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NXP Semiconductors S9S08RN8W2MTG
- Part No.:
- S9S08RN8W2MTG
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08RN8W2MTG.pdf
- Description:
- IC MCU 8BIT 8KB FLASH 16TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,558
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Product details
Overview
S9S08RN8W2MTG from NXP Semiconductors (formerly Freescale) is an 8-bit S08 MCU with 8 KB flash, 256-byte EEPROM with ECC, and 2 KB RAM, operating at up to 20 MHz bus frequency across –40 °C to +125 °C. It integrates ADC (8-channel, 10-bit), two SCI/UARTs, SPI, I²C, FTM timers, TSI touch sensing, and low-power stop3 mode. Used in automotive body control modules requiring robust timing, fault detection, and mixed-signal interfacing.
For engineers reviewing the S9S08RN8W2MTG datasheet, S9S08RN8W2MTG pinout, S9S08RN8W2MTG application, or S9S08RN8W2MTG equivalent, this page delivers verified technical context, package mapping to 16-pin TSSOP, validated peripheral timing, real-world power consumption data in Stop3 mode (4.5 µA @ 3 V), and confirmed alternatives for automotive-grade 8-bit MCU replacement.
Technical Context
The S9S08RN8W2MTG implements an S08 CPU core with four-level nested interrupt support and up to 40 interrupt/reset sources. Its clock system combines a Pierce oscillator (XOSC) for crystal/resonator use and an internal clock source (ICS) with FLL, delivering ±2% DCO frequency deviation over –40 °C to +125 °C.
System protection includes independent watchdog timer, programmable low-voltage detect (LVD) with four warning thresholds per range, illegal opcode/address detection, and flash/RAM access protection. Debug is enabled via single-wire BDM interface with three breakpoints and on-chip ICE module featuring two comparators and nine trigger modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | 8-bit S08 CPU, up to 20 MHz bus frequency at 2.7–5.5 V |
| Memory | 8 KB flash (read/program/erase over full voltage/temp), 256-byte EEPROM with ECC, 2 KB RAM |
| ADC | 8-channel, 10-bit resolution, 2.5 µs conversion time, supports stop mode operation |
| Low-Power Mode | Stop3 mode draws 4.5 µA @ 3 V (–40 °C to +125 °C), with optional 1 kHz LPO clock active |
| Operating Temp | –40 °C to +125 °C ambient, junction rated to +135 °C |
| Package | 16-pin TSSOP (TG suffix), θJA = 130 °C/W on single-layer board |
| ESD Rating | HBM ±6 kV, CDM ±500 V, latch-up tested to ±100 mA at 125 °C |
Pinout & Package
16-pin TSSOP (TG) package with 14 GPIOs, including two true open-drain outputs (PTA2, PTA3), one output-only pin, and four ultra-high-current sink pins (20 mA capability). Pin functions are multiplexed across peripherals including SCI, SPI, I²C, FTM, TSI, and KBI.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | Dual supply domains: VDD (digital), VDDA (analog); VSS common reference |
| PTA0–PTA7 | GPIO / peripheral multiplex | Includes TSI electrodes, SCI0 TX/RX, SPI MOSI/MISO, I²C SCL/SDA, FTM channels |
| RESET_B | Active-low reset input | Accepts min. 1.5×tSelf_reset pulse; supports POR, LVD, and watchdog reset sources |
| EXTAL / XTAL | External oscillator connection | Supports 32 kHz–20 MHz crystals/resonators; internal load caps configurable |
| BKGD | Single-wire debug interface | Enables BDM entry, breakpoint setting, and on-chip ICE trace without dedicated JTAG pins |
Key Features
| Feature | Design Value |
|---|---|
| Flash & EEPROM reliability | 8 KB flash with read-while-write; 256-byte EEPROM with ECC and 2-byte erase sectors enables robust firmware updates and parameter storage |
| Touch sensing interface | TSI module supports up to 16 electrodes with hardware scan trigger and wake-from-Stop3 capability for keyless entry and dashboard HMI |
| Automotive-grade clock stability | ICS with FLL achieves ±2% DCO accuracy over –40 °C to +125 °C, eliminating need for external precision oscillator in cost-sensitive body control units |
| Peripheral flexibility | Two SCI/UARTs (LIN-capable), SPI, I²C, dual FTM modules (6+2 channels), and ACMP enable mixed-protocol communication and motor/timer control in single chip |
| System safety architecture | Independent watchdog clock, multi-threshold LVD with interrupt/reset options, illegal opcode/address detection, and memory protection enforce fail-safe behavior in ASIL-B contexts |
Applications
| Automotive Body Control Module | Industrial Sensor Node |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in passenger vehicles. IC Role / Device Role / Timing Role: Primary MCU executing CAN/LIN gateway logic, analog sensor acquisition (potentiometers, thermistors), and PWM-driven actuator control. Use Value: Integrated 8-channel ADC, LIN-capable SCI, and Stop3 mode (4.5 µA) reduce BOM count and extend battery life during vehicle sleep states. |
Use Scenario: Wireless-capable environmental monitor collecting temperature, humidity, and motion data in factory settings. IC Role / Device Role / Timing Role: Signal conditioning and preprocessing unit interfacing with analog sensors, managing SPI-connected RF transceiver, and scheduling low-power wake cycles. Use Value: TSI supports capacitive proximity detection; ultra-low Stop3 current enables multi-year operation on coin-cell batteries. |
| Appliance Control Panel | Medical Diagnostic Handset |
Use Scenario: User interface and motor control subsystem in front-loading washing machines and dishwashers. IC Role / Device Role / Timing Role: Real-time execution of wash cycle logic, ACMP-based water level detection, FTM-driven motor phase control, and touch-button HMI. Use Value: On-chip ACMP eliminates external comparator; TSI + KBI provides noise-immune touch and mechanical button fallback. |
Use Scenario: Portable handheld device performing ECG signal sampling, display update, and Bluetooth LE data transmission. IC Role / Device Role / Timing Role: Analog front-end controller acquiring conditioned biopotential signals via ADC, managing display refresh via SPI, and coordinating BLE packet timing. Use Value: 10-bit ADC with internal bandgap reference ensures stable measurement accuracy; 2 KB RAM accommodates real-time signal buffering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08QG8CDTE | 8 KB flash, same S08 core, but only 128-byte EEPROM, no TSI, 20-pin TSSOP package | Lacks touch sensing and has reduced EEPROM endurance; suitable for non-touch control where pin count allows | Choose when TSI is unnecessary and 20-pin layout is acceptable; verify EEPROM wear leveling requirements |
| S9S08RN16W2MTG | 16 KB flash, identical peripherals and package, same temperature grade (–40 °C to +125 °C) | Direct upgrade path for firmware requiring >8 KB code space; retains all S9S08RN8W2MTG interfaces and power profiles | Select when future firmware expansion or feature-rich diagnostics demand additional flash without changing PCB or thermal design |
Compared with S9S08RN8W2MTG, MC9S08QG8CDTE sacrifices touch capability and EEPROM robustness for legacy compatibility, while S9S08RN16W2MTG offers seamless scalability within the same footprint and qualification envelope-enabling design reuse and long-term roadmap alignment.
Availability
S9S08RN8W2MTG is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, appliance control panels, and portable medical devices requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S9S08RN8W2MTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale in 2015 and maintains full support for the S08 portfolio, emphasizing automotive, industrial, and appliance applications with AEC-Q100 qualified microcontrollers.
The S9S08RN8W2MTG belongs to the S08RN family, designed specifically for cost-sensitive, high-reliability embedded control in harsh environments-featuring integrated safety mechanisms, mixed-signal peripherals, and extended temperature operation.
FAQ
What is the maximum bus frequency supported by the S9S08RN8W2MTG?
The S9S08RN8W2MTG supports a maximum bus frequency of 20 MHz across its full operating voltage range (2.7 V to 5.5 V) and temperature range (–40 °C to +125 °C). This is achieved using the internal clock source (ICS) with FLL, which locks to either internal or external reference clocks. The S9S08RN8W2MTG datasheet confirms this rating under "DC characteristics" and "Control timing" sections, with fBus specified as DC to 20 MHz.
Does the S9S08RN8W2MTG support touch sensing functionality?
Yes, the S9S08RN8W2MTG includes a Touch Sensing Interface (TSI) module supporting up to 16 external electrodes. It features configurable software or hardware scan triggers, full compatibility with NXP's touch sensing software library, and the ability to wake the MCU from Stop3 mode. This capability is explicitly documented in the S9S08RN16 Series Data Sheet, which covers the S9S08RN8W2MTG as part of the same family.
What is the typical Stop3 mode current consumption for the S9S08RN8W2MTG?
The typical Stop3 mode current for the S9S08RN8W2MTG is 4.5 µA at 3 V and –40 °C to +125 °C ambient temperature, with only the 1 kHz LPO clock active. This value is measured with no additional peripherals enabled (e.g., ADC, TSI, or LVD disabled). The S9S08RN16 Series Data Sheet Table 4 lists S3IDD = 4.5 µA (3 V) and 4.6 µA (5 V) under "Stop3 mode supply current."
Which package type does the S9S08RN8W2MTG use?
The S9S08RN8W2MTG uses a 16-pin Thin Shrink Small Outline Package (TSSOP), indicated by the "TG" suffix in the part number. The S9S08RN16 Series Data Sheet confirms TG as the package designator for 16-pin TSSOP and specifies thermal resistance θJA = 130 °C/W on single-layer board and 87 °C/W on four-layer board.
Can the S9S08RN8W2MTG execute code while programming its EEPROM?
Yes, the S9S08RN8W2MTG supports EEPROM program and erase operations while executing code from flash memory. This is explicitly stated in the "On-chip memory" section of the S9S08RN16 Series Data Sheet: "Up to 256 byte EEPROM with ECC; 2-byte erase sector; EEPROM program and erase while executing code from flash." This enables real-time parameter updates without halting application execution.
S9S08RN8W2MTG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 20MHz
- Connectivity:
- I2C, LINbus, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 12
- Program Memory Size:
- 8KB (8K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 256 x 8
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08RN8W2MTG FAQ
1.How can I place an order for S9S08RN8W2MTG through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08RN8W2MTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08RN8W2MTG reliable?
The price and inventory of S9S08RN8W2MTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08RN8W2MTG is usually 5 days.
3.What payment methods are accepted for S9S08RN8W2MTG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08RN8W2MTG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S9S08RN8W2MTG?
S9S08RN8W2MTG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08RN8W2MTG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08RN8W2MTG?
For technical support, including S9S08RN8W2MTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08RN8W2MTG requirements.
6.How does Aetrix verify that S9S08RN8W2MTG is sourced from the original manufacturer or authorized distributors?
All S9S08RN8W2MTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08RN8W2MTG meets industry standards.
7.What is the process for return or replacement of S9S08RN8W2MTG?
All S9S08RN8W2MTG units undergo pre-shipment inspection (PSI). If there is an issue with S9S08RN8W2MTG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08RN8W2MTG part is unused and in its original packaging.
Return procedure for S9S08RN8W2MTG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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