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NXP Semiconductors S9S08RNA16W2MTG

Part No.:
S9S08RNA16W2MTG
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08RNA16W2MTG.pdf
Description:
IC MCU 8BIT 16KB FLASH 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,619

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Product details

Overview

S9S08RNA16W2MTG from NXP Semiconductors (formerly Freescale) is an automotive-grade 8-bit S08 microcontroller with 16 KB flash, 256-byte EEPROM with ECC, and 2 KB RAM, operating at up to 20 MHz bus frequency across –40 °C to 125 °C. It integrates ADC (10-bit, 8-channel), dual SCI/UART, SPI, I²C, FTM timers, TSI touch sensing, and low-voltage detection - deployed in engine control modules, body electronics, and HVAC actuators.

For engineers reviewing the S9S08RNA16W2MTG datasheet, S9S08RNA16W2MTG pinout, S9S08RNA16W2MTG application, or S9S08RNA16W2MTG equivalent, this page delivers verified technical context, package-specific pin mapping, real-world use-value per application, and two validated alternative parts for functional migration - all grounded in Rev 1 (02/2014) S9S08RN16DS documentation.

Technical Context

The S9S08RNA16W2MTG implements an S08 CPU core with four-level nested interrupt support and up to 40 interrupt/reset sources. Its clock system combines a Pierce external oscillator (XOSC) and an internal clock source (ICS) with FLL, enabling precise 1–20 MHz operation with ±2% DCO deviation over –40 °C to 125 °C.

System protection includes independent watchdog, programmable low-voltage detect (LVD) with four warning levels, illegal opcode/address reset, and flash/RAM access protection. Debug is enabled via single-wire background debug interface (BDM) with three breakpoints and on-chip ICE module supporting nine trigger modes.

Key Specifications

Parameter Value and Actual Design Meaning
Core 8-bit S08 CPU, up to 20 MHz bus frequency at 2.7–5.5 V
Memory 16 KB flash (read/program/erase over full voltage/temp), 256 B EEPROM with ECC, 2 KB RAM
ADC 8-channel, 10-bit resolution, 2.5 µs conversion time, supports stop mode operation
Operating Temp –40 °C to +125 °C ambient, qualified for automotive AEC-Q100 Grade 1
Supply Current 4.6 µA typical in Stop3 mode (with 1 kHz LPO active); 7.6 mA typical run current at 20 MHz / 5 V
Peripherals Dual SCI/UART, SPI, I²C (400 kbps), two FTM modules (6+2 channels), TSI (16 electrodes), RTC, ACMP
Package 16-pin TSSOP (TG), θJA = 130 °C/W on single-layer board

Pinout & Package

16-pin Thin Shrink Small Outline Package (TSSOP), surface-mount, 0.65 mm pitch, JEDEC MO-153 compliant. Thermal resistance θJA = 130 °C/W (single-layer board), 87 °C/W (four-layer board).

Pin/Terminal Circuit Role Design Meaning
VDD Power supply Main digital supply (2.7–5.5 V); decoupling required near pin
VSS Ground reference Digital ground return; must be connected to PCB ground plane
PTA0–PTA7 GPIO / peripheral multiplex 8-bit port A; PTA2/PTA3 are true open-drain outputs; PTA4–PTA7 support keyboard interrupt (KBI)
RESET_B Active-low reset input Asynchronous reset; internal pullup; accepts min. 100 ns pulse width
EXTAL / XTAL External oscillator connection Crystal/resonator inputs for XOSC; supports 32 kHz–20 MHz range with configurable gain
CLKOUT Internal clock output Optional buffered output of internal bus clock or ICS/FLL source for test or sync
SCI0_TX / SCI0_RX UART channel 0 I/O Non-return-to-zero (NRZ) serial interface; supports LIN extension
TPA0 / TPA1 Touch sense inputs TSI electrode inputs; enable wake-from-Stop3 via capacitive touch event

Key Features

Feature Design Value
ECC-protected EEPROM 256-byte EEPROM with error-correcting code enables robust parameter storage in harsh environments
Stop3 ultra-low-power mode 4.6 µA typical supply current with 1 kHz LPO active, RTC, ADC, and TSI retain functionality
Programmable LVD Configurable low-voltage detect thresholds (2.56–4.4 V) with hysteresis and interrupt/reset options
Hardware CRC module Dedicated cyclic redundancy check engine accelerates firmware integrity verification and data packet validation
On-chip debug ICE Two comparators and nine trigger modes enable precise real-time trace and breakpoint control without external probes

Applications

Engine Control Unit (ECU) Body Control Module (BCM)

Use Scenario: Real-time monitoring of throttle position, coolant temperature, and crankshaft timing in 4-cylinder gasoline engines.

IC Role / Device Role / Timing Role: Central controller executing closed-loop fuel injection and spark timing algorithms with deterministic 20 MHz bus timing.

Use Value: 16 KB flash accommodates AEC-Q100-compliant safety routines; 8-channel ADC samples analog sensors at 2.5 µs; Stop3 mode enables fast wake-on-crank signal.

Use Scenario: Managing door lock actuation, interior lighting dimming, and window lift sequencing in premium vehicle platforms.

IC Role / Device Role / Timing Role: Low-voltage system supervisor coordinating LIN-connected nodes and driving high-current loads via GPIO sink pins.

Use Value: Four 20 mA sink-capable pins directly drive solenoids; TSI supports capacitive touch switches; LVD warning prevents brownout-induced logic faults.

HVAC Actuator Controller Seat Position Memory Module

Use Scenario: Controlling blend-air and mode-door stepper motors in climate control systems with feedback from potentiometers and thermistors.

IC Role / Device Role / Timing Role: Sensor interface and motor driver coordinator using FTM PWM outputs and ADC for closed-loop position correction.

Use Value: Dual FTM modules generate synchronized edge-aligned PWM for dual-motor control; EEPROM stores calibration offsets with ECC for field longevity.

Use Scenario: Storing and recalling driver seat position profiles via nonvolatile memory and executing smooth motor movement via timed GPIO sequences.

IC Role / Device Role / Timing Role: Dedicated memory manager and motion sequencer interfacing with LIN master and local potentiometer feedback.

Use Value: 256-byte ECC EEPROM retains seat profiles across 100k+ cycles; SCI UART enables diagnostics and reprogramming over vehicle network.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC9S08RN16W2MTG Same die, identical electrical specs and pinout; legacy Freescale marking superseded by NXP S-prefix branding No functional difference; used interchangeably in legacy designs and new builds where documentation references older part number Select MC9S08RN16W2MTG only if sourcing from legacy inventory or referencing pre-NXP design documents
S9S08RN8W2MTG Same package and peripherals, but 8 KB flash, 128 B EEPROM, and reduced RAM (1 KB); otherwise identical timing, temp range, and peripheral set Suitable for cost-sensitive applications with smaller firmware footprint and fewer stored parameters Choose S9S08RN8W2MTG when firmware size < 64 KB and EEPROM usage < 128 B; verify flash layout compatibility

Compared with S9S08RNA16W2MTG, MC9S08RN16W2MTG offers identical functionality under legacy branding, while S9S08RN8W2MTG reduces memory resources without altering I/O, timing, or environmental capability - enabling scalable platform design across entry and mid-tier automotive modules.

Availability

S9S08RNA16W2MTG is available at Aetrix Electronics and suitable for engine control units, body electronics modules, and HVAC actuator controllers requiring stable component supply across automotive production lifecycles.

Supply support for S9S08RNA16W2MTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontroller innovation dating to the Motorola and Freescale eras.

The S9S08RN series was designed specifically for cost-optimized, high-reliability automotive body and powertrain control applications demanding extended temperature operation, robust EMC performance, and long-term supply stability.

FAQ

What is the maximum bus frequency supported by the S9S08RNA16W2MTG?

The S9S08RNA16W2MTG supports a maximum bus frequency of 20 MHz across its full operating voltage range (2.7–5.5 V) and temperature range (–40 °C to 125 °C). This is achieved via the internal clock source (ICS) with frequency-locked loop (FLL), which can be driven by either the internal trimmed reference or an external crystal/resonator. The 20 MHz limit applies to both FEI and FBE operating modes.

Does the S9S08RNA16W2MTG support EEPROM wear leveling or automatic erase management?

The S9S08RNA16W2MTG does not include hardware wear leveling or automatic erase management. Its 256-byte EEPROM uses 2-byte erase sectors and supports program/erase while executing code from flash, but endurance (100k cycles) and data retention (10 years) require firmware-level management. Users must implement software logic to distribute writes across sectors and track erase counts - no built-in controller handles this autonomously.

Can the S9S08RNA16W2MTG operate in stop mode while maintaining ADC or TSI functionality?

Yes, the S9S08RNA16W2MTG supports ADC and TSI operation in Stop3 mode. In Stop3, the 1 kHz low-power oscillator (LPO) remains active, enabling the ADC to perform conversions and the TSI module to scan up to 16 electrodes - both capable of generating interrupts to wake the MCU. The datasheet specifies +40 µA ADC adder and +121 µA TSI adder to baseline Stop3 current (4.6 µA), confirming active peripheral operation during low-power states.

What are the key thermal limitations for the S9S08RNA16W2MTG in a 16-pin TSSOP package?

The S9S08RNA16W2MTG in 16-pin TSSOP has a junction-to-ambient thermal resistance (θJA) of 130 °C/W on a single-layer board and 87 °C/W on a four-layer board. Its maximum junction temperature is 135 °C, and ambient operating range is –40 °C to 125 °C. To avoid thermal shutdown, total power dissipation (PD = IDD × VDD + PI/O) must satisfy TJ = TA + (PD × θJA) ≤ 135 °C - e.g., at 125 °C ambient and 5 V, max allowable PD is ~77 mW on single-layer layout.

Is the S9S08RNA16W2MTG pin-compatible with other members of the S9S08RN family?

The S9S08RNA16W2MTG is pin-compatible with the S9S08RN8W2MTG (8 KB flash variant) in the same 16-pin TSSOP package, sharing identical pin assignments, electrical characteristics, and peripheral mapping. However, it is not pin-compatible with 20-pin, 32-pin, or 48-pin variants (e.g., S9S08RN16W2MLF) due to differing pin counts and signal multiplexing - package-specific pinouts must be verified per device marking.

S9S08RNA16W2MTG Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
12
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08RNA16W2MTG FAQ

1.How can I place an order for S9S08RNA16W2MTG through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08RNA16W2MTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S9S08RNA16W2MTG reliable?

The price and inventory of S9S08RNA16W2MTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08RNA16W2MTG is usually 5 days.

3.What payment methods are accepted for S9S08RNA16W2MTG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S9S08RNA16W2MTG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S9S08RNA16W2MTG?

S9S08RNA16W2MTG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08RNA16W2MTG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08RNA16W2MTG?

For technical support, including S9S08RNA16W2MTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08RNA16W2MTG requirements.

6.How does Aetrix verify that S9S08RNA16W2MTG is sourced from the original manufacturer or authorized distributors?

All S9S08RNA16W2MTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08RNA16W2MTG meets industry standards.

7.What is the process for return or replacement of S9S08RNA16W2MTG?

All S9S08RNA16W2MTG units undergo pre-shipment inspection (PSI). If there is an issue with S9S08RNA16W2MTG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08RNA16W2MTG part is unused and in its original packaging.

Return procedure for S9S08RNA16W2MTG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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