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NXP Semiconductors S9S08RN32W1MLC
- Part No.:
- S9S08RN32W1MLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S08RN32W1MLC.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,013
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Product details
Overview
S9S08RN32W1MLC from NXP Semiconductors (formerly Freescale) is an automotive-grade 8-bit S08 microcontroller featuring a 20 MHz bus, 32 KB flash, 256-byte EEPROM with ECC, and 4 KB RAM, operating across –40 °C to 125 °C for engine control, body electronics, and powertrain sensor interfaces.
For engineers reviewing the S9S08RN32W1MLC datasheet, S9S08RN32W1MLC pinout, S9S08RN32W1MLC application, or S9S08RN32W1MLC equivalent, this page delivers verified electrical specs, validated peripheral timing, confirmed thermal behavior at 125 °C, and real-world debug interface constraints - all specific to the 32-pin LQFP package and RN32 variant.
Technical Context
The S9S08RN32W1MLC implements an S08 CPU core with four-level nested interrupt support and up to 40 interrupt/reset sources. Its internal clock system combines an FLL-controlled ICS with precision-trimmed internal reference (±2% deviation over –40 °C to 125 °C) and a loop-controlled Pierce XOSC supporting crystal or ceramic resonator inputs.
System protection includes independent watchdog clocking, configurable low-voltage detection with four warning thresholds (e.g., VLVDH = 4.3 V), illegal opcode/address reset, and flash/RAM access protection. Debug is enabled via single-wire BDM with three breakpoints and on-chip ICE with two comparators and nine trigger modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | 8-bit S08 CPU with four-level nested interrupts and 40 interrupt/reset sources |
| Flash / EEPROM / RAM | 32 KB flash (read/program/erase over full voltage/temp), 256-byte EEPROM with ECC and 2-byte erase sector, 4 KB RAM |
| Operating Range | –40 °C to 125 °C ambient; 2.7 V to 5.5 V supply; 20 MHz max bus frequency |
| ADC | 12-bit, 16-channel; 2.5 µs conversion time; supports operation in stop3 mode with hardware trigger |
| Timers & Interfaces | Three FTM modules (one 6-channel, two 2-channel), three SCI/UARTs (with LIN support), one I²C (400 kbps), two SPIs (8-/16-bit), RTC, and TSI for up to 16 electrodes |
| Power Modes | Low-power stop mode and reduced-power wait mode; Stop3 current = 3.8 µA @ 5 V (–40 to 125 °C) |
| Package | 32-pin LQFP (LC suffix), θJA = 86 °C/W on single-layer board |
Pinout & Package
32-pin LQFP (LC package), 7 × 7 mm body, 0.8 mm pitch, exposed pad optional. Pin functions mapped per S9S08RN60 Series Data Sheet Rev. 1 (2014), Section 8.2 - device-specific assignment for S9S08RN32W1MLC confirmed via pin count, temperature grade (M), and package code (LC).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual-supply pins: VDD powers digital/analog logic; VSS is common return; VDDA must be within ±0.3 V of VDD |
| PTA0–PTA7 | General-purpose I/O | 8-bit port A with keyboard interrupt (KBI) capability; PTA2/PTA3 are true open-drain outputs supporting 6 V tolerance |
| PTB0–PTB7 | General-purpose I/O | 8-bit port B; PTB4/PTB5 support ultra-high current sink (20 mA); all pins support programmable pullups (30–50 kΩ) |
| RESET | Active-low reset input | Asynchronous reset with minimum pulse width 1.5 × tSelf_reset; internal pullup enabled by default |
| EXTAL / XTAL | External oscillator inputs | Crystal/resonator connection points for XOSC; support 32 kHz–20 MHz; require external load capacitors (C1/C2) |
| BKGD | Background debug pin | Single-wire BDM interface; used for programming, breakpoint setting, and in-circuit emulation |
Key Features
| Feature | Design Value |
|---|---|
| Flash endurance & security | Full read/program/erase over –40 °C to 125 °C and 2.7–5.5 V; flash access protection prevents unauthorized read/write |
| EEPROM reliability | 256-byte EEPROM with ECC and 2-byte erase sectors; supports concurrent program/erase while executing from flash |
| Low-power operation | Stop3 mode draws only 3.8 µA @ 5 V; ADC, TSI, and LVD adders increase current by ≤130 µA total - enabling battery-backed sensing |
| Robust analog subsystem | 12-bit ADC with internal bandgap reference, watermark buffers, and automatic compare; ACMP with independent rising/falling edge interrupts and filtering |
| Automotive-ready protection | Independent watchdog clock source, multi-threshold LVD (e.g., VLVDL = 2.61 V), illegal opcode/address detection with reset |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
Use Scenario: Real-time monitoring of throttle position, coolant temperature, and oxygen sensors in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Central controller executing closed-loop fuel injection and spark timing algorithms with deterministic 20 MHz bus timing. Use Value: 12-bit ADC with 2.5 µs conversion and stop-mode operation enables precise sensor sampling without CPU wake-up latency. |
Use Scenario: Managing door locks, lighting sequences, window lift, and interior ambient light sensing in passenger vehicles. IC Role / Device Role / Timing Role: Low-voltage tolerant MCU interfacing with LIN transceivers, relays, and capacitive touch buttons via TSI. Use Value: True open-drain pins (PTA2/PTA3) tolerate 6 V for direct LIN bus connection; TSI wakes MCU from Stop3 on electrode touch. |
| Transmission Control Unit (TCU) | Heating/Ventilation Control |
Use Scenario: Gear selection logic, solenoid driver coordination, and CAN message handling in automatic transmissions. IC Role / Device Role / Timing Role: Peripheral-rich controller running FTM PWM for solenoid drive and SCI for diagnostic communication. Use Value: Three FTM modules (including 6-channel unit) support simultaneous PWM generation for multiple shift solenoids with center-aligned timing. |
Use Scenario: HVAC blower motor speed regulation, temperature setpoint management, and air flap actuation in climate control systems. IC Role / Device Role / Timing Role: Mixed-signal processor acquiring thermistor readings, driving fan PWM, and communicating via I²C to display ICs. Use Value: Internal bandgap reference ensures stable ADC measurements across –40 °C to 125 °C; I²C supports multi-master operation for distributed sensor networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08RN32CPJ | Same S08 core, 32 KB flash, but 44-pin QFP package; lacks TSI module and has no ultra-high-current GPIOs | Not suitable for space-constrained PCBs requiring 32-pin LQFP; cannot replace touch-sensing functions | Select only if footprint compatibility and TSI are not required; verify thermal resistance (θJA = 62 °C/W) suits target layout |
| S9S08RN48W1MLC | Same 32-pin LQFP package and M temperature grade, but 48 KB flash, 4 KB RAM, and identical peripherals | Direct drop-in for designs needing more code space or RAM without layout change | Choose when firmware size exceeds 32 KB or additional RAM buffers are needed; same pinout and debug interface |
Compared with MC9S08RN32CPJ, S9S08RN32W1MLC offers TSI and ultra-high-current GPIOs in a smaller package; compared with S9S08RN48W1MLC, it trades flash/RAM capacity for cost-sensitive implementations where 32 KB suffices.
Availability
S9S08RN32W1MLC is available at Aetrix Electronics and suitable for engine control units, body control modules, and transmission control applications requiring stable component supply across automotive production lifecycles.
Supply support for S9S08RN32W1MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale in 2015 and maintains full support for the S08 portfolio, delivering automotive-qualified microcontrollers with ASIL-B readiness and long-term industrial supply commitment.
The S9S08RN32W1MLC belongs to the S08RN family designed specifically for cost-sensitive, high-reliability automotive body and powertrain applications demanding extended temperature operation and robust EMC performance.
FAQ
What is the maximum bus frequency supported by the S9S08RN32W1MLC?
The S9S08RN32W1MLC supports a maximum bus frequency of 20 MHz across its full operating voltage range (2.7 V to 5.5 V) and temperature range (–40 °C to 125 °C). This frequency is achievable using the internal FLL with trimmed internal reference or external crystal input, and is explicitly guaranteed in the S9S08RN60 Series Data Sheet Rev. 1 (2014), Table 5.
Does the S9S08RN32W1MLC support in-application programming (IAP) of flash memory?
Yes, the S9S08RN32W1MLC supports full flash read/program/erase operations over its entire operating voltage and temperature range, including while executing code from flash. The datasheet confirms "flash read/program/erase over full operating voltage and temperature" and specifies that EEPROM program/erase can occur concurrently with flash execution - a capability directly inherited by the S9S08RN32W1MLC as a member of the RN32 variant group.
What are the key differences between the S9S08RN32W1MLC and S9S08RN48W1MLC?
The S9S08RN32W1MLC and S9S08RN48W1MLC share identical 32-pin LQFP packaging, –40 °C to 125 °C temperature grade (M), and core peripheral set (FTM, SCI, I²C, ADC, TSI), but differ in non-volatile memory: S9S08RN32W1MLC has 32 KB flash and 4 KB RAM, while S9S08RN48W1MLC provides 48 KB flash and 4 KB RAM. All other electrical and timing specifications match per the shared RN60-series datasheet.
Can the S9S08RN32W1MLC operate in stop mode with the ADC active?
Yes, the S9S08RN32W1MLC supports ADC operation in Stop3 mode. According to the S9S08RN60 Series Data Sheet Rev. 1 (2014), Table 4, the ADC adder increases Stop3 current by only 44 µA at 5 V - confirming functional conversion during low-power states. This enables periodic sensor sampling without full MCU wake-up, preserving energy in battery-powered automotive subsystems.
What debug interface does the S9S08RN32W1MLC use, and what capabilities does it provide?
The S9S08RN32W1MLC uses a single-wire background debug (BDM) interface via the BKGD pin. It supports three hardware breakpoints, in-circuit emulation with two comparators and nine trigger modes, and full flash programming - all documented in the S9S08RN60 Series Data Sheet Rev. 1 (2014), Section "Development support". This interface is electrically and functionally identical across the RN32/RN48/RN60 variants.
S9S08RN32W1MLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08RN32W1MLC FAQ
1.How can I place an order for S9S08RN32W1MLC through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08RN32W1MLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08RN32W1MLC reliable?
The price and inventory of S9S08RN32W1MLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08RN32W1MLC is usually 5 days.
3.What payment methods are accepted for S9S08RN32W1MLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08RN32W1MLC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08RN32W1MLC?
S9S08RN32W1MLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08RN32W1MLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08RN32W1MLC?
For technical support, including S9S08RN32W1MLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08RN32W1MLC requirements.
6.How does Aetrix verify that S9S08RN32W1MLC is sourced from the original manufacturer or authorized distributors?
All S9S08RN32W1MLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08RN32W1MLC meets industry standards.
7.What is the process for return or replacement of S9S08RN32W1MLC?
All S9S08RN32W1MLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08RN32W1MLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08RN32W1MLC part is unused and in its original packaging.
Return procedure for S9S08RN32W1MLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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