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NXP Semiconductors S9S08RN16W2VTJ

Part No.:
S9S08RN16W2VTJ
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08RN16W2VTJ.pdf
Description:
IC MCU 8BIT 16KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,050

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Product details

Overview

S9S08RN16W2VTJ from NXP Semiconductors (formerly Freescale) is an automotive-grade 8-bit S08 microcontroller featuring a 20 MHz bus frequency, 16 KB flash memory, 256-byte EEPROM with ECC, and 2 KB RAM, operating across -40 °C to 125 °C for engine control, body electronics, and sensor interface applications.

For engineers reviewing the S9S08RN16W2VTJ datasheet, S9S08RN16W2VTJ pinout, S9S08RN16W2VTJ application, or S9S08RN16W2VTJ equivalent, this page delivers verified electrical specs, thermal behavior at extended temperature, low-power stop3 mode current (4.6 µA), I/O drive strength (20 mA sink/source on PTB4/PTB5), and peripheral timing constraints per Rev 1 (02/2014) data sheet.

Technical Context

The S9S08RN16W2VTJ implements an S08 CPU core with four-level nested interrupt support and up to 40 interrupt/reset sources. Its clock system integrates a loop-controlled Pierce oscillator (XOSC) and an internal clock source (ICS) with FLL, enabling precise 1–2% frequency stability across -40 °C to 125 °C via factory-trimmed internal reference.

System protection includes independent watchdog timer, configurable low-voltage detection (LVD) with four warning thresholds in high/low ranges, illegal opcode/address detection, and flash/RAM access protection. Debug is enabled via single-wire background debug interface (BDM) with three breakpoints and on-chip ICE module supporting nine trigger modes.

Key Specifications

Parameter Value and Actual Design Meaning
Core 8-bit S08 CPU, up to 20 MHz bus frequency at 2.7–5.5 V
Memory 16 KB flash (read/program/erase over full voltage/temp), 256 B EEPROM with ECC, 2 KB RAM
Operating Temp -40 °C to +125 °C ambient, qualified for automotive underhood applications
Power Modes Stop3 mode draws 4.6 µA (5 V), with optional ADC/TSI/LVD adders increasing current by ≤128 µA
I/O Drive Four ultra-high-current pins (PTB4/PTB5) support 20 mA sink/source; standard I/O: 5 mA @ 5 V
Clock Accuracy ICS FLL output deviation: ±2.0% over -40 °C to 125 °C; ±1.0% over 0 °C to 70 °C
ADC 10-channel, 10-bit resolution, 2.5 µs conversion time, operation in stop mode, hardware trigger support
Peripherals Two FTM modules (6- and 2-channel), two SCI/UARTs with LIN support, one SPI, one I²C (400 kbps), TSI (16 electrodes)

Pinout & Package

Package: 20-pin TSSOP (JEDEC MO-153, 4.4 mm × 6.5 mm, 0.65 mm pitch). Thermal resistance θJA = 116 °C/W (single-layer board).

Pin/Terminal Circuit Role Design Meaning
VDD, VSS Power supply and ground Dual power domains: VDD (digital), VDDA (analog); VSS common return; decoupling required per datasheet layout guidelines
PTA0–PTA7 General-purpose I/O Eight-bit port A; PTA2/PTA3 are true open-drain outputs; PTA0/PTA1 support crystal/resonator connection (XTAL/EXTAL)
PTB0–PTB7 General-purpose I/O Eight-bit port B; PTB4/PTB5 support 20 mA sink/source; PTB6/PTB7 serve as SCI0 TX/RX
RESET_B Active-low reset input Asynchronous reset with 1.5×tSelf_reset minimum pulse width; internal pullup; latched during power-on reset
BKGD Background debug signal Single-wire BDM interface; requires external pullup; used for programming, debugging, and forced reset entry
AD0–AD9 Analog input channels 10 dedicated ADC inputs multiplexed on port pins; share pins with GPIO; require external filtering per analog design rules

Key Features

Feature Design Value
Flash endurance 100,000 program/erase cycles with full read/write/erase capability while executing code from flash
EEPROM reliability 256-byte EEPROM with ECC and 2-byte erase sectors enables robust nonvolatile parameter storage
Low-power operation Stop3 mode with 1 kHz LPO clock active achieves 4.6 µA typical IDD; peripherals like ADC/TSI can wake MCU
Touch sensing interface TSI supports up to 16 external electrodes with software/hardware scan triggers and stop3 wake capability
Automotive safety Independent watchdog with separate clock source, dual LVD trip points, illegal opcode/address detection with reset
Debug efficiency On-chip ICE with two comparators and nine trigger modes enables precise real-time trace and breakpoint analysis

Applications

Engine Control Unit (ECU) Body Control Module (BCM)

Use Scenario: Real-time monitoring of throttle position, coolant temperature, and crankshaft angle in gasoline/diesel engines.

IC Role / Device Role / Timing Role: Primary controller executing closed-loop fuel injection and spark timing algorithms with deterministic 20 MHz bus timing.

Use Value: 10-bit ADC with 2.5 µs conversion and stop-mode operation enables synchronized sampling without CPU overhead; -40 °C to 125 °C rating ensures underhood reliability.

Use Scenario: Centralized management of door locks, lighting, wipers, and HVAC in passenger vehicles.

IC Role / Device Role / Timing Role: System coordinator interfacing with LIN bus (via SCI), touch sensors (TSI), and discrete actuators using high-drive GPIOs.

Use Value: Four 20 mA sink/source pins directly drive relays and LEDs; TSI supports capacitive touch buttons with stop3 wake; LIN extension simplifies wiring harness integration.

Smart Sensor Node Industrial Motor Controller

Use Scenario: Localized environmental sensing (temperature, humidity, pressure) with CAN/LIN gateway functionality.

IC Role / Device Role / Timing Role: Edge-processing node converting analog sensor signals via ADC and transmitting via SCI/LIN with CRC integrity checking.

Use Value: On-chip CRC module ensures data integrity; 256-byte EEPROM stores calibration coefficients; low-power stop3 mode extends battery life in wireless nodes.

Use Scenario: Closed-loop speed/torque control of BLDC motors in pumps, fans, and compressors.

IC Role / Device Role / Timing Role: PWM generator and feedback processor using dual FTM modules for six-step commutation and ADC-based current sensing.

Use Value: Two FTM modules (6- and 2-channel) provide independent edge-aligned PWM outputs; 10-bit ADC with hardware trigger synchronizes sampling to PWM period.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08RN8W2VTJ 8 KB flash, 128 B EEPROM, same package and peripheral set; lower memory density and reduced EEPROM capacity Suitable for cost-sensitive, functionally simplified variants of BCM or sensor nodes where 16 KB flash is unused Select when firmware footprint remains under 8 KB and EEPROM usage fits within 128 B; identical pinout and qualification.
S9S08RN16W2MLF Same 16 KB flash, 256 B EEPROM, and core features but in 48-pin LQFP package with 35 GPIOs and 12-channel ADC Required for designs needing >20 GPIOs, full 12-channel ADC, or enhanced thermal performance (θJA = 82 °C/W) Choose for higher I/O count, expanded analog acquisition, or improved power dissipation in demanding industrial environments.

Compared with S9S08RN16W2VTJ, MC9S08RN8W2VTJ reduces memory and EEPROM for cost savings in simpler applications, while S9S08RN16W2MLF expands I/O and thermal headroom in larger systems-neither is pin-compatible due to differing pin counts and package footprints.

Availability

S9S08RN16W2VTJ is available at Aetrix Electronics and suitable for automotive engine control, body electronics, smart sensor nodes, and industrial motor controllers requiring stable component supply across extended temperature and long product lifecycles.

Supply support for S9S08RN16W2VTJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in microcontroller innovation from its Freescale acquisition.

The S08 RN series was designed specifically for cost-optimized, high-reliability automotive body and powertrain applications, emphasizing extended temperature operation, functional safety features, and low-power embedded control.

FAQ

What is the maximum bus frequency and operating voltage range for the S9S08RN16W2VTJ?

The S9S08RN16W2VTJ supports a maximum bus frequency of 20 MHz across its full operating voltage range of 2.7 V to 5.5 V. This specification holds over the entire qualified temperature range of -40 °C to +125 °C, as confirmed in Section 4.4 and Table 5 of the Rev 1 (02/2014) data sheet. The internal clock source (ICS) with FLL enables stable operation at this frequency with ±2.0% deviation across the full temperature range.

Does the S9S08RN16W2VTJ support in-circuit debugging, and what interface is used?

Yes, the S9S08RN16W2VTJ supports in-circuit debugging via a single-wire background debug interface (BDM) compliant with Freescale's BDM protocol. It includes breakpoint capability for up to three breakpoints and an on-chip in-circuit emulator (ICE) module with two comparators and nine trigger modes. This allows real-time trace, register inspection, and non-intrusive code execution control without requiring additional debug hardware beyond a BDM pod.

What are the low-power modes supported by the S9S08RN16W2VTJ, and what is the typical current in stop3 mode?

The S9S08RN16W2VTJ supports one low-power stop mode (stop3) and a reduced-power wait mode. In stop3 mode-with only the 1 kHz LPO clock active-the typical supply current is 4.6 µA at 5 V and -40 °C to +125 °C, as specified in Table 4, item 6 of the data sheet. Optional peripherals (ADC, TSI, LVD) add incremental current (≤128 µA total), enabling wake-on-event functionality while maintaining ultra-low quiescent draw.

How many ADC channels does the S9S08RN16W2VTJ have, and what is its resolution and conversion time?

The S9S08RN16W2VTJ includes a 10-channel, 10-bit successive-approximation ADC with a 2.5 µs conversion time, as documented in the "Peripherals" section and Table 2 of the data sheet. It supports operation in stop mode, optional hardware triggering, automatic compare functions, and uses an internal bandgap reference. Channel count is fixed for the 20-pin TSSOP package (S9S08RN16W2VTJ), unlike the 48-pin variant which offers 12 channels.

What package type and pin count does the S9S08RN16W2VTJ use, and what are its thermal characteristics?

The S9S08RN16W2VTJ uses a 20-pin TSSOP package (JEDEC MO-153, 4.4 mm × 6.5 mm, 0.65 mm pitch). Its thermal resistance is θJA = 116 °C/W on a single-layer board and 76 °C/W on a four-layer board, per Table 8 of the data sheet. This package supports automotive underhood operation up to +125 °C ambient, with junction temperature rated to +135 °C.

S9S08RN16W2VTJ Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08RN16W2VTJ FAQ

1.How can I place an order for S9S08RN16W2VTJ through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08RN16W2VTJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08RN16W2VTJ reliable?

The price and inventory of S9S08RN16W2VTJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08RN16W2VTJ is usually 5 days.

3.What payment methods are accepted for S9S08RN16W2VTJ?

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4.How is shipping managed for S9S08RN16W2VTJ?

S9S08RN16W2VTJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08RN16W2VTJ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08RN16W2VTJ?

For technical support, including S9S08RN16W2VTJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08RN16W2VTJ requirements.

6.How does Aetrix verify that S9S08RN16W2VTJ is sourced from the original manufacturer or authorized distributors?

All S9S08RN16W2VTJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08RN16W2VTJ meets industry standards.

7.What is the process for return or replacement of S9S08RN16W2VTJ?

All S9S08RN16W2VTJ units undergo pre-shipment inspection (PSI). If there is an issue with S9S08RN16W2VTJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08RN16W2VTJ part is unused and in its original packaging.

Return procedure for S9S08RN16W2VTJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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