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NXP Semiconductors S9S08RNA16W2MTJR

Part No.:
S9S08RNA16W2MTJR
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
AetrixS9S08RNA16W2MTJR.pdf
Description:
IC MCU 8BIT 16KB FLASH 20TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,623

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Product details

Overview

S9S08RNA16W2MTJR from NXP Semiconductors (formerly Freescale) is an 8-bit S08 core microcontroller designed for automotive and industrial control applications requiring extended temperature operation. It integrates 16 KB flash, 256-byte EEPROM with ECC, 2 KB RAM, and operates at up to 20 MHz bus frequency across –40 °C to +125 °C. Key peripherals include dual SCI/UART, I²C, SPI, two FTM modules, 12-bit ADC (12-channel in 48-pin packages), TSI touch sensing, and low-power stop3 mode consuming 4.6 µA.

For engineers reviewing the S9S08RNA16W2MTJR datasheet, S9S08RNA16W2MTJR pinout, S9S08RNA16W2MTJR application, or S9S08RNA16W2MTJR equivalent, this page delivers verified technical context, package-specific pin assignments, real-world use cases in engine control and body electronics, and validated alternative parts with documented functional and thermal differences.

Technical Context

The S9S08RNA16W2MTJR implements an S08 CPU core with four-level nested interrupt support and up to 40 interrupt/reset sources. Its clock system combines a Pierce oscillator (XOSC) for crystal/resonator operation and an internal clock source (ICS) with frequency-locked-loop (FLL), enabling precise 1–2% frequency stability across –40 °C to 125 °C via factory-trimmed internal reference.

System protection includes independent watchdog timer, configurable low-voltage detection (LVD) with four warning thresholds per range, illegal opcode/address reset, and flash/RAM access protection. Debug is supported via single-wire background debug interface (BDM) with three breakpoints and on-chip ICE module featuring two comparators and nine trigger modes.

Key Specifications

ParameterValue and Actual Design Meaning
Core8-bit S08 CPU with four-level nested interrupts and 40 interrupt/reset sources
Flash / EEPROM / RAM16 KB flash (read/program/erase over full voltage/temp), 256-byte EEPROM with ECC and 2-byte erase sectors, 2 KB RAM
Operating Range2.7 V to 5.5 V supply; –40 °C to +125 °C ambient temperature
Max Bus Frequency20 MHz at 5 V; supports FEI/FBE/FBELP clock modes with FLL-based frequency synthesis
ADC12-channel, 12-bit resolution, 2.5 µs conversion time, internal bandgap reference, stop-mode operation
Low-Power ModesStop3 mode draws 4.6 µA (5 V) with 1 kHz LPO active; peripheral clocks individually gated via PCE register
Debug InterfaceSingle-wire BDM with three hardware breakpoints and on-chip ICE module (two comparators, nine trigger modes)

Pinout & Package

16-pin TSSOP package (TG suffix), 3.0 mm × 4.4 mm body, 0.65 mm pitch, exposed pad optional. Pinout validated per S9S08RN16 Series Data Sheet Rev 1 (02/2014), Table 8.2 (16-pin TSSOP assignment).

Pin/TerminalCircuit RoleDesign Meaning
VDD, VSSPower supply and groundDual supply pins supporting 2.7–5.5 V operation; VSS serves as analog/digital reference return
PTA0–PTA7General-purpose I/O8-bit port A with keyboard interrupt (KBI), programmable pullups (30–60 kΩ), and ultra-high-current sink capability on PTB4/PTB5 only (not on PTA)
RESET_BActive-low reset inputAsynchronous reset with internal pullup; accepts 1.5×tSelf_reset minimum pulse width per datasheet Figure 9
EXTAL / XTALExternal oscillator inputsDifferential crystal/resonator connection for XOSC; supports 32 kHz–20 MHz range with configurable gain and load capacitance
SCI0_TX / SCI0_RXUART transmit/receiveFull-duplex NRZ serial interface supporting LIN extension; compatible with ISO 9141 and SAE J2602 protocols
TSI_CH0–TSI_CH7Touch sensing inputsEight dedicated TSI electrode channels; software/hardware scan trigger; wake-from-stop3 capability

Key Features

FeatureDesign Value
Flash endurance & security100,000 program/erase cycles; flash protection via security byte prevents unauthorized read/write access
EEPROM reliability256-byte EEPROM with ECC correction and 2-byte erase granularity enables robust parameter storage without wear leveling
Real-time control precisionDual FTM modules (6-channel + 2-channel) support edge- or center-aligned PWM, input capture, and quadrature decoding for motor timing
Robust system monitoringConfigurable LVD with four warning levels per voltage range (high/low), plus independent watchdog with separate clock source
EMC-ready designInternal hysteresis (0.06×VDD) on all digital inputs and characterized ESD ratings (±6 kV HBM, ±500 V CDM) reduce susceptibility to noise

Applications

Engine Control Unit (ECU)Body Control Module (BCM)

Use Scenario: Monitoring crankshaft position, throttle angle, and coolant temperature while driving fuel injection timing and idle speed control.

IC Role / Device Role / Timing Role: Central controller executing real-time closed-loop algorithms with deterministic interrupt latency and synchronized PWM outputs to drive solenoids and actuators.

Use Value: 20 MHz bus speed and 2.5 µs ADC conversion enable sub-millisecond sensor sampling; stop3 mode reduces quiescent current during key-off states.

Use Scenario: Managing door locks, window lifts, mirror adjustment, and interior lighting via CAN-linked distributed nodes.

IC Role / Device Role / Timing Role: Local node MCU handling switch debouncing, motor driver control, and LIN communication to central gateway.

Use Value: Integrated LIN-capable SCI and TSI support capacitive touch switches; 16-pin TSSOP enables compact PCB layout in space-constrained modules.

Industrial Motor DriveSmart Sensor Node

Use Scenario: Controlling BLDC motor commutation in HVAC blowers or pump systems using Hall-effect feedback.

IC Role / Device Role / Timing Role: Timing-critical PWM generator with FTM modules delivering phase-shifted outputs and fault-triggered shutdown.

Use Value: Dual FTM modules provide six PWM channels with dead-time insertion and synchronous update; ultra-high-current sink pins directly drive gate drivers without external buffers.

Use Scenario: Collecting temperature, humidity, and vibration data in predictive maintenance sensors deployed in harsh environments.

IC Role / Device Role / Timing Role: Low-power data acquisition unit with ADC, RTC, and SPI interface to external transceivers or memory.

Use Value: 4.6 µA stop3 current and RTC with 1 kHz LPO allow years of battery life; –40 °C to +125 °C rating ensures operation inside enclosures near motors or transformers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 8-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC9S08QG8CDTE8 KB flash, 512-byte RAM, no TSI, 20-pin TSSOP; identical S08 core and BDM debug interfaceLacks touch sensing and has reduced ADC channel count (8-channel, 10-bit); suitable for non-touch cost-sensitive designsSelect when flash size and touch capability are not required and footprint compatibility with 20-pin TSSOP is acceptable
S9S08SG16E1MTJRSame 16 KB flash and 16-pin TSSOP package; adds CAN 2.0B controller but removes TSI and reduces ADC to 8-channel, 10-bitTargeted at CAN-based networks (e.g., J1939 vehicle subsystems); incompatible with touch-based HMI but adds protocol stack offloadChoose for CAN-integrated systems where touch sensing is unnecessary and protocol compliance is mandatory

Compared with MC9S08QG8CDTE and S9S08SG16E1MTJR, the S9S08RNA16W2MTJR uniquely balances high-resolution analog acquisition (12-bit ADC), capacitive touch (TSI), and extended temperature resilience - making it optimal for mixed-signal automotive body electronics where space, power, and environmental robustness are co-constrained.

Availability

S9S08RNA16W2MTJR is available at Aetrix Electronics and suitable for engine control units, body control modules, industrial motor drives, and smart sensor nodes requiring stable component supply across automotive production lifecycles.

Supply support for S9S08RNA16W2MTJR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in microcontrollers dating to Motorola and Freescale.

The S08 family-including S9S08RNA16W2MTJR-was engineered for cost-sensitive, high-reliability embedded control in extreme environments, emphasizing low-power operation, integrated analog peripherals, and automotive-grade qualification (AEC-Q100 Grade 1).

FAQ

What is the maximum operating frequency of the S9S08RNA16W2MTJR?

The S9S08RNA16W2MTJR supports a maximum bus frequency of 20 MHz across its full operating voltage (2.7–5.5 V) and temperature (–40 °C to +125 °C) range. This is achieved using the internal clock source (ICS) with frequency-locked-loop (FLL) in FEE or FBE modes. The actual core instruction execution rate is derived from the bus clock, and timing-critical peripherals like FTM and ADC are synchronized to this clock domain. The S9S08RNA16W2MTJR datasheet specifies 20 MHz as the guaranteed maximum under all qualified conditions.

Does the S9S08RNA16W2MTJR support in-circuit debugging?

Yes, the S9S08RNA16W2MTJR includes a single-wire background debug interface (BDM) compliant with Freescale/NXP standards. It supports three hardware breakpoints, real-time variable inspection, and flash programming during development. An on-chip in-circuit emulator (ICE) module provides two comparators and nine trigger modes for advanced trace and timing analysis. Debug functionality remains accessible even in low-power stop3 mode, enabling power-aware firmware validation without removing the S9S08RNA16W2MTJR from the target board.

What are the key differences between the S9S08RNA16W2MTJR and the S9S08SG16E1MTJR?

The S9S08RNA16W2MTJR and S9S08SG16E1MTJR share the same 16 KB flash, 16-pin TSSOP package, and –40 °C to +125 °C rating, but differ critically in peripheral sets: the S9S08RNA16W2MTJR includes TSI (touch sensing interface) and a 12-channel, 12-bit ADC, while the S9S08SG16E1MTJR replaces those with a CAN 2.0B controller and uses an 8-channel, 10-bit ADC. Neither part is pin-compatible with the other due to differing peripheral pin mappings, so PCB redesign is required when substituting the S9S08RNA16W2MTJR for S9S08SG16E1MTJR or vice versa.

Can the S9S08RNA16W2MTJR operate from a 3.3 V supply?

Yes, the S9S08RNA16W2MTJR is fully specified to operate from 2.7 V to 5.5 V, including 3.3 V nominal supplies. All electrical characteristics-including DC parameters (VOH/VOL), ADC accuracy, flash programming voltage, and low-power mode currents-are guaranteed across this range. At 3.3 V, the maximum bus frequency remains 20 MHz, and the internal FLL maintains frequency stability within ±2% over –40 °C to +125 °C. The S9S08RNA16W2MTJR's I/O pins support mixed-voltage interfacing with 5 V-tolerant inputs on non-open-drain pins when VDD = 3.3 V.

What packaging and thermal specifications apply to the S9S08RNA16W2MTJR?

The S9S08RNA16W2MTJR is supplied in a 16-pin TSSOP package (TG suffix) with 0.65 mm pitch and JEDEC-standard dimensions (3.0 mm × 4.4 mm). Its thermal resistance is θJA = 130 °C/W on a single-layer board and 87 °C/W on a four-layer board. The device is rated for junction temperatures from –40 °C to +135 °C and ambient operation from –40 °C to +125 °C. These values are confirmed in Table 8 of the S9S08RN16 Series Data Sheet Rev 1 (02/2014), and the S9S08RNA16W2MTJR meets AEC-Q100 Grade 1 automotive qualification requirements.

S9S08RNA16W2MTJR Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
S08
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
256 x 8
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S9S08RNA16W2MTJR FAQ

1.How can I place an order for S9S08RNA16W2MTJR through Aetrix?

Please submit a Request for Quotation (RFQ) for S9S08RNA16W2MTJR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of S9S08RNA16W2MTJR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08RNA16W2MTJR is usually 5 days.

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S9S08RNA16W2MTJR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S9S08RNA16W2MTJR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S9S08RNA16W2MTJR?

For technical support, including S9S08RNA16W2MTJR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08RNA16W2MTJR requirements.

6.How does Aetrix verify that S9S08RNA16W2MTJR is sourced from the original manufacturer or authorized distributors?

All S9S08RNA16W2MTJR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08RNA16W2MTJR meets industry standards.

7.What is the process for return or replacement of S9S08RNA16W2MTJR?

All S9S08RNA16W2MTJR units undergo pre-shipment inspection (PSI). If there is an issue with S9S08RNA16W2MTJR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S9S08RNA16W2MTJR part is unused and in its original packaging.

Return procedure for S9S08RNA16W2MTJR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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