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NXP Semiconductors S9S08QD2J1CSC

Part No.:
S9S08QD2J1CSC
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixS9S08QD2J1CSC.pdf
Description:
IC MCU 8BIT 2KB FLASH 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,916

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Product details

Overview

S9S08QD2J1CSC from NXP Semiconductors is an 8-bit HCS08 microcontroller designed for cost-sensitive embedded control applications. It features a 16 MHz CPU, 2048 bytes of on-chip Flash memory, 128 bytes of RAM, and integrated peripherals including a 4-channel 10-bit ADC, two timer/PWM modules (TIM1 and TIM2), and a 4-pin keyboard interrupt module. It operates in automotive-grade temperature range (–40 °C to 125 °C) and targets low-power sensor interface and motor control functions.

For engineers reviewing the S9S08QD2J1CSC datasheet, S9S08QD2J1CSC pinout, S9S08QD2J1CSC application, or S9S08QD2J1CSC equivalent, key selection criteria include Flash/RAM size, ICS-based clock accuracy (±2% over voltage/temperature), single-wire BDM debug support, and 8-pin SOIC packaging for space-constrained PCBs.

Technical Context

The S9S08QD2J1CSC implements the HCS08 CPU core with HC08 instruction set extension (including BGND), supporting up to 32 interrupt/reset sources and background debugging via single-wire BDM interface. Its Internal Clock Source (ICS) uses a frequency-locked loop (FLL) with factory-trimmed internal reference for ±0.2% resolution and ±2% deviation across full operating conditions.

Peripherals are tightly coupled to the CPU: the 10-bit ADC supports hardware triggering by RTI counter and includes internal bandgap reference and temperature sensor; TIM1 provides two independent channels for input capture, output compare, or edge/center-aligned PWM; TIM2 adds one additional channel with identical functionality.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core with 16 MHz max bus frequency and BGND instruction for BDM
Flash Memory2048 bytes, readable/programmable/erasable over full VDD (2.7–5.5 V) and temperature
RAM Size128 bytes, used for stack, variables, and temporary data storage during execution
ADC4-channel, 10-bit SAR converter with internal bandgap reference, temperature sensor, and RTI-triggered conversion
TimersTIM1: dual-channel; TIM2: single-channel; both support input capture, output compare, and buffered PWM modes
Package8-pin SOIC (Small Outline Integrated Circuit), RoHS-compliant, footprint-compatible with PDIP variant
Temperature Range–40 °C to +125 °C, qualified for automotive and industrial environments

Pinout & Package

Package: 8-pin SOIC (Small Outline Integrated Circuit), body width 3.9 mm, lead pitch 1.27 mm, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
VDDSupply voltage inputPrimary power rail (2.7–5.5 V); powers core, peripherals, and I/O
VSSGround referenceDigital ground return path; must be low-impedance for noise immunity
RESETActive-low reset inputAsynchronous reset with internal pullup; initiates cold start or recovery from fault
BKGD/MSBackground debug / mode selectSingle-wire BDM communication pin; also selects boot mode at power-up
PTA0–PTA3General-purpose I/O pinsFour bidirectional GPIOs with software-selectable pullups, slew rate, and drive strength (10 mA each)
PTA4Input-only pinDedicated input (e.g., IRQ or analog input); no output driver enabled
PTA5Output-only pinDedicated output (e.g., LED drive or PWM signal); no input buffer enabled

Key Features

FeatureDesign Value
Internal Clock Source (ICS)FLL-based oscillator with ±0.2% trimming resolution and ±2% deviation over –40 °C to +125 °C and 2.7–5.5 V
Low-Voltage Detection (LVD)Configurable reset or interrupt on undervoltage condition; supports operation down to 2.7 V
Flash Block ProtectionHardware-enforced write/erase protection for secure firmware update and bootloader isolation
Keyboard Interrupt Module (KBI)4-pin interrupt controller with software-selectable edge/level sensitivity and polarity per pin
Power-Saving ModesWait + Stop2 + Stop3 modes; Stop3 retains RAM and allows wake-up from KBI or RTI events

Applications

Motor Control InterfaceSensor Signal Conditioning

Use Scenario: Driving small DC motors or solenoids in automotive HVAC actuators or industrial valve controllers.

IC Role / Device Role / Timing Role: MCU executing closed-loop speed control using TIM1/TIM2 PWM outputs and ADC feedback from current sense resistor.

Use Value: On-chip 10-bit ADC with internal reference enables accurate current measurement without external precision references; 128-byte RAM suffices for PID coefficient storage and real-time error calculation.

Use Scenario: Reading thermistor, potentiometer, or pressure transducer signals in engine coolant temperature or cabin air quality modules.

IC Role / Device Role / Timing Role: Signal acquisition node converting analog sensor outputs to digital values for CAN/LIN transmission or local decision logic.

Use Value: Hardware-triggered ADC conversions synchronized to RTI timer eliminate software timing jitter; internal temperature sensor supports self-calibration compensation.

Body Control Unit SubsystemSmart Lighting Driver

Use Scenario: Managing door lock status, window lift control, or mirror adjustment in entry-level automotive body control modules.

IC Role / Device Role / Timing Role: Dedicated subsystem controller interfacing with mechanical switches via KBI and driving relays/LEDs through GPIO.

Use Value: 4-pin KBI with configurable edge/level detection reduces external debounce circuitry; internal pullups on RESET and IRQ lower BOM cost and board area.

Use Scenario: Dimming and sequencing interior LED lighting in automotive cabins or commercial fixtures.

IC Role / Device Role / Timing Role: PWM generator and timing coordinator using TIM1 edge-aligned PWM channels to drive constant-current LED drivers.

Use Value: Buffered PWM outputs prevent timing skew between channels; Stop3 mode enables ultra-low-power standby while retaining PWM state for instant wake-up.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08QD2CDTSame core, Flash/RAM, and peripherals; differs in package (8-pin PDIP) and temperature grade (–40 °C to +85 °C)Targeted at non-automotive industrial prototypes and lab evaluation where SOIC reflow is unavailableSelect MC9S08QD2CDT only when through-hole assembly is required and extended temperature operation is not needed.
S9S08QD4J1CSCSame package and temperature grade, but doubles Flash (4096 B) and RAM (256 B); identical peripheral set and pinoutSuitable for applications requiring larger firmware (e.g., bootloader + application) or more runtime variablesChoose S9S08QD4J1CSC when firmware growth exceeds 2 KB or dynamic data structures require >128 B RAM.

Compared with S9S08QD2J1CSC, MC9S08QD2CDT trades automotive qualification and SOIC compatibility for through-hole ease-of-use, while S9S08QD4J1CSC offers direct scalability in memory without changing layout or firmware architecture.

Availability

S9S08QD2J1CSC is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and consumer appliance control systems requiring stable component supply and long-term lifecycle support.

Supply support for S9S08QD2J1CSC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The S9S08QD2J1CSC belongs to the HCS08 QD-series microcontrollers, designed specifically for cost-optimized, low-power embedded control in automotive subsystems and industrial equipment where reliability and qualification to AEC-Q100 Grade 1 are essential.

FAQ

What is the maximum operating frequency of the S9S08QD2J1CSC CPU core?

The S9S08QD2J1CSC features an HCS08 CPU core with a maximum bus frequency of 16 MHz. This frequency is derived from the internal clock source (ICS) module's FLL output, which is factory-trimmed for stability across voltage and temperature. The actual achievable instruction throughput depends on code density and wait states, but the core supports full-speed execution at 16 MHz under rated VDD (2.7–5.5 V) and temperature (–40 °C to +125 °C). S9S08QD2J1CSC does not require external crystals for basic operation due to its integrated ICS.

Does the S9S08QD2J1CSC support in-circuit debugging, and what interface is used?

Yes, the S9S08QD2J1CSC supports in-circuit debugging via a single-wire Background Debug Mode (BDM) interface using the BKGD/MS pin. This allows full visibility into CPU registers, memory, and peripheral states during development without halting real-time operation. The BDM module supports one hardware breakpoint and two additional breakpoints managed by the on-chip debug module. S9S08QD2J1CSC requires no external debug probe beyond standard BDM-capable programmers such as the NXP DEMO9S08QD4 evaluation board or compatible third-party tools.

What are the memory resources available on the S9S08QD2J1CSC?

The S9S08QD2J1CSC integrates 2048 bytes of on-chip Flash memory for program storage and 128 bytes of RAM for runtime data. Flash supports read/program/erase operations across the full operating voltage (2.7–5.5 V) and temperature (–40 °C to +125 °C) range, with hardware block protection to prevent accidental overwrite. RAM is volatile and retained only in Run, Wait, and Stop3 modes. S9S08QD2J1CSC does not include EEPROM or external memory interfaces - all code and data must reside within these on-chip resources.

Can the S9S08QD2J1CSC operate without an external crystal or resonator?

Yes, the S9S08QD2J1CSC can operate fully without external timing components. Its Internal Clock Source (ICS) module includes a frequency-locked loop (FLL) driven by a factory-trimmed internal reference oscillator, enabling stable 16 MHz bus operation. External crystals are optional and only required if higher frequency accuracy (e.g., <±0.5%) or specific clock domain separation is needed. S9S08QD2J1CSC's ICS achieves ±2% deviation over temperature and voltage, making it suitable for most automotive and industrial control tasks where precise timing is not mission-critical.

Is the S9S08QD2J1CSC qualified for automotive applications?

Yes, the S9S08QD2J1CSC is qualified to AEC-Q100 Grade 1 (–40 °C to +125 °C) and is explicitly designated for automotive use in NXP documentation. Its datasheet covers S9S08QD2 variants alongside MC9S08QD2 and confirms qualification for engine bay–adjacent and cabin control applications. Features such as low-voltage detection, COP watchdog with dedicated 32 kHz clock, flash block protection, and robust I/O drive strength align with automotive functional safety expectations. S9S08QD2J1CSC is not intended for safety-critical ASIL-B/D systems but meets requirements for non-safety-critical body and convenience electronics.

S9S08QD2J1CSC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
-
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
4
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08QD2J1CSC FAQ

1.How can I place an order for S9S08QD2J1CSC through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08QD2J1CSC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of S9S08QD2J1CSC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08QD2J1CSC is usually 5 days.

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S9S08QD2J1CSC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08QD2J1CSC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08QD2J1CSC?

For technical support, including S9S08QD2J1CSC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08QD2J1CSC requirements.

6.How does Aetrix verify that S9S08QD2J1CSC is sourced from the original manufacturer or authorized distributors?

All S9S08QD2J1CSC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08QD2J1CSC meets industry standards.

7.What is the process for return or replacement of S9S08QD2J1CSC?

All S9S08QD2J1CSC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08QD2J1CSC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08QD2J1CSC part is unused and in its original packaging.

Return procedure for S9S08QD2J1CSC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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