NXP Semiconductors S9S08RNA16W2MTGR

Overview

S9S08RNA16W2MTGR from NXP Semiconductors (formerly Freescale) is an automotive-grade 8-bit S08 microcontroller with 16 KB flash, 256-byte EEPROM with ECC, and 2 KB RAM, operating at up to 20 MHz bus frequency across –40 °C to +125 °C. It integrates ADC (10-bit, 8-channel), dual SCI/UART, SPI, I²C, FTM timers, TSI touch sensing, and low-power stop3 mode consuming 4.6 µA - deployed in engine control modules, body electronics, and HVAC actuators.

For engineers reviewing the S9S08RNA16W2MTGR datasheet, S9S08RNA16W2MTGR pinout, S9S08RNA16W2MTGR application, or S9S08RNA16W2MTGR equivalent, this page delivers verified technical context, validated package mapping (16-pin TSSOP), confirmed peripheral timing specs, and two rigorously cross-referenced alternative parts for functional migration paths in automotive embedded systems.

Technical Context

The S9S08RNA16W2MTGR implements an S08 CPU core with four-level nested interrupt support and up to 40 interrupt/reset sources. Its clock system combines a Pierce oscillator (XOSC) for crystal/resonator operation and an internal clock source (ICS) with FLL, enabling ±2.0% DCO frequency deviation over –40 °C to 125 °C.

System protection includes independent watchdog timer, programmable low-voltage detection (LVD) with four warning levels, illegal opcode/address reset, and flash/RAM access protection. Debug is enabled via single-wire background debug interface with three breakpoints and on-chip ICE module featuring two comparators and nine trigger modes.

Key Specifications

Pinout & Package

16-pin TSSOP (TG package), 0.65 mm pitch, 5.0 × 4.4 mm body size, exposed pad not present. Pin functions mapped per S9S08RN16 Series Data Sheet Rev 1 (02/2014), Table 8.2 "Device pin assignment" for 16-pin TSSOP variant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit automotive microcontroller applications.

Compared with S9S08RNA16W2MTGR, MC9S08RN16W2MTGR offers identical functionality under legacy naming, while S9S08RNA8W2MTGR provides a flash- and EEPROM-reduced variant for space-constrained implementations - both retain the same 16-pin TSSOP footprint, –40 °C to 125 °C rating, and peripheral feature set.

Availability

S9S08RNA16W2MTGR is available at Aetrix Electronics and suitable for engine control units, body electronics modules, and HVAC actuator systems requiring stable component supply across automotive production lifecycles.

Supply support for S9S08RNA16W2MTGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in microcontrollers dating to Motorola and Freescale.

The S9S08RNA16W2MTGR belongs to the S08RN family - designed specifically for cost-optimized, high-reliability automotive body and powertrain applications demanding extended temperature operation, robust EMC performance, and long-term supply stability.

FAQ

What is the maximum bus frequency supported by the S9S08RNA16W2MTGR?

The S9S08RNA16W2MTGR supports a maximum bus frequency of 20 MHz across its full operating voltage range (2.7 V to 5.5 V) and temperature range (–40 °C to +125 °C). This frequency is achieved using the internal clock source (ICS) with FLL, and is confirmed in Section 5.2.1 of the S9S08RN16 Series Data Sheet Rev 1. The S9S08RNA16W2MTGR maintains timing compliance under worst-case conditions without derating.

Does the S9S08RNA16W2MTGR support in-circuit debugging, and what interface is used?

Yes, the S9S08RNA16W2MTGR supports in-circuit debugging via a single-wire background debug (BDM) interface. It includes breakpoint capability for up to three hardware breakpoints and an on-chip in-circuit emulator (ICE) debug module with two comparators and nine trigger modes. This configuration is fully documented in the "Development support" section of the S9S08RN16 Series Data Sheet Rev 1 and is functionally identical across all RN16 variants including the S9S08RNA16W2MTGR.

What are the EEPROM specifications for the S9S08RNA16W2MTGR?

The S9S08RNA16W2MTGR includes 256 bytes of EEPROM with built-in error-correcting code (ECC), organized in 2-byte erase sectors. It supports concurrent program and erase operations while executing code from flash memory. Endurance is rated for ≥100,000 erase/write cycles, and data retention exceeds 10 years at 125 °C - all specified in the "On-chip memory" section of the S9S08RN16 Series Data Sheet Rev 1 and validated for the S9S08RNA16W2MTGR's 16-pin TSSOP configuration.

Which package type does the S9S08RNA16W2MTGR use, and what are its thermal characteristics?

The S9S08RNA16W2MTGR uses a 16-pin TSSOP package (TG suffix), with thermal resistance θ_JA = 130 °C/W on a single-layer board and 87 °C/W on a four-layer board. These values are explicitly listed in Table 8 of the S9S08RN16 Series Data Sheet Rev 1 and apply directly to the S9S08RNA16W2MTGR as a member of the RN16 family's 16-pin variant.

Can the S9S08RNA16W2MTGR operate in low-power modes while retaining ADC functionality?

Yes, the S9S08RNA16W2MTGR supports ADC operation in Stop3 mode. When enabled, the ADC adds 40 µA to the base stop3 current of 4.6 µA (at 5 V), resulting in total current of 44.6 µA. This capability is confirmed in Table 4, item #7 of the S9S08RN16 Series Data Sheet Rev 1 and applies identically to the S9S08RNA16W2MTGR due to shared silicon and qualification.