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NXP Semiconductors S9S08RN16W2MTG

Part No.:
S9S08RN16W2MTG
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08RN16W2MTG.pdf
Description:
IC MCU 8BIT 16KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,645

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Product details

Overview

S9S08RN16W2MTG from NXP Semiconductors (formerly Freescale) is an 8-bit S08 microcontroller with 16 KB flash, 256-byte EEPROM with ECC, and 2 KB RAM, operating at up to 20 MHz bus frequency across –40 °C to +125 °C. It integrates ADC (10-bit, 8-channel), two SCI/UARTs, I²C, SPI, FTM timers, TSI touch sensing, and low-power stop3 mode consuming only 4.6 µA - deployed in automotive body control modules, industrial sensor nodes, and HVAC actuator interfaces.

For engineers reviewing the S9S08RN16W2MTG datasheet, S9S08RN16W2MTG pinout, S9S08RN16W2MTG application, or S9S08RN16W2MTG equivalent, this page delivers verified technical context, package-specific pin assignments, real-world use-value per application, and two validated alternative parts - all grounded in the official S9S08RN16DS Rev 1 (02/2014) specification.

Technical Context

The S9S08RN16W2MTG implements an enhanced S08 CPU core with four-level nested interrupt support and up to 40 interrupt/reset sources. Its clock system combines a Pierce oscillator (XOSC) for crystal/resonator operation and an internal clock source (ICS) with FLL, delivering ±2% DCO frequency deviation over –40 °C to 125 °C.

System protection includes independent watchdog timer, configurable low-voltage detect (LVD) with four warning thresholds per range, illegal opcode/address detection, and flash/RAM access protection. Debug is enabled via single-wire BDM interface with three breakpoints and on-chip ICE module featuring two comparators and nine trigger modes.

Key Specifications

Parameter Value and Actual Design Meaning
Core 8-bit S08 CPU, up to 20 MHz bus frequency at 2.7–5.5 V
Memory 16 KB flash (read/program/erase over full voltage/temp), 256-byte EEPROM with ECC, 2 KB RAM
ADC 8-channel, 10-bit resolution, 2.5 µs conversion time, supports stop3 mode operation
Low-Power Modes Stop3 mode draws 4.6 µA (5 V); adds 40 µA for ADC, 121 µA for TSI, 128 µA for LVD
Operating Temp –40 °C to +125 °C ambient, junction rated to +135 °C
I/O Drive Four ultra-high-current pins (20 mA sink/source), two true open-drain outputs, 35 GPIOs total
Package 16-pin TSSOP (TG), θJA = 130 °C/W on single-layer board

Pinout & Package

16-pin TSSOP (TG) package, 3.0 mm × 4.4 mm body, 0.65 mm pitch, exposed pad not present. Thermal resistance θJA = 130 °C/W (single-layer board).

Pin/Terminal Circuit Role Design Meaning
VDD Power supply Primary 2.7–5.5 V digital supply; decoupling required near pin
VSS Ground reference Digital ground return; must be connected to system GND plane
PTA0–PTA7 GPIO / peripheral multiplex 8-bit port A; PTA2/PTA3 are true open-drain; PTA4–PTA7 support KBI
PTB0–PTB7 GPIO / peripheral multiplex 8-bit port B; PTB4/PTB5 support ultra-high-current drive (20 mA)
RESET_B Active-low reset input Asynchronous reset; accepts min. 1.5×tSelf_reset pulse width; internal pullup
EXTAL/XTAL Crystal oscillator inputs Connect external crystal/resonator (4–20 MHz high range or 32–40 kHz low range)

Key Features

Feature Design Value
Flash & EEPROM reliability 16 KB flash with read-while-write; 256-byte EEPROM with ECC and 2-byte erase sectors
Low-power operation Stop3 mode with 1 kHz LPO clock active; peripherals like ADC, TSI, and LVD retain wake capability
Touch sensing interface TSI module supports up to 16 electrodes; hardware scan trigger; wakes MCU from Stop3
Robust clocking ICS with FLL achieves ±2% accuracy over –40 °C to 125 °C; XOSC supports ceramic resonators
Debug & development Single-wire BDM interface with 3 breakpoints; on-chip ICE with 2 comparators and 9 trigger modes

Applications

Automotive Body Control Unit Industrial Sensor Node

Use Scenario: Centralized control of door locks, window lifts, and interior lighting in passenger vehicles.

IC Role / Device Role / Timing Role: Main MCU executing CAN/LIN gateway logic, analog sensor acquisition, and PWM-driven motor control.

Use Value: 8-channel 10-bit ADC acquires cabin temperature/humidity sensors; ultra-high-current pins directly drive relays; Stop3 mode enables <5 µA sleep current for battery longevity.

Use Scenario: Wireless-capable environmental monitor deployed in factory floors or remote substations.

IC Role / Device Role / Timing Role: Signal conditioner and data aggregator interfacing thermistors, pressure transducers, and RS-485 transceivers.

Use Value: TSI detects panel touch for local HMI; dual SCI ports enable simultaneous Modbus RTU and debug UART; LVD with four warning levels prevents brownout-induced firmware corruption.

HVAC Actuator Module Smart Appliance Control Board

Use Scenario: Precision airflow damper control in commercial HVAC systems using stepper or DC motors.

IC Role / Device Role / Timing Role: Real-time motion controller managing FTM-generated edge-aligned PWM and quadrature encoder feedback.

Use Value: Two 16-bit FTM modules provide 6-channel and 2-channel PWM outputs; RTC maintains scheduling during power cycles; 20 mA sink capability drives MOSFET gate drivers directly.

Use Scenario: Main control unit in refrigerators or washing machines handling user interface, motor sequencing, and safety monitoring.

IC Role / Device Role / Timing Role: Safety-critical supervisor coordinating thermal cutoffs, door interlocks, and water-level sensing via ACMP and ADC.

Use Value: Analog comparator (ACMP) provides fast overtemperature trip with independent interrupt; EEPROM stores calibration offsets with ECC; watchdog uses independent clock to survive clock failure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08RN8W2MTG 8 KB flash, 128-byte EEPROM, same 16-pin TSSOP package and peripheral set Lower memory capacity limits firmware complexity; suitable for cost-sensitive, function-limited designs Select when application firmware fits within 8 KB and no future memory expansion is anticipated
S9S08RN16W2MLF Same 16 KB flash and peripherals, but in 48-pin LQFP package with 35 GPIOs and full 12-channel ADC Enables larger I/O count and higher-resolution analog acquisition; requires PCB redesign Choose when design needs >16 pins or 12-bit ADC channels; not drop-in compatible with TG package

Compared with MC9S08RN8W2MTG, the S9S08RN16W2MTG doubles flash and EEPROM while retaining identical package and low-power behavior; versus S9S08RN16W2MLF, it trades I/O count and ADC channel count for compact 16-pin footprint - making it optimal for space-constrained, memory-moderate embedded control.

Availability

S9S08RN16W2MTG is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, HVAC actuators, and smart appliance control requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S9S08RN16W2MTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors acquired Freescale in 2015 and maintains full support for the legacy S08 portfolio, delivering high-reliability microcontrollers for automotive, industrial, and consumer applications.

The S9S08RN16W2MTG belongs to the S08RN family - designed specifically for cost-sensitive, low-power embedded control in harsh environments, emphasizing robust clocking, integrated analog peripherals, and extended-temperature operation without external supervision circuitry.

FAQ

What is the maximum bus frequency supported by the S9S08RN16W2MTG?

The S9S08RN16W2MTG supports a maximum bus frequency of 20 MHz across its full operating voltage range (2.7 V to 5.5 V) and temperature range (–40 °C to +125 °C). This is achieved using the internal clock source (ICS) with FLL or external crystal oscillator (XOSC), and is confirmed in Table 5 of the S9S08RN16DS Rev 1 datasheet under "Bus frequency".

Does the S9S08RN16W2MTG support in-circuit debugging, and what interface is used?

Yes, the S9S08RN16W2MTG supports in-circuit debugging via a single-wire background debug mode (BDM) interface. It includes breakpoint capability for up to three breakpoints and an on-chip in-circuit emulator (ICE) module with two comparators and nine trigger modes - all documented in Section 1.3 ("Development support") of the S9S08RN16DS Rev 1 datasheet.

What are the low-power consumption characteristics of the S9S08RN16W2MTG in Stop3 mode?

In Stop3 mode, the S9S08RN16W2MTG draws 4.6 µA at 5 V (–40 °C to +125 °C). Adding active peripherals increases current: +40 µA for ADC, +121 µA for TSI, and +128 µA for LVD - all specified in Table 4 of the S9S08RN16DS Rev 1 datasheet. The 1 kHz LPO clock remains active to support wake events.

Which package type does the S9S08RN16W2MTG use, and what are its thermal characteristics?

The S9S08RN16W2MTG uses a 16-pin TSSOP package (designator "TG"). Its thermal resistance is θJA = 130 °C/W on a single-layer board and 87 °C/W on a four-layer board, as listed in Table 8 of the S9S08RN16DS Rev 1 datasheet. The device is rated for junction temperatures up to +135 °C.

Can the S9S08RN16W2MTG perform analog-to-digital conversion while in low-power mode?

Yes, the S9S08RN16W2MTG supports ADC operation in Stop3 mode. Its 8-channel, 10-bit ADC can be triggered and acquire data while the CPU and most peripherals are halted - enabling precise sensor sampling with minimal power overhead. This capability is explicitly stated in the "Peripherals" section of the S9S08RN16DS Rev 1 datasheet.

S9S08RN16W2MTG Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08RN16W2MTG FAQ

1.How can I place an order for S9S08RN16W2MTG through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08RN16W2MTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08RN16W2MTG reliable?

The price and inventory of S9S08RN16W2MTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08RN16W2MTG is usually 5 days.

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Once your S9S08RN16W2MTG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08RN16W2MTG?

For technical support, including S9S08RN16W2MTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08RN16W2MTG requirements.

6.How does Aetrix verify that S9S08RN16W2MTG is sourced from the original manufacturer or authorized distributors?

All S9S08RN16W2MTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08RN16W2MTG meets industry standards.

7.What is the process for return or replacement of S9S08RN16W2MTG?

All S9S08RN16W2MTG units undergo pre-shipment inspection (PSI). If there is an issue with S9S08RN16W2MTG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08RN16W2MTG part is unused and in its original packaging.

Return procedure for S9S08RN16W2MTG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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