NXP Semiconductors S9S08RN60W1MLHR
- Part No.:
- S9S08RN60W1MLHR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
S9S08RN60W1MLHR.pdf
- Description:
- IC MCU 8BIT 60KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,295
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S9S08RN60W1MLHR from NXP Semiconductors (formerly Freescale) is an automotive-grade 8-bit S08 microcontroller with 60 KB on-chip flash, 4 KB RAM, and 256-byte EEPROM with ECC. It operates at up to 20 MHz bus frequency across –40 °C to +125 °C, supports 55 GPIOs including eight 20 mA sink pins, and integrates ADC, FTM, SCI, SPI, I²C, RTC, TSI, and ACMP peripherals. It targets engine control units, body electronics, and industrial sensor nodes requiring robust real-time control under harsh thermal conditions.
For engineers reviewing the S9S08RN60W1MLHR datasheet, S9S08RN60W1MLHR pinout, S9S08RN60W1MLHR application, or S9S08RN60W1MLHR equivalent, this page delivers verified technical context, validated package mapping (64-pin LQFP), confirmed peripheral timing specs, and two rigorously cross-referenced alternative MCUs - all extracted from the official Rev. 1 (01/2014) datasheet and NXP product documentation.
Technical Context
The S9S08RN60W1MLHR implements an enhanced S08 CPU core with four-level nested interrupt support and up to 40 interrupt/reset sources. Its clock system combines a loop-controlled Pierce oscillator (XOSC) and an internal clock source (ICS) with frequency-locked-loop (FLL), enabling precise 1–2% frequency stability across –40 °C to 125 °C via factory-trimmed internal reference.
System protection includes independent watchdog timer, configurable low-voltage detection (LVD) with four warning thresholds per range, illegal opcode/address reset, and flash/RAM access protection. Debug infrastructure features single-wire background debug interface (BDM), three hardware breakpoints, and on-chip ICE with two comparators and nine trigger modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | 8-bit S08 CPU with up to 20 MHz bus frequency at 2.7–5.5 V |
| Memory | 60 KB flash (read/program/erase over full voltage/temperature), 256 B EEPROM with ECC, 4 KB RAM |
| Operating Temp | –40 °C to +125 °C ambient, qualified for automotive AEC-Q100 Grade 1 |
| I/O Capability | 55 GPIOs including eight ultra-high-current pins (20 mA sink/source), two true open-drain outputs |
| Analog Peripherals | 16-channel 12-bit ADC (2.5 µs conversion), one analog comparator with filtering and dual-edge interrupt |
| Communication | Three SCI/UART (LIN-capable), one I²C (400 kbps), two SPI (8-bit + 16-bit), three FTM modules (6+2+2 channels) |
| Power Modes | Run, Wait, and Stop3 modes; Stop3 current = 3.8 µA @ 5 V (–40 to 125 °C), with optional ADC/TSI/LVD wake-up adders |
Pinout & Package
Package: 64-pin LQFP (LH suffix), RoHS-compliant, moisture sensitivity level MSL3, thermal resistance θJA = 71 °C/W (single-layer board).
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual 5.5 V tolerant supply rails; VDDA analog supply referenced to VDD ±0.3 V |
| PTA0–PTA7 | General-purpose I/O / KBI0 / TSI | Port A supports keyboard interrupt (KBI) and touch sensing input (TSI); PTA2/PTA3 are true open-drain |
| PTB0–PTB7 | General-purpose I/O / FTM / SCI / SPI | Includes FTM channel outputs, SCI TX/RX, SPI MOSI/MISO; PTB4/PTB5 support 20 mA sink/source |
| PTC0–PTC7 | General-purpose I/O / ADC / ACMP / I²C | ADC input channels, analog comparator inputs, I²C SDA/SCL; supports internal bandgap reference |
| RESET | Active-low reset input | Minimum external reset pulse width = 1.5 × tSelf_reset; supports POR and LVD-initiated reset |
| EXTAL/XTAL | External crystal/resonator connection | Supports 32 kHz–20 MHz crystals; start-up time ≤3 ms (high-range, high-gain mode) |
| BKGD | Single-wire background debug | Enables in-circuit debugging, programming, and breakpoint control via BDM interface |
Key Features
| Feature | Design Value |
|---|---|
| Flash endurance & security | 100,000 program/erase cycles; read/program/erase while executing from flash; flash protection via security byte |
| EEPROM reliability | 256 B with ECC correction; 2-byte erase sector; program/erase during flash execution |
| Low-power operation | Stop3 mode draws only 3.8 µA @ 5 V; ADC/TSI/LVD can wake MCU without exiting Stop3 |
| Robust clocking | ICS with FLL achieves ±2.0% DCO deviation over –40 to 125 °C; internal reference trimmed to ±1.0% at 0–70 °C |
| Touch sensing interface | TSI supports up to 16 electrodes; hardware scan trigger; wakes MCU from Stop3; compatible with NXP Touch Sensing Library |
Applications
| Engine Control Unit (ECU) | Automotive Body Control Module (BCM) |
|---|---|
|
Use Scenario: Real-time monitoring of throttle position, coolant temperature, and crankshaft angle in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Primary control MCU executing closed-loop fuel injection and spark timing algorithms with deterministic interrupt latency. Use Value: 20 MHz bus speed and four-level nested interrupts ensure sub-microsecond response to critical engine events; 125 °C rating enables placement near powertrain components. |
Use Scenario: Centralized management of door locks, lighting, wipers, and HVAC in passenger vehicles. IC Role / Device Role / Timing Role: System coordinator interfacing with LIN slaves (door modules, sensors) and driving high-current loads (headlights, motors). Use Value: Eight 20 mA sink pins directly drive relays and LEDs; LIN-capable SCI eliminates need for external transceivers; EEPROM stores configuration and fault logs. |
| Industrial Motor Drive Controller | Smart Sensor Node |
|
Use Scenario: Closed-loop speed/torque control of BLDC motors in HVAC blowers and pumps. IC Role / Device Role / Timing Role: Real-time PWM generation (via FTM), current sensing (ADC), and fault monitoring (ACMP, LVD). Use Value: Three FTM modules provide six-channel center-aligned PWM for motor phases; ADC watermark buffering enables burst sampling without CPU overhead. |
Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and air quality in building automation systems. IC Role / Device Role / Timing Role: Low-power data acquisition node using TSI for user interface and ADC for analog sensor conditioning. Use Value: Stop3 current of 3.8 µA extends battery life; TSI wake capability allows instant UI response; internal bandgap reference ensures stable ADC accuracy across temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S9S08RN48W1MLHR | 48 KB flash, identical package, pinout, and peripheral set; same 20 MHz/125 °C rating | Reduced code space limits complex control algorithms or large protocol stacks (e.g., full CAN+LIN) | Select when firmware size < 45 KB and cost optimization is prioritized without sacrificing thermal or I/O capability |
| MKE02Z64VLD4 | ARM Cortex-M0+ core, 64 KB flash, 8 KB RAM, 48 MHz max, but only rated to 105 °C and lacks TSI/ACMP | Higher performance but no native touch sensing; requires external components for analog comparator functions | Choose for new designs needing ARM ecosystem compatibility and higher throughput, accepting reduced analog integration and lower temperature grade |
Compared with S9S08RN60W1MLHR, the S9S08RN48W1MLHR offers identical thermal, I/O, and peripheral compatibility at lower memory cost, while the MKE02Z64VLD4 trades analog integration and 125 °C operation for ARM architecture advantages and higher clock speed - making each suitable for distinct design trade-offs in automotive and industrial control.
Availability
S9S08RN60W1MLHR is available at Aetrix Electronics and suitable for automotive engine control, industrial motor drives, and smart sensor nodes requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S9S08RN60W1MLHR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontroller innovation from its Freescale acquisition.
The S9S08RN60W1MLHR belongs to NXP's legacy S08 RN-series, designed specifically for cost-sensitive, thermally demanding automotive body and powertrain control applications where deterministic real-time response and long-term reliability are critical.
FAQ
What is the maximum operating temperature range for the S9S08RN60W1MLHR?
The S9S08RN60W1MLHR is fully qualified for operation from –40 °C to +125 °C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This rating is validated across all electrical specifications including flash endurance, ADC linearity, and I/O drive strength, enabling direct placement in under-hood automotive environments without derating.
Does the S9S08RN60W1MLHR support in-system programming via its debug interface?
Yes, the S9S08RN60W1MLHR supports full in-system programming and debugging through its single-wire background debug (BDM) interface. The on-chip ICE module enables flash programming, real-time register inspection, and three hardware breakpoints - all without requiring external programming hardware beyond a standard BDM pod.
Can the S9S08RN60W1MLHR execute code while erasing or programming its flash memory?
Yes, the S9S08RN60W1MLHR supports concurrent flash program/erase and code execution from other flash blocks. This feature enables safe firmware updates and data logging without halting real-time control tasks, leveraging its banked flash architecture and dedicated command buffer.
What is the minimum supply voltage required for the S9S08RN60W1MLHR to retain RAM contents?
The S9S08RN60W1MLHR guarantees RAM retention down to 2.0 V (VRAM specification), allowing it to maintain critical variables and state information during brown-out conditions or controlled power-down sequences before entering Stop3 mode.
How many independent PWM channels does the S9S08RN60W1MLHR support?
The S9S08RN60W1MLHR integrates three FlexTimer Modules (FTM): one 6-channel and two 2-channel units, delivering up to ten independent PWM outputs. Each channel supports edge- or center-aligned modes, input capture, and output compare - sufficient for multi-phase motor control or LED dimming arrays.
S9S08RN60W1MLHR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 64-LQFP
- Series:
- S08
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 55
- Program Memory Size:
- 60KB (60K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08RN60W1MLHR FAQ
1.How can I place an order for S9S08RN60W1MLHR through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08RN60W1MLHR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08RN60W1MLHR reliable?
The price and inventory of S9S08RN60W1MLHR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08RN60W1MLHR is usually 5 days.
3.What payment methods are accepted for S9S08RN60W1MLHR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08RN60W1MLHR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08RN60W1MLHR?
S9S08RN60W1MLHR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08RN60W1MLHR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08RN60W1MLHR?
For technical support, including S9S08RN60W1MLHR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08RN60W1MLHR requirements.
6.How does Aetrix verify that S9S08RN60W1MLHR is sourced from the original manufacturer or authorized distributors?
All S9S08RN60W1MLHR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08RN60W1MLHR meets industry standards.
7.What is the process for return or replacement of S9S08RN60W1MLHR?
All S9S08RN60W1MLHR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08RN60W1MLHR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08RN60W1MLHR part is unused and in its original packaging.
Return procedure for S9S08RN60W1MLHR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S9S08RN60W1MLHR Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

