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NXP Semiconductors S9S08QD2J1VSCR

Part No.:
S9S08QD2J1VSCR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixS9S08QD2J1VSCR.pdf
Description:
IC MCU 8BIT 2KB FLASH 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,739

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Product details

Overview

S9S08QD2J1VSCR from NXP Semiconductors is an 8-bit HCS08 microcontroller with 16 MHz CPU, 2048 bytes of flash memory, and 128 bytes of RAM, designed for cost-sensitive embedded control in automotive body electronics and industrial sensors. It integrates ADC, dual timers (TIM1/TIM2), keyboard interrupt module, and internal clock source with FLL.

For engineers reviewing the S9S08QD2J1VSCR datasheet, S9S08QD2J1VSCR pinout, S9S08QD2J1VSCR application, or S9S08QD2J1VSCR equivalent, key selection criteria include flash size, I/O count, SOIC-8 package compatibility, low-voltage detection, and single-wire background debug support.

Technical Context

The S9S08QD2J1VSCR implements the HCS08 CPU core with HC08 instruction set plus BGND, supporting up to 32 interrupt/reset sources and active background debugging with one hardware breakpoint. Its internal clock source (ICS) uses a frequency-locked loop (FLL) trimmed for ±0.2% resolution and ±2% deviation over voltage and temperature.

Memory subsystem includes flash programmable/erasable across full operating range, with block protection and vector redirection. Peripherals include a 4-channel 10-bit ADC with hardware trigger from RTI, two timer modules (TIM1: 2-channel, TIM2: 1-channel), and a 4-pin keyboard interrupt module with software-selectable edge/level polarity.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreHCS08 8-bit core with BGND instruction and background debug interface
Max Clock Frequency16 MHz bus clock, derived from ICS FLL with internal reference trimming
Flash Memory2048 bytes, read/program/erase over full voltage/temperature range with block protection
RAM Size128 bytes, used for stack, variables, and temporary data storage
ADC4-channel, 10-bit, with automatic compare, internal bandgap reference, and RTI-triggered conversion
TimersTIM1: 2-channel; TIM2: 1-channel; each supports input capture, output compare, and edge/center-aligned PWM
Package8-pin SOIC, RoHS-compliant, 150 mil width, standard JEDEC outline

Pinout & Package

8-pin SOIC package (JEDEC MS-012AC), 150 mil body width, surface-mount, RoHS-compliant. Pinout validated per MC9S08QD4 Series Data Sheet Rev. 7 (2022), Section 2.1.

Pin/TerminalCircuit RoleDesign Meaning
VDDSupply voltageCore and I/O power supply (2.7–5.5 V); decoupling required at pin
VSSGroundDigital ground reference; must be connected to system GND plane
RESETActive-low reset inputInternal pullup enabled; asserts reset on falling edge or low hold
BKGD/MSSingle-wire debug interfaceShares pin with mode select; enables background debug communication
PTA0/AD0GPIO / ADC channel 0Configurable as digital I/O or analog input; supports ADC sampling
PTA1/AD1GPIO / ADC channel 1Configurable as digital I/O or analog input; shares port A with PTA0
PTA2/AD2GPIO / ADC channel 2Configurable as digital I/O or analog input; supports internal temperature sensor
PTA3/AD3GPIO / ADC channel 3Configurable as digital I/O or analog input; supports internal bandgap reference channel

Key Features

FeatureDesign Value
Internal Clock Source (ICS)FLL-based clock generation with ±0.2% trim resolution enables stable timing without external crystal
Low-Voltage Detection (LVD)Configurable reset or interrupt on undervoltage condition, critical for automotive brown-out resilience
Hardware-Triggered ADCRTI counter initiates conversions autonomously-reduces CPU load during periodic sensing
Single-Wire Background DebugEnables in-circuit programming and real-time debugging using only BKGD/MS pin
Flash Block ProtectionPrevents accidental overwrite of bootloader or calibration data via dedicated protection register

Applications

Automotive Door ModuleIndustrial Temperature Sensor Node

Use Scenario: Control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies.

IC Role / Device Role / Timing Role: Primary MCU executing motor control logic, switch debouncing, and LIN bus interface coordination.

Use Value: Integrated TIM1/TIM2 enable precise PWM for DC motor speed control; 10-bit ADC reads potentiometer and thermistor inputs directly.

Use Scenario: Standalone environmental monitoring unit measuring ambient temperature and supply voltage in factory equipment cabinets.

IC Role / Device Role / Timing Role: Sensor hub collecting analog readings, performing local threshold checks, and signaling alerts via GPIO.

Use Value: Internal temperature sensor and bandgap reference eliminate need for external components; LVD ensures reliable operation during power fluctuations.

Smart Appliance Control BoardLED Dimming Controller

Use Scenario: Main control unit for microwave oven or washing machine user interface and safety interlocks.

IC Role / Device Role / Timing Role: Real-time executor of keypad scan, display update, and door latch monitoring with fail-safe reset behavior.

Use Value: KBI module scans 4-key matrix with software-selectable edge/level sensitivity; COP watchdog prevents firmware lockup during cooking cycles.

Use Scenario: Constant-current LED driver for architectural lighting with smooth dimming and thermal derating.

IC Role / Device Role / Timing Role: PWM generator synchronizing multiple LED channels while reading thermal feedback via ADC.

Use Value: TIM1 buffered edge-aligned PWM delivers stable 1–100% dimming range; 128-byte RAM suffices for lookup tables and state tracking.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08QD2CPBESame core, 2048B flash, 128B RAM, but in 8-pin PDIP package; no SOIC optionThrough-hole assembly only; lacks SOIC thermal and space advantagesSelect when legacy through-hole manufacturing or prototyping on breadboard is required
S9S08QD4J1VSCRSame package and pinout, but doubles flash (4096B) and RAM (256B); identical peripherals and clockingSupports larger firmware images and more complex state machines without hardware changeChoose when future firmware expansion or additional feature integration is anticipated

Compared with MC9S08QD2CPBE and S9S08QD4J1VSCR, the S9S08QD2J1VSCR provides optimal balance of cost, footprint, and resource allocation for fixed-function automotive and industrial controls where code size remains under 2 KB and RAM usage stays below 128 B.

Availability

S9S08QD2J1VSCR is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, and smart appliance control boards requiring stable component supply and long-term lifecycle support.

Supply support for S9S08QD2J1VSCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, delivering secure, scalable solutions for automotive, industrial, IoT, and mobile applications.

The HCS08 family-including S9S08QD2J1VSCR-is designed for cost-effective, low-power embedded control in automotive body electronics and industrial automation where small footprint, debug capability, and robustness across temperature/voltage variations are essential.

FAQ

What is the maximum operating frequency of the S9S08QD2J1VSCR?

The S9S08QD2J1VSCR features an HCS08 CPU core with a maximum bus clock frequency of 16 MHz, achieved via its internal clock source (ICS) with frequency-locked loop (FLL). This frequency is maintained across the full operating voltage (2.7–5.5 V) and temperature (−40 °C to 125 °C) range, as verified in the MC9S08QD4 Series Data Sheet Rev. 7.

Does the S9S08QD2J1VSCR support in-circuit debugging?

Yes, the S9S08QD2J1VSCR supports single-wire background debugging via the BKGD/MS pin, enabling real-time program execution control, register inspection, and memory access without halting system operation. The on-chip debug module provides one hardware breakpoint plus two additional breakpoints managed by the debug interface.

What ADC capabilities does the S9S08QD2J1VSCR offer?

The S9S08QD2J1VSCR integrates a 4-channel, 10-bit analog-to-digital converter with internal bandgap reference, temperature sensor channel, and hardware triggering via the RTI counter. It supports automatic compare functionality and asynchronous clocking, allowing deterministic sampling intervals independent of CPU activity.

Is the S9S08QD2J1VSCR pin-compatible with other QD-series MCUs?

Yes, the S9S08QD2J1VSCR in 8-pin SOIC is pin-compatible with S9S08QD4J1VSCR and shares identical pin assignments, electrical characteristics, and peripheral mapping. However, it is not pin-compatible with PDIP-packaged variants like MC9S08QD2CPBE due to differing package footprints and thermal pad configurations.

What power-saving modes are available on the S9S08QD2J1VSCR?

The S9S08QD2J1VSCR supports Wait mode plus three Stop modes (Stop1, Stop2, Stop3), each progressively reducing power consumption. Stop3 disables the ICS and most peripherals while retaining RAM content and enabling wake-up via IRQ or reset. Low-voltage detection and COP watchdog remain functional in selected Stop modes per configuration.

S9S08QD2J1VSCR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
-
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
4
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08QD2J1VSCR FAQ

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Please submit a Request for Quotation (RFQ) for S9S08QD2J1VSCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of S9S08QD2J1VSCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08QD2J1VSCR is usually 5 days.

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S9S08QD2J1VSCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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5.How can I obtain technical support or documentation for S9S08QD2J1VSCR?

For technical support, including S9S08QD2J1VSCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08QD2J1VSCR requirements.

6.How does Aetrix verify that S9S08QD2J1VSCR is sourced from the original manufacturer or authorized distributors?

All S9S08QD2J1VSCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08QD2J1VSCR meets industry standards.

7.What is the process for return or replacement of S9S08QD2J1VSCR?

All S9S08QD2J1VSCR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08QD2J1VSCR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08QD2J1VSCR part is unused and in its original packaging.

Return procedure for S9S08QD2J1VSCR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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