ADC channels, ACMP inputs, and TPM1; PTC4–PTC5 are GPIO-only.

Key Features

FeatureDesign Value
Stop3-mode peripheral operationADC, ACMP, RTC, and SLIC remain fully functional during deepest low-power state-enabling battery-powered LIN node wake-on-event without CPU wake-up.
Integrated LIN protocol engineSLIC handles full LIN frame assembly/disassembly, checksum calculation/verification, and automatic baud rate detection-offloading CPU and ensuring deterministic timing compliance.
In-circuit EEPROM programming1 KB EEPROM can be erased and reprogrammed while executing code from FLASH, enabling field-updatable calibration data or configuration storage without system interruption.
Trimmed internal reference clockICS FLL achieves ±0.2% resolution and ±2% accuracy across voltage/temperature range-eliminating need for external crystal in cost-sensitive applications where ±2% timing tolerance is acceptable.
Security circuitryPrevents unauthorized read-out of FLASH, EEPROM, and RAM contents via background debug interface-essential for protecting firmware IP in automotive and industrial deployments.

Applications

Automotive Door ModuleIndustrial Sensor Node

Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies.

IC Role / Device Role / Timing Role: Primary MCU managing LIN slave communication with body control module, executing motor control via TPM PWM, and monitoring switches/sensors via ADC and ACMP.

Use Value: Stop3-mode operation enables sub-10 µA sleep current while maintaining LIN responsiveness and switch wake-up-extending battery life in key-off scenarios.

Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and vibration data in remote factory locations.

IC Role / Device Role / Timing Role: Data acquisition MCU using integrated ADC and temperature sensor, storing calibrated readings in EEPROM, and transmitting via LIN to gateway controller.

Use Value: On-chip EEPROM allows persistent storage of sensor offsets and calibration coefficients without external nonvolatile memory-reducing BOM count and PCB area.

Smart Actuator ControllerLIN Gateway Subsystem

Use Scenario: Closed-loop position control of HVAC damper actuators using potentiometer feedback and stepper motor drive.

IC Role / Device Role / Timing Role: Real-time controller performing ADC sampling, PID computation, and TPM-generated PWM output; SLIC handles diagnostics and configuration updates over LIN.

Use Value: Hardware-accelerated SLIC ensures <100 µs frame processing latency-meeting LIN 2.0 timing requirements for actuator command-response cycles.

Use Scenario: Bridging CAN-based main ECU with multiple LIN slave nodes (e.g., seat controls, lighting modules) in premium vehicle architectures.

IC Role / Device Role / Timing Role: LIN master node coordinating scheduled frame transmission, error handling, and diagnostic services across up to 16 slaves using SLIC and SCI peripherals.

Use Value: Dual SCI interfaces (SCI0/SCI1) enable simultaneous LIN master and debug/trace communication-supporting concurrent development and production diagnostics.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08EL16F1MTL16 KB FLASH, 1 KB RAM, same peripheral set and pinout; identical 28-TSSOP package and SLIC/ADC/TPM feature set.Lower memory capacity limits firmware complexity and data logging depth; suitable for simpler LIN slaves with minimal state management.Select when application fits within 16 KB FLASH and does not require EEPROM persistence beyond 512 bytes.
S9S08SG48F1MTL48 KB FLASH, 4 KB RAM, enhanced ADC (12-bit, 16-channel), additional SCI and IIC modules; 44-pin LQFP package-not pin-compatible.Higher memory and resolution support advanced diagnostics, multi-sensor fusion, and dual-bus (LIN+CAN) bridging roles.Choose for next-generation designs needing scalability, higher analog precision, or migration path beyond 28-pin footprint constraints.

Compared with MC9S08EL16F1MTL, S9S08EL32F1MTL provides double FLASH and RAM for larger control algorithms and EEPROM for robust configuration storage; versus S9S08SG48F1MTL, it trades package size and peripheral count for lower cost and proven qualification in legacy automotive platforms.

Availability

S9S08EL32F1MTL is available at Aetrix Electronics and suitable for automotive body electronics, industrial LIN sensor networks, and smart actuator control systems requiring stable component supply and long-term lifecycle support.

Supply support for S9S08EL32F1MTL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S08EL32F1MTL belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-sensitive, low-power automotive body electronics and industrial control nodes requiring LIN protocol compliance and robust flash memory reliability.

FAQ

What is the maximum operating frequency of the S9S08EL32F1MTL CPU core?

The S9S08EL32F1MTL CPU core is rated for a maximum bus frequency of 20 MHz, derived from its internal clock source (ICS) with frequency-locked loop (FLL). While the HCS08 architecture supports up to 40 MHz in certain configurations, the S9S08EL32F1MTL datasheet specifies 20 MHz as the maximum guaranteed bus frequency under full temperature and voltage range. This ensures timing compliance for all on-chip peripherals including ADC, SLIC, and TPM modules.

Does the S9S08EL32F1MTL support LIN 2.0 protocol natively?

Yes, the S9S08EL32F1MTL includes a dedicated Slave LIN Interface Controller (SLIC) module that implements LIN 2.0 and SAE J2602 protocol layers in hardware. It handles frame synchronization, automatic bit rate detection, checksum generation and verification, and full message buffering-without CPU intervention. This native support enables deterministic, low-latency LIN communication essential for automotive body electronics applications.

Can the S9S08EL32F1MTL operate its ADC in low-power stop modes?

Yes, the S9S08EL32F1MTL ADC remains fully operational in stop3 mode-the deepest low-power state. It supports 2.5 μs conversion time, automatic compare function, and use of the internal bandgap reference channel while consuming minimal current. This capability allows battery-powered LIN nodes to perform periodic sensor measurements and wake the CPU only upon threshold violation, significantly extending operational lifetime.

What debug interface does the S9S08EL32F1MTL provide?

The S9S08EL32F1MTL features a single-wire background debug (BDM) interface compliant with the Freescale/NXP BDM specification. It supports in-circuit debugging with one hardware breakpoint, plus two additional breakpoints managed by the on-chip debug module. The integrated ICE module includes two comparators, nine trigger modes, and an eight-deep FIFO for change-of-flow address capture-enabling robust firmware validation and real-time trace in resource-constrained environments.

Is the S9S08EL32F1MTL pin-compatible with other MC9S08EL-series devices?

Yes, the S9S08EL32F1MTL in 28-TSSOP package is pin-compatible with MC9S08EL16F1MTL and MC9S08SL16F1MTL within the same package variant. All share identical pin assignments, electrical characteristics, and peripheral mapping-including SLIC, ADC, TPM, and I/O functionality. This allows direct substitution in existing designs when increased FLASH or EEPROM capacity is required, without PCB layout changes.

S9S08EL32F1MTL Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
28-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08EL32F1MTL FAQ

1.How can I place an order for S9S08EL32F1MTL through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08EL32F1MTL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08EL32F1MTL reliable?

The price and inventory of S9S08EL32F1MTL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08EL32F1MTL is usually 5 days.

3.What payment methods are accepted for S9S08EL32F1MTL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08EL32F1MTL transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08EL32F1MTL?

S9S08EL32F1MTL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08EL32F1MTL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08EL32F1MTL?

For technical support, including S9S08EL32F1MTL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08EL32F1MTL requirements.

6.How does Aetrix verify that S9S08EL32F1MTL is sourced from the original manufacturer or authorized distributors?

All S9S08EL32F1MTL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08EL32F1MTL meets industry standards.

7.What is the process for return or replacement of S9S08EL32F1MTL?

All S9S08EL32F1MTL units undergo pre-shipment inspection (PSI). If there is an issue with S9S08EL32F1MTL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08EL32F1MTL part is unused and in its original packaging.

Return procedure for S9S08EL32F1MTL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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