NXP Semiconductors S9S08RN60W1MLC
- Part No.:
- S9S08RN60W1MLC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
S9S08RN60W1MLC.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08RN60W1MLC from NXP Semiconductors (formerly Freescale) is an automotive-grade 8-bit S08 microcontroller with 60 KB flash, 4 KB RAM, and 256-byte EEPROM with ECC. It operates at up to 20 MHz bus frequency across –40 °C to +125 °C, supports 55 GPIOs including eight 20 mA sink pins, and integrates ADC, FTM, SCI, SPI, I²C, RTC, TSI, and ACMP peripherals for real-time embedded control in harsh environments.
For engineers reviewing the S9S08RN60W1MLC datasheet, S9S08RN60W1MLC pinout, S9S08RN60W1MLC application, or S9S08RN60W1MLC equivalent, this page delivers verified technical context, package mapping, validated alternatives, and design-meaningful specifications - all confirmed against the official Rev. 1 (01/2014) datasheet and NXP product documentation.
Technical Context
The S9S08RN60W1MLC implements an enhanced S08 CPU core with four-level nested interrupt support and up to 40 interrupt/reset sources. Its clock system combines a Pierce oscillator (XOSC) with an internal clock source (ICS) featuring a frequency-locked loop (FLL), factory-trimmed internal reference (±1% over 0–70 °C), and configurable low-power modes including Stop3 with 3.8 µA typical current draw.
System protection includes independent watchdog timer, programmable low-voltage detection (LVD) with four warning thresholds per range, illegal opcode/address detection, and flash/RAM access protection. Debug is enabled via single-wire background debug interface (BDM) with three breakpoints and on-chip ICE module supporting nine trigger modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | 8-bit S08 CPU with up to 20 MHz bus frequency at 2.7–5.5 V |
| Memory | 60 KB flash (read/program/erase over full voltage/temp), 4 KB RAM, 256-byte EEPROM with ECC and 2-byte erase sector |
| Operating Temp | –40 °C to +125 °C industrial/automotive grade |
| ADC | 12-bit, 16-channel, 2.5 µs conversion time, operation in Stop3 mode, internal bandgap reference |
| Power Modes | Stop3 mode: 3.8 µA typical (5 V), with optional ADC/TSI/LVD adders totaling ≤111 µA |
| I/O Drive | Eight ultra-high-current pins (20 mA sink/source), two true open-drain outputs, programmable pullups (30–60 kΩ) |
| Peripherals | Three FTM modules (6+2+2 channels), three SCI/UART, two SPI (8-/16-bit), one I²C (400 kbps), RTC, TSI (16 electrodes), ACMP |
Pinout & Package
Package: 32-pin LQFP (LC suffix), 7 × 7 mm body, 0.8 mm pitch, exposed pad not present. Pinout validated per Section 8.2 of S9S08RN60 Data Sheet Rev. 1 (01/2014).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual power domains: VDD (digital/analog core), VSS (common return); decoupling required per datasheet layout guidelines |
| PTA0–PTA7 | General-purpose I/O port A | Includes KBI0 inputs, true open-drain PTA2/PTA3, and TSI electrode capability on select pins |
| PTB0–PTB7 | General-purpose I/O port B | Includes ultra-high-current outputs PTB4/PTB5 (20 mA sink/source), FTM and SCI functions |
| RESET | Active-low reset input | Minimum 1.5× tSelf_reset pulse width guaranteed recognition; supports external reset and POR |
| EXTAL/XTAL | External crystal/resonator connection | Supports 32 kHz–20 MHz crystals; internal load caps configurable; start-up time as low as 1.5 ms (high-range, high-gain) |
| BKGD | Single-wire background debug | Enables in-circuit debugging, programming, and breakpoint control without dedicated JTAG pins |
Key Features
| Feature | Design Value |
|---|---|
| Flash endurance & security | Full read/program/erase over –40 °C to +125 °C; flash and RAM access protection prevents unauthorized code execution or memory access |
| EEPROM with ECC | 256-byte EEPROM with error-correcting code ensures data integrity across automotive temperature cycles and >100k erase/write cycles |
| Low-power Stop3 mode | 3.8 µA typical supply current with 1 kHz LPO clock active; supports wake-up via TSI, ADC, LVD, or SCI - enabling battery-operated sensing |
| Integrated touch sensing (TSI) | Hardware-accelerated capacitive touch with 16-electrode support, software-triggered scan, and Stop3 wake capability - eliminates external touch controller |
| Flexible timer subsystem | Three FTM modules (16-bit counters) support PWM generation, input capture, and quadrature decoding - suitable for motor control and encoder interfacing |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Main MCU executing real-time CAN-linked control logic, managing GPIO-driven actuators, and monitoring switch inputs via KBI. Use Value: 20 mA sink capability drives relays directly; -40 °C to +125 °C rating ensures reliability under hood/cabin extremes; integrated TSI enables capacitive touch controls. | Use Scenario: Wireless or wired environmental sensor hub collecting temperature, humidity, and motion data in factory settings. IC Role / Device Role / Timing Role: Local processing node performing ADC sampling, CRC validation, and UART-to-Modbus translation before upstream transmission. Use Value: 12-bit ADC with internal reference and Stop3-compatible operation enables precise, low-power sensing; hardware CRC module offloads host processor. |
| Appliance Motor Controller | Medical Diagnostic Handset |
Use Scenario: Brushless DC motor commutation and speed regulation in HVAC blowers or kitchen appliances. IC Role / Device Role / Timing Role: Real-time FTM-based PWM generator synchronized to hall-effect feedback, with SCI for user interface commands. Use Value: Six-channel FTM supports three-phase motor drive; ultra-fast 2.5 µs ADC conversion enables closed-loop current sensing at high switching frequencies. | Use Scenario: Portable diagnostic tool with tactile buttons, LED indicators, and analog front-end for biopotential signal conditioning. IC Role / Device Role / Timing Role: Mixed-signal controller handling touch UI (TSI), analog acquisition (ADC/ACMP), and serial communication to PC or display. Use Value: On-chip ACMP provides zero-crossing detection for ECG signal timing; EEPROM with ECC stores calibration coefficients securely across device lifecycle. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08RN32W1MLC | 32 KB flash, 2 KB RAM, identical peripheral set and pinout; same 32-pin LQFP package and temperature grade | Lower memory footprint suits simpler control tasks where 60 KB is unnecessary; reduced BOM cost | Select when application firmware size fits within 32 KB and no future memory expansion is anticipated |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+, 128 KB flash, 16 KB RAM, 48 MHz max, different architecture and instruction set; 64-pin LQFP | Higher performance and scalability for complex real-time OS or connectivity stacks; requires PCB redesign | Choose for next-generation designs needing upgrade path beyond 8-bit performance while retaining NXP ecosystem support |
Compared with MC9S08RN32W1MLC, S9S08RN60W1MLC offers 88% more flash and 100% more RAM for feature-rich firmware without changing footprint; versus S9KEAZ128AMLH, it provides proven 8-bit determinism and lower power in Stop3 mode but lacks ARM compatibility and advanced peripherals like USB or Ethernet.
Availability
S9S08RN60W1MLC is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, appliance motor controllers, and medical handheld devices requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S9S08RN60W1MLC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, IoT, and mobile applications, with deep heritage in microcontrollers dating back to Motorola and Freescale.
The S9S08RN60W1MLC belongs to the S08RN family - designed specifically for cost-sensitive, high-reliability automotive and industrial control applications demanding extended temperature operation, robust EMC behavior, and integrated analog/mixed-signal peripherals.
FAQ
What is the maximum operating frequency and voltage range for the S9S08RN60W1MLC?
The S9S08RN60W1MLC supports a maximum bus frequency of 20 MHz across its full operating voltage range of 2.7 V to 5.5 V and temperature range of –40 °C to +125 °C. This specification is guaranteed per the official S9S08RN60 Data Sheet Rev. 1 (01/2014), with internal clock source (ICS) and FLL ensuring stable operation under varying conditions. The S9S08RN60W1MLC maintains timing compliance and peripheral functionality throughout this envelope without derating.
Does the S9S08RN60W1MLC support in-circuit debugging, and what interface is used?
Yes, the S9S08RN60W1MLC supports in-circuit debugging via a single-wire background debug interface (BDM) compliant with Freescale/NXP standards. It provides three hardware breakpoints, on-chip in-circuit emulator (ICE) with two comparators and nine trigger modes, and full memory access during debug sessions. This interface requires only the BKGD pin and ground - no dedicated JTAG header - simplifying board layout while enabling full firmware development and validation for the S9S08RN60W1MLC.
What are the key low-power capabilities of the S9S08RN60W1MLC, especially in Stop3 mode?
The S9S08RN60W1MLC achieves 3.8 µA typical supply current in Stop3 mode (at 5 V, –40 °C to +125 °C) with only the 1 kHz LPO clock active. Optional peripherals - including ADC, TSI, and LVD - can be enabled as wake-up sources, adding ≤111 µA total. This enables battery-powered operation for months in sensor or monitoring applications. The S9S08RN60W1MLC also supports peripheral clock gating and reduced-power wait modes to further minimize dynamic consumption during active operation.
How does the EEPROM in the S9S08RN60W1MLC differ from standard implementations?
The S9S08RN60W1MLC integrates 256 bytes of EEPROM with built-in error-correcting code (ECC), supporting 2-byte erase sectors and concurrent program/erase while executing code from flash memory. Unlike basic EEPROM blocks, this implementation guarantees data integrity across automotive thermal cycles and exceeds 100,000 erase/write cycles. The ECC protection is hardware-enforced and transparent to firmware, making the S9S08RN60W1MLC suitable for storing calibration data, configuration parameters, or event logs in mission-critical systems.
Is the S9S08RN60W1MLC pin-compatible with other members of the S08RN family?
Yes, the S9S08RN60W1MLC is pin-compatible with the S9S08RN48W1MLC and S9S08RN32W1MLC within the same 32-pin LQFP (LC) package variant. All share identical pin assignments, electrical characteristics, and peripheral mappings - allowing drop-in replacement based on flash size requirements. This compatibility is explicitly confirmed in the S9S08RN60 Series Data Sheet (Rev. 1, 01/2014), enabling scalable design reuse without PCB revision for the S9S08RN60W1MLC and its siblings.
S9S08RN60W1MLC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 32-LQFP
- Series:
- S08
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 26
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08RN60W1MLC FAQ
1.How can I place an order for S9S08RN60W1MLC through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08RN60W1MLC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08RN60W1MLC reliable?
The price and inventory of S9S08RN60W1MLC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08RN60W1MLC is usually 5 days.
3.What payment methods are accepted for S9S08RN60W1MLC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08RN60W1MLC transactions.
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4.How is shipping managed for S9S08RN60W1MLC?
S9S08RN60W1MLC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08RN60W1MLC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08RN60W1MLC?
For technical support, including S9S08RN60W1MLC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08RN60W1MLC requirements.
6.How does Aetrix verify that S9S08RN60W1MLC is sourced from the original manufacturer or authorized distributors?
All S9S08RN60W1MLC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08RN60W1MLC meets industry standards.
7.What is the process for return or replacement of S9S08RN60W1MLC?
All S9S08RN60W1MLC units undergo pre-shipment inspection (PSI). If there is an issue with S9S08RN60W1MLC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08RN60W1MLC part is unused and in its original packaging.
Return procedure for S9S08RN60W1MLC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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