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NXP Semiconductors S9S08QD2J1MSCR
- Part No.:
- S9S08QD2J1MSCR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
S9S08QD2J1MSCR.pdf
- Description:
- IC MCU 8BIT 2KB FLASH 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,500
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Product details
Overview
S9S08QD2J1MSCR from NXP Semiconductors is an 8-bit HCS08 microcontroller with 16 MHz CPU, 2048 bytes of flash memory, and 128 bytes of RAM, designed for cost-sensitive embedded control in automotive body electronics and industrial sensors.
For engineers reviewing the S9S08QD2J1MSCR datasheet, S9S08QD2J1MSCR pinout, S9S08QD2J1MSCR application, or S9S08QD2J1MSCR equivalent, key selection criteria include its 8-pin SOIC package, single-wire background debug interface, internal clock source with FLL, 4-channel 10-bit ADC, and support for Wait/Stop2/Stop3 low-power modes.
Technical Context
The S9S08QD2J1MSCR implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and a background debugging system with one hardware breakpoint plus two additional breakpoints in the on-chip debug module.
Its internal clock source (ICS) integrates a frequency-locked loop (FLL) trimmed for ±0.2% resolution and ±2% deviation over temperature and voltage; power management includes COP watchdog reset (from dedicated 32 kHz clock or bus clock), low-voltage detection with reset/interrupt, and flash block protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | HCS08 8-bit core with BGND instruction and background debug support |
| Max Clock Frequency | 16 MHz - determines maximum instruction throughput and peripheral timing margins |
| Flash Memory | 2048 bytes - sufficient for small firmware images with bootloader and basic control logic |
| RAM Size | 128 bytes - supports limited variable storage and stack depth for real-time control tasks |
| ADC Resolution | 10-bit, 4-channel - enables precise analog sensing of temperature, voltage, or sensor outputs |
| Power Modes | Wait, Stop2, Stop3 - reduces current draw to µA range during idle periods for battery-powered systems |
| Debug Interface | Single-wire BDM - allows in-circuit programming and debugging with minimal PCB footprint |
Pinout & Package
Package: 8-pin SOIC (Small Outline Integrated Circuit), RoHS-compliant, surface-mountable with standard 1.27 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Supply voltage input | Core and I/O power rail (2.7–5.5 V); requires local decoupling |
| VSS | Ground reference | Digital ground return path; must be connected to system GND plane |
| RESET | Active-low reset input | Hardware reset trigger with internal pullup; asserts full MCU initialization |
| BKGD/MS | Background debug / mode select | Single-wire BDM communication and boot-mode selection pin |
| PTA0–PTA3 | General-purpose I/O | Four bidirectional pins with software-selectable pullups, slew rate, and drive strength (10 mA each) |
| PTA4 | Input-only pin | Dedicated input (e.g., IRQ or sensor signal) without output capability |
| PTA5 | Output-only pin | Dedicated output (e.g., LED driver or enable signal) without input capability |
Key Features
| Feature | Design Value |
|---|---|
| Internal Clock Source (ICS) with FLL | Eliminates external crystal requirement while maintaining ±2% frequency accuracy across voltage and temperature |
| Hardware-triggerable ADC | Enables precise timing of analog conversions using RTI counter, reducing CPU overhead in periodic sensing |
| Two independent TPM modules | TIM1 (2-channel) and TIM2 (1-channel) support PWM generation, input capture, and output compare for motor or lighting control |
| Keyboard Interrupt (KBI) module | 4-pin interrupt-capable I/O with software-selectable edge/level sensitivity for pushbutton or switch interfaces |
| Flash block protection | Prevents accidental overwrite of critical firmware sections during field updates or debug operations |
Applications
| Automotive Door Module | Industrial Temperature Sensor Node |
|---|---|
Use Scenario: Monitoring window lock status, mirror position, and interior lighting in entry-level vehicle door assemblies. IC Role / Device Role / Timing Role: Central controller executing polling logic, driving LEDs, and communicating via LIN or discrete signals. Use Value: Low pin count and integrated ADC reduce BOM cost; Stop3 mode extends battery life during vehicle sleep states. | Use Scenario: Local analog sensing of ambient temperature in HVAC ducts or factory equipment enclosures. IC Role / Device Role / Timing Role: Signal conditioner and data acquisition node converting thermistor voltage to digital values for transmission. Use Value: Internal bandgap reference and temperature sensor channel enable self-calibration; 128-byte RAM suffices for local averaging and wake-on-threshold logic. |
| Smart Appliance Control Board | LED Dimming Driver |
Use Scenario: Managing user interface buttons, buzzer feedback, and relay control in washing machines or microwaves. IC Role / Device Role / Timing Role: Primary MCU handling KBI inputs, PWM fan control, and fault monitoring. Use Value: Software-selectable pullups eliminate external resistors; BKGD pin enables field firmware updates without JTAG header. | Use Scenario: Generating dimmable PWM waveforms for high-efficiency LED lighting in signage or task lighting. IC Role / Device Role / Timing Role: Precision PWM generator with buffered edge-aligned output and dead-time control. Use Value: TIM1's dual-channel PWM supports complementary outputs; 16 MHz clock ensures fine-grained duty-cycle resolution at 1–20 kHz switching frequencies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08QD2CPBE | Same core, flash, and RAM; PDIP-8 package instead of SOIC-8; rated for –40 °C to 105 °C (vs. –40 °C to 125 °C for S9S08QD2J1MSCR) | Preferred for through-hole prototyping or legacy board reuse; lacks automotive qualification | Select when manual soldering or socket-based testing is required; verify thermal margin for high-temp environments |
| S9S08QD4J1MSCR | Same package and temperature grade; doubles flash (4096 B) and RAM (256 B); identical peripherals and pinout | Suitable for designs requiring larger firmware (e.g., bootloader + application) or more runtime variables | Drop-in upgrade path when code size exceeds 2 KB or additional RAM buffers are needed |
Compared with MC9S08QD2CPBE, S9S08QD2J1MSCR offers extended temperature operation and surface-mount compatibility; compared with S9S08QD4J1MSCR, it trades memory capacity for lower unit cost in resource-constrained applications where firmware fits within 2 KB.
Availability
S9S08QD2J1MSCR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and smart appliance control boards requiring stable component supply and long-term manufacturability.
Supply support for S9S08QD2J1MSCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The S9S08QD2J1MSCR belongs to the HCS08 QD-series microcontrollers, designed specifically for cost-optimized, low-pin-count embedded control in automotive and industrial environments where reliability, debug accessibility, and power efficiency are critical.
FAQ
What is the operating temperature range for the S9S08QD2J1MSCR?
The S9S08QD2J1MSCR is qualified for operation from –40 °C to +125 °C, meeting automotive-grade thermal requirements for under-hood and cabin-mounted electronic control units. This rating is confirmed in the MC9S08QD4 Series Data Sheet Rev. 7 and applies specifically to the S9S08QD2 variant with the 'J' temperature suffix. The device maintains full functionality-including flash programming, ADC accuracy, and timer operation-across this full range.
Does the S9S08QD2J1MSCR support in-circuit debugging?
Yes, the S9S08QD2J1MSCR supports single-wire background debug mode (BDM) via the BKGD/MS pin, enabling full in-circuit programming, real-time register inspection, and breakpoint-based debugging without halting system clocks. It provides one hardware breakpoint plus two additional breakpoints managed by the on-chip debug module, as documented in the HCS08 CPU chapter of the official data sheet.
What are the power supply requirements for the S9S08QD2J1MSCR?
The S9S08QD2J1MSCR operates from a single supply rail between 2.7 V and 5.5 V, compatible with common 3.3 V and 5 V system buses. Its internal voltage regulator and low-voltage detection circuitry ensure reliable reset behavior and brown-out protection across this range. The device draws less than 100 µA in Stop3 mode, making it suitable for battery-backed applications.
Can the S9S08QD2J1MSCR generate PWM signals?
Yes, the S9S08QD2J1MSCR integrates two timer/PWM modules: TIM1 (2-channel) and TIM2 (1-channel), each supporting buffered edge-aligned and center-aligned PWM outputs. These timers accept internal or external clock sources and support programmable period and duty cycle, enabling precise motor speed control, LED dimming, or DC-DC converter gate drive in the S9S08QD2J1MSCR-based design.
Is the S9S08QD2J1MSCR pin-compatible with other QD-series MCUs?
Yes, the S9S08QD2J1MSCR in 8-pin SOIC is pin-compatible with the S9S08QD4J1MSCR and MC9S08QD4CPBE variants, sharing identical pin assignments, electrical characteristics, and peripheral mapping. This allows direct substitution where increased flash or RAM is not required, or facilitates migration to higher-memory versions without PCB redesign.
S9S08QD2J1MSCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 16MHz
- Connectivity:
- -
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 4
- Program Memory Size:
- 2KB (2K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128 x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08QD2J1MSCR FAQ
1.How can I place an order for S9S08QD2J1MSCR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08QD2J1MSCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08QD2J1MSCR reliable?
The price and inventory of S9S08QD2J1MSCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08QD2J1MSCR is usually 5 days.
3.What payment methods are accepted for S9S08QD2J1MSCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08QD2J1MSCR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08QD2J1MSCR?
S9S08QD2J1MSCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08QD2J1MSCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08QD2J1MSCR?
For technical support, including S9S08QD2J1MSCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08QD2J1MSCR requirements.
6.How does Aetrix verify that S9S08QD2J1MSCR is sourced from the original manufacturer or authorized distributors?
All S9S08QD2J1MSCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08QD2J1MSCR meets industry standards.
7.What is the process for return or replacement of S9S08QD2J1MSCR?
All S9S08QD2J1MSCR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08QD2J1MSCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08QD2J1MSCR part is unused and in its original packaging.
Return procedure for S9S08QD2J1MSCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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