NXP Semiconductors S9S08RN32W1MLCR
- Part No.:
- S9S08RN32W1MLCR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S08RN32W1MLCR.pdf
- Description:
- IC MCU 8BIT 32KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08RN32W1MLCR from NXP Semiconductors (formerly Freescale) is an 8-bit S08 CPU-based microcontroller designed for automotive and industrial embedded control. It delivers up to 20 MHz bus operation across –40 °C to 125 °C, integrates 32 KB flash, 256-byte EEPROM with ECC, 4 KB RAM, and supports up to 55 GPIOs - deployed in engine control units, body electronics, and motor drive interfaces.
For engineers reviewing the S9S08RN32W1MLCR datasheet, S9S08RN32W1MLCR pinout, S9S08RN32W1MLCR application, or S9S08RN32W1MLCR equivalent, key selection criteria include its -40 °C to 125 °C operating range, on-chip ADC with stop-mode operation, FTM PWM capability, I²C/SCI/SPI peripheral set, and single-wire BDM debug interface for in-circuit development.
Technical Context
The S9S08RN32W1MLCR implements a Harvard-architecture S08 core with four-level nested interrupt support and up to 40 interrupt/reset sources. Its clock system combines an external crystal oscillator (XOSC) and an internal clock source (ICS) with frequency-locked-loop (FLL), enabling precise 1–20 MHz bus frequencies with ±2% DCO deviation over –40 °C to 125 °C.
System protection includes independent watchdog timer, low-voltage detection with configurable trip points (e.g., VLVDH = 4.2–4.4 V), illegal opcode/address reset, and flash/RAM access protection. Peripheral integration covers three FTM modules (1×6-channel, 2×2-channel), 16-channel 12-bit ADC with hardware trigger and stop-mode operation, TSI touch sensing, and three SCI UARTs with LIN extension support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | 8-bit S08 CPU with four-level nested interrupts and 40 interrupt/reset sources |
| Flash / EEPROM / RAM | 32 KB flash (read/program/erase over full voltage/temp), 256-byte EEPROM with ECC and 2-byte erase sector, 4 KB RAM |
| Operating Range | 2.7–5.5 V supply; –40 °C to 125 °C ambient temperature |
| Bus Frequency | Up to 20 MHz at 5 V; supported across full temperature range |
| ADC | 16-channel, 12-bit resolution, 2.5 µs conversion time, internal bandgap reference, operates in stop3 mode |
| Peripherals | 3× SCI (UART/LIN), 2× SPI (8-/16-bit), 1× I²C (400 kbps), 3× FTM (PWM/input capture), TSI (16-electrode), RTC, CRC |
| Debug Interface | Single-wire background debug (BDM) with three breakpoints and on-chip ICE module (2 comparators, 9 trigger modes) |
Pinout & Package
32-pin LQFP package (package code LC), 7 × 7 mm body, 0.8 mm pitch, exposed pad optional. Pin assignments conform to S9S08RN32-specific signal multiplexing defined in Rev. 1 (01/2014) datasheet Section 8.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: VDD (digital/analog core), VSS (common return); VDDA referenced to VDD ±0.3 V |
| PTA0–PTA7 | GPIO / peripheral multiplex | 8-bit port A with KBI, open-drain options (PTA2/PTA3), ultra-high-current sink (20 mA) on PTB4/PTB5 |
| PTB0–PTB7 | GPIO / peripheral multiplex | 8-bit port B supporting FTM, SCI, SPI, ADC channel inputs, and TSI electrode connections |
| RESET | Active-low reset input | Asynchronous reset with 1.5×tSelf_reset minimum pulse width; supports POR and LVD-initiated reset |
| EXTAL / XTAL | External oscillator inputs | Differential crystal/resonator interface for XOSC; supports 32 kHz–20 MHz range with programmable gain and load capacitance |
| BKGD | Background debug pin | Single-wire BDM interface for programming, breakpoint setting, and real-time trace via on-chip ICE |
Key Features
| Feature | Design Value |
|---|---|
| Flash endurance & security | 100,000 program/erase cycles; flash protection registers prevent unauthorized read/write/erase access |
| Low-power operation | Stop3 mode draws 3.8 µA (5 V) with 1 kHz LPO active; ADC/TSI/LVD adders increase current by ≤130 µA total |
| Robust clock system | ICS with FLL achieves ±2% DCO accuracy over –40 °C to 125 °C; crystal start-up as fast as 1.5 ms (high-range, high-gain) |
| Analog subsystem | 12-bit ADC includes data buffers with watermark, automatic compare, and internal bandgap reference; ACMP supports dual-input filtering and edge-triggered interrupts |
| Touch sensing | TSI module supports up to 16 electrodes, software/hardware scan trigger, and wake-from-stop3 capability using Freescale TSS library |
Applications
| Engine Control Unit (ECU) | Automotive Body Control Module (BCM) |
|---|---|
Use Scenario: Real-time monitoring of throttle position, coolant temperature, and crankshaft timing in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Central controller executing closed-loop fuel injection and spark timing algorithms with deterministic 20 MHz bus timing. Use Value: 32 KB flash stores calibrated maps; 12-bit ADC resolves sensor signals with <1 LSB INL; stop3 mode enables low-quiescent current during ignition-off states. | Use Scenario: Managing door locks, window lifts, mirror controls, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: I/O hub interfacing with switches, relays, LIN transceivers, and CAN gateways via SCI and GPIO. Use Value: 55 GPIOs support direct drive of solenoids and LEDs; TSI enables capacitive touch buttons; LIN-compliant SCI reduces wiring harness complexity. |
| Industrial Motor Drive Interface | Smart Sensor Node |
Use Scenario: Closed-loop speed/torque control of BLDC motors in HVAC blowers or pump systems. IC Role / Device Role / Timing Role: PWM generator and current-sense signal processor using FTM modules and ADC with hardware trigger synchronization. Use Value: Three FTM modules provide six independent PWM outputs with edge- or center-aligned modes; ADC operates in stop3 mode for synchronized sampling during motor commutation pauses. | Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and motion data for predictive maintenance. IC Role / Device Role / Timing Role: Ultra-low-power sensor aggregator with wake-on-event (TSI, KBI, ADC threshold) and secure firmware updates via BDM. Use Value: Stop3 current of 3.8 µA extends battery life; EEPROM with ECC ensures reliable logging; single-wire BDM enables field firmware patching without JTAG header space. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08RN32CPJ | Same S08RN32 core, 32-pin LQFP, but rated for –40 °C to 105 °C (vs. 125 °C); no TSI module; different oscillator calibration trim | Limited to under-hood applications with lower thermal stress; lacks touch sensing capability | Select when TSI and extended temperature are unnecessary and cost sensitivity outweighs qualification scope |
| S9KEAZ32AMLH | Kinetis E-series ARM Cortex-M0+ core; 64-pin LQFP; 32 KB flash; 4 KB SRAM; 12-bit ADC; no TSI; higher performance (40 MHz), larger footprint | Targets next-generation designs requiring RTOS support, USB, or higher computational throughput | Choose for migration paths needing scalable architecture, not drop-in replacement |
Compared with MC9S08RN32CPJ and S9KEAZ32AMLH, the S9S08RN32W1MLCR uniquely combines extended temperature operation (–40 °C to 125 °C), integrated TSI, and stop3-mode ADC functionality in a compact 32-pin LQFP - making it optimal for thermally demanding automotive body and powertrain interfaces where touch UI and ultra-low standby current are critical.
Availability
S9S08RN32W1MLCR is available at Aetrix Electronics and suitable for automotive engine control, industrial motor drives, and smart sensor nodes requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S9S08RN32W1MLCR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontroller innovation from its Freescale acquisition.
The S9S08RN32W1MLCR belongs to the S08RN family - engineered specifically for cost-sensitive, thermally robust automotive body electronics and powertrain sub-systems requiring high reliability, integrated analog peripherals, and long-term supply assurance.
FAQ
What is the maximum bus frequency supported by the S9S08RN32W1MLCR across its full operating temperature range?
The S9S08RN32W1MLCR supports up to 20 MHz bus frequency across its full –40 °C to 125 °C operating temperature range and 2.7–5.5 V supply voltage. This is guaranteed per the S9S08RN60 Series Data Sheet Rev. 1 (01/2014), which explicitly covers the S9S08RN32 variant. The ICS with FLL ensures stable operation at this rate even under worst-case voltage and thermal conditions, with ±2% DCO output deviation specified over the full range.
Does the S9S08RN32W1MLCR include EEPROM with error correction, and what is its erase granularity?
Yes, the S9S08RN32W1MLCR includes 256 bytes of on-chip EEPROM with built-in error-correcting code (ECC) for enhanced data integrity. Its erase granularity is 2-byte sectors - enabling fine-grained nonvolatile parameter storage without bulk erasure. This feature is confirmed in the "On-chip memory" section of the S9S08RN60 Series Data Sheet, which applies to all members of the RN32/RN48/RN60 family including the S9S08RN32W1MLCR.
Can the S9S08RN32W1MLCR's ADC operate while the device is in stop3 low-power mode?
Yes, the S9S08RN32W1MLCR's 16-channel, 12-bit ADC can operate in stop3 mode - a key low-power feature documented in the S9S08RN60 Series Data Sheet. When configured with ADLPC = 1, ADLSMP = 1, ADCO = 1, MODE = 10B, and ADICLK = 11B, the ADC draws only 44 µA (at 5 V) above baseline stop3 current, enabling periodic sensor sampling without waking the CPU core.
What debug interface does the S9S08RN32W1MLCR support, and how many hardware breakpoints are available?
The S9S08RN32W1MLCR supports a single-wire background debug (BDM) interface compliant with Freescale's BDM protocol. It provides three configurable hardware breakpoints during in-circuit debugging, implemented via the on-chip in-circuit emulator (ICE) module containing two comparators and nine trigger modes - all detailed in the "Development support" section of the official datasheet.
Is the S9S08RN32W1MLCR qualified for automotive applications, and what is its temperature rating?
Yes, the S9S08RN32W1MLCR is automotive-qualified with an operating temperature range of –40 °C to 125 °C, indicated by the 'M' suffix in its part number per the S9S08RN60 Series Data Sheet Section 2.3. It meets AEC-Q100 stress test requirements for automotive use and is commonly deployed in engine control units, body control modules, and transmission control interfaces where extended thermal resilience is mandatory.
S9S08RN32W1MLCR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08RN32W1MLCR FAQ
1.How can I place an order for S9S08RN32W1MLCR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08RN32W1MLCR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08RN32W1MLCR reliable?
The price and inventory of S9S08RN32W1MLCR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08RN32W1MLCR is usually 5 days.
3.What payment methods are accepted for S9S08RN32W1MLCR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08RN32W1MLCR transactions.
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4.How is shipping managed for S9S08RN32W1MLCR?
S9S08RN32W1MLCR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08RN32W1MLCR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08RN32W1MLCR?
For technical support, including S9S08RN32W1MLCR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08RN32W1MLCR requirements.
6.How does Aetrix verify that S9S08RN32W1MLCR is sourced from the original manufacturer or authorized distributors?
All S9S08RN32W1MLCR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08RN32W1MLCR meets industry standards.
7.What is the process for return or replacement of S9S08RN32W1MLCR?
All S9S08RN32W1MLCR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08RN32W1MLCR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08RN32W1MLCR part is unused and in its original packaging.
Return procedure for S9S08RN32W1MLCR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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