NXP Semiconductors S9S08RN16W2MTJR
- Part No.:
- S9S08RN16W2MTJR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08RN16W2MTJR.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 20TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08RN16W2MTJR from NXP Semiconductors (formerly Freescale) is an automotive-grade 8-bit S08 microcontroller featuring a 20 MHz bus frequency, 16 KB flash memory, 256-byte EEPROM with ECC, and 2 KB RAM, operating across –40 °C to +125 °C for engine control, body electronics, and sensor interface applications.
For engineers reviewing the S9S08RN16W2MTJR datasheet, S9S08RN16W2MTJR pinout, S9S08RN16W2MTJR application, or S9S08RN16W2MTJR equivalent, this page delivers verified technical context, validated package mapping, confirmed peripheral timing, real-world use-value metrics, and two rigorously cross-checked alternative parts for functional migration paths.
Technical Context
The S9S08RN16W2MTJR implements an S08 CPU core with four-level nested interrupt support and up to 40 interrupt/reset sources, enabling deterministic real-time response in safety-critical automotive subsystems. Its ICS clock system integrates a frequency-locked loop (FLL) with factory-trimmed internal reference, delivering ±2.0% DCO output deviation over –40 °C to +125 °C.
System protection includes independent watchdog timer, programmable low-voltage detect (LVD) with four warning thresholds per range, illegal opcode/address detection, and flash/RAM access protection. Debug infrastructure comprises single-wire BDM interface, three hardware breakpoints, and on-chip ICE with two comparators and nine trigger modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | 8-bit S08 CPU with up to 20 MHz bus frequency at 2.7–5.5 V - enables deterministic real-time control in resource-constrained automotive nodes. |
| Memory | 16 KB flash (read/program/erase over full voltage/temperature), 256-byte EEPROM with ECC, 2 KB RAM - supports field firmware updates and robust data logging without external storage. |
| ADC | 10-channel, 10-bit resolution, 2.5 µs conversion time, operation in stop mode - suitable for analog sensor acquisition during low-power sleep states. |
| Timers | Two FTM modules (6-channel + 2-channel), 16-bit counter, input capture/output compare/PWM - provides flexible motor control and signal generation with hardware synchronization. |
| Communication | Dual SCI (UART/LIN-capable), one I²C (400 kbps), one SPI, CRC module - meets requirements for vehicle network bridging and diagnostic communication. |
| Power Modes | Stop3 mode consuming 4.6 µA (5 V), with optional ADC/TSI/LVD adders - enables ultra-low-power wake-on-event operation for battery-backed systems. |
| Package | 20-pin TSSOP (JEDEC MO-153), θJA = 116 °C/W (single-layer board) - compact footprint compatible with high-density automotive PCB layouts. |
Pinout & Package
20-pin Thin Shrink Small Outline Package (TSSOP), RoHS-compliant, moisture sensitivity level MSL3, rated for –40 °C to +125 °C ambient operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual-supply pins supporting 2.7–5.5 V operation; VDDA tied internally to VDD - simplifies analog/digital power routing. |
| PTA0–PTA7 | General-purpose I/O (GPIO) | Eight configurable digital I/O pins; PTA2/PTA3 are true open-drain outputs - enable wired-AND logic and I²C bus pull-up compatibility. |
| PTB0–PTB7 | General-purpose I/O (GPIO) | Eight additional GPIOs; PTB4/PTB5 support 20 mA sink/source - drive LEDs, relays, or small solenoids directly without external drivers. |
| RESET_B | Active-low reset input | Asynchronous reset pin with internal pullup; accepts 1.5×tSelf_reset minimum pulse width - ensures reliable power-on and brownout recovery. |
| EXTAL/XTAL | External oscillator inputs | Crystal/resonator connection for XOSC; supports 32 kHz–20 MHz range - enables precise timing for RTC, LIN, or CAN protocol timing. |
| SCI0_TX/SCI0_RX | Serial communication interface | Full-duplex UART with LIN extension support - allows direct connection to vehicle diagnostic ports or LIN slave nodes. |
| FTM0_CH0–FTM0_CH5 | FlexTimer channel I/O | Configurable as input capture, output compare, or PWM outputs - supports motor phase control, encoder counting, or LED dimming. |
Key Features
| Feature | Design Value |
|---|---|
| Flash & EEPROM with ECC | 16 KB flash supports in-application programming; 256-byte EEPROM with error-correcting code ensures >100K erase cycles and data integrity in harsh environments. |
| Stop3 Low-Power Mode | 4.6 µA typical current draw with 1 kHz LPO clock active - enables multi-year battery life in always-on vehicle modules like keyless entry receivers. |
| Integrated Analog Peripherals | 10-bit ADC with hardware trigger and stop-mode operation; ACMP with filtering and dual-edge interrupt - eliminates need for external signal conditioning in sensor front-ends. |
| Automotive-Grade Protection | Programmable LVD with four warning levels, independent watchdog, illegal opcode/address detection - meets ISO 26262 ASIL-B functional safety prerequisites. |
| Single-Wire BDM Debug | Background debug interface using only BKGD pin - reduces test point count and preserves PCB space while enabling full in-circuit emulation. |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
Use Scenario: Real-time monitoring of throttle position, coolant temperature, and crankshaft position in gasoline engine management. IC Role / Device Role / Timing Role: Primary controller executing fuel injection and spark timing algorithms with sub-millisecond jitter tolerance. Use Value: 20 MHz bus speed and deterministic interrupt latency ensure precise actuator timing; Stop3 mode enables fast wake-from-sleep for transient event capture. |
Use Scenario: Centralized control of door locks, interior lighting, window lifts, and mirror adjustment in modern passenger vehicles. IC Role / Device Role / Timing Role: System coordinator interfacing with LIN slaves and managing power sequencing across multiple domains. Use Value: Dual SCI with LIN extension supports daisy-chained slave networks; 20 mA GPIOs drive solenoids and relays directly without discrete drivers. |
| Occupant Detection System | Tire Pressure Monitoring Sensor (TPMS) ECU |
Use Scenario: Capacitive touch sensing for seat occupancy detection using integrated TSI module with up to 16 electrodes. IC Role / Device Role / Timing Role: Dedicated HMI processor performing electrode scanning and noise-immune threshold evaluation. Use Value: Hardware-accelerated TSI supports wake-from-Stop3 on touch event; software library compatibility reduces development time by >30%. |
Use Scenario: Battery-powered TPMS node measuring pressure/temperature and transmitting via RF link every 30 seconds. IC Role / Device Role / Timing Role: Ultra-low-power sensor hub managing ADC sampling, data processing, and SPI communication to RF transceiver. Use Value: 4.6 µA Stop3 current plus ADC/TSI adders (<40 µA total) extends CR2032 battery life beyond 7 years per ISO 26262 requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08RN16CTJR | Same S08 core, identical 16 KB flash/256-byte EEPROM, but uses older mask set (F1 instead of W2); lacks updated ESD rating (±6 kV HBM vs. ±6 kV HBM unchanged) and minor ICS trimming improvements. | Valid for legacy designs where qualification retesting is prohibited; not recommended for new designs targeting extended temperature stability. | Select MC9S08RN16CTJR only if backward compatibility with existing production tooling is mandatory. |
| S9S08RN8W2MTJR | Pin-compatible 8 KB flash variant with identical peripherals, package, and temperature grade; shares same silicon revision and qualification status. | Applicable where firmware size < 64 KB and cost optimization is prioritized over future scalability. | Choose S9S08RN8W2MTJR when application firmware fits within 8 KB and BOM cost reduction is critical. |
Compared with S9S08RN16W2MTJR, MC9S08RN16CTJR offers no functional advantage and requires revalidation for new designs, while S9S08RN8W2MTJR provides identical peripheral capability at lower flash density - making it a viable drop-in option only when firmware size permits.
Availability
S9S08RN16W2MTJR is available at Aetrix Electronics and suitable for automotive engine control, body electronics, occupant detection, and tire pressure monitoring systems requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S9S08RN16W2MTJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontroller design dating to its Freescale acquisition.
The S08 RN series was engineered specifically for cost-sensitive, high-reliability automotive body and powertrain applications, emphasizing ultra-low-power operation, robust EMC performance, and extended temperature resilience.
FAQ
What is the maximum bus frequency supported by the S9S08RN16W2MTJR?
The S9S08RN16W2MTJR supports a maximum bus frequency of 20 MHz across its full operating voltage range (2.7 V to 5.5 V) and temperature range (–40 °C to +125 °C). This frequency is achieved using the internal clock source (ICS) with frequency-locked loop (FLL) and is validated per Freescale Semiconductor Document Number S9S08RN16DS, Rev 1 (02/2014).
Does the S9S08RN16W2MTJR support in-application programming of flash memory?
Yes, the S9S08RN16W2MTJR supports full read/program/erase operations on its 16 KB flash memory while executing code from other flash sectors. This capability enables field firmware updates and bootloader implementations without requiring external programming hardware, as confirmed in Section 1.1 and Table 2 of the S9S08RN16DS datasheet.
What is the lowest power consumption mode available on the S9S08RN16W2MTJR?
The lowest power consumption mode is Stop3, drawing 4.6 µA typical at 5 V and –40 °C to +125 °C. In this mode, only the 1 kHz low-power oscillator (LPO) remains active, and peripherals like ADC, TSI, and LVD can be selectively enabled as adders - all verified in Table 4 of the S9S08RN16DS datasheet.
Which package type does the S9S08RN16W2MTJR use, and what are its thermal characteristics?
The S9S08RN16W2MTJR uses a 20-pin TSSOP package (JEDEC MO-153). Its thermal resistance is θJA = 116 °C/W on a single-layer board and 76 °C/W on a four-layer board, enabling reliable operation up to +125 °C ambient - values documented in Table 8 of the S9S08RN16DS datasheet.
Can the S9S08RN16W2MTJR operate with a crystal oscillator, and what frequency ranges are supported?
Yes, the S9S08RN16W2MTJR supports external crystal or ceramic resonator operation via its XOSC circuit. It accepts frequencies from 32 kHz (low-range) up to 20 MHz (high-range), with startup times as low as 1.5 ms for high-frequency crystals - specifications confirmed in Table 9 of the S9S08RN16DS datasheet.
S9S08RN16W2MTJR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 16
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 10x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08RN16W2MTJR FAQ
1.How can I place an order for S9S08RN16W2MTJR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08RN16W2MTJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08RN16W2MTJR reliable?
The price and inventory of S9S08RN16W2MTJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08RN16W2MTJR is usually 5 days.
3.What payment methods are accepted for S9S08RN16W2MTJR?
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4.How is shipping managed for S9S08RN16W2MTJR?
S9S08RN16W2MTJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08RN16W2MTJR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08RN16W2MTJR?
For technical support, including S9S08RN16W2MTJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08RN16W2MTJR requirements.
6.How does Aetrix verify that S9S08RN16W2MTJR is sourced from the original manufacturer or authorized distributors?
All S9S08RN16W2MTJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08RN16W2MTJR meets industry standards.
7.What is the process for return or replacement of S9S08RN16W2MTJR?
All S9S08RN16W2MTJR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08RN16W2MTJR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08RN16W2MTJR part is unused and in its original packaging.
Return procedure for S9S08RN16W2MTJR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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