NXP Semiconductors S9S08SG16E1CTG
- Part No.:
- S9S08SG16E1CTG
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 16-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
S9S08SG16E1CTG.pdf
- Description:
- IC MCU 8BIT 16KB FLASH 16TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S9S08SG16E1CTG from NXP Semiconductors (formerly Freescale) is an 8-bit HCS08 microcontroller with 16 KB on-chip Flash, 1 KB RAM, and integrated peripherals including 10-bit ADC, dual TPM timers, SCI, SPI, I²C, ACMP, and RTC. It operates at up to 40 MHz bus frequency, supports -40°C to +125°C temperature range, and targets low-power embedded control in automotive body electronics and industrial sensors.
For engineers reviewing the S9S08SG16E1CTG datasheet, S9S08SG16E1CTG pinout, S9S08SG16E1CTG application, or S9S08SG16E1CTG equivalent, key selection criteria include Flash size (16 KB), TSSOP-16 package, 22 GPIOs, stop3 mode current (1.5 µA), and integrated LVD/LVW for robust supply monitoring in space-constrained automotive modules.
Technical Context
The S9S08SG16E1CTG implements the HCS08 CPU core with 36–40 MHz bus clock capability, supported by an Internal Clock Source (ICS) featuring a frequency-locked loop (FLL) and precision-trimmed internal reference (±0.2% resolution). Its memory map allocates 16,384 bytes of Flash (0x1860–0x7FFF), 1,024 bytes of RAM (0x0080–0x047F), and 26,528 unimplemented bytes - distinct from the SG32 variant's larger Flash allocation.
Peripheral integration includes a 16-channel 10-bit ADC with 2.5 µs conversion time and internal temperature sensor, two 2-channel TPM modules supporting PWM and input capture, and a real-time counter (RTC) with free-running 1 kHz low-power oscillator enabling wake-up from all stop modes. The device supports single-wire background debug and features FLASH block protection, COP watchdog, and configurable low-voltage detection with reset/interrupt options.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | HCS08 8-bit CPU with BGND instruction support and 32 interrupt/reset sources |
| Flash Memory | 16 KB (0x1860–0x7FFF); supports read/program/erase across full -40°C to +125°C operating range |
| RAM Size | 1 KB (0x0080–0x047F); retains data in stop3 mode with VDD ≥ 1.8 V |
| ADC Resolution | 10-bit; 16-channel input with internal bandgap reference and temperature sensor channel |
| Bus Frequency | Up to 40 MHz; derived from ICS FLL or external crystal (1–16 MHz or 31.25–38.4 kHz) |
| Stop3 Current | 1.5 µA typical at 3.3 V, 25°C; enables ultra-low-power cyclic wake-up via RTC |
| LVD Threshold | Selectable trip points; guaranteed functionality between VLVD0 and VDD min (1.8 V) |
Pinout & Package
Package: 16-pin TSSOP (Thin Shrink Small Outline Package), 4.4 mm × 5.0 mm body, 0.65 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Power Supply | Main digital supply (1.8–3.6 V); powers core, Flash, RAM, and most peripherals |
| VSS | Ground Reference | Digital ground return path; requires low-impedance connection to minimize noise |
| RESET | Active-Low Reset Input | Asynchronous reset assertion; internal pull-up ensures valid state during power-up |
| BKGD/MS | Single-Wire Debug & Mode Select | Enables background debug communication and selects active boot mode |
| PTA0–PTA1 | GPIO / Peripheral Multiplex | Port A pins supporting SCI TX/RX, TPM1 CH0/CH1, or general-purpose I/O with configurable slew rate |
| PTB0–PTB5 | GPIO / Peripheral Multiplex | Port B pins supporting ADC inputs, TPM2 CH0/CH1, RTC_CLKIN, or ganged output (PTB[5:2]) |
| PTC0–PTC3 | GPIO / Peripheral Multiplex | Port C pins supporting I²C SDA/SCL, SPI MOSI/MISO/SCK, or ganged output (PTC[3:0]) |
| XOSC/XFC | Crystal Oscillator Input/Output | Connects to external crystal (1–16 MHz) or ceramic resonator; enables precise timing source |
Key Features
| Feature | Design Value |
|---|---|
| FLASH Block Protection | Configurable via FPROT/NVPROT registers to prevent accidental erase/write of critical firmware sections |
| Low-Voltage Warning (LVW) | Generates interrupt before VDD drops below minimum operating voltage, enabling graceful shutdown or data save |
| Stop3 Mode Power Management | Retains RAM and register contents while disabling CPU and most clocks; RTC continues running on 1 kHz internal oscillator |
| Ganged Output Control | Single write to PTB[5:2] or PTC[3:0] simultaneously updates four pins - simplifies LED array or relay bank control |
| Background Debug Interface | Single-wire interface supports in-circuit debugging, breakpoint setting, and flash programming without dedicated JTAG pins |
Applications
| Automotive Door Module | Industrial Temperature Sensor Node |
|---|---|
Use Scenario: Centralized control of window lift, mirror adjustment, and interior lighting in vehicle door assemblies. IC Role / Device Role / Timing Role: Main system controller executing motor drive logic, switch debouncing, LIN communication, and fault diagnostics. Use Value: Integrated 10-bit ADC reads potentiometer position; TPM PWM drives DC motors; stop3 mode reduces quiescent current during vehicle sleep states. |
Use Scenario: Battery-powered wireless node measuring ambient temperature and transmitting data via UART-to-LoRa bridge. IC Role / Device Role / Timing Role: Sensor hub managing ADC sampling, internal temperature compensation, and low-power wake-up scheduling. Use Value: On-chip temperature sensor and bandgap reference enable self-calibration; 1.5 µA stop3 current extends battery life to >5 years at 1-sample/hour duty cycle. |
| Smart Appliance Motor Control | Medical Diagnostic Handheld |
Use Scenario: Speed-regulated BLDC fan control in HVAC systems with overtemperature and stall detection. IC Role / Device Role / Timing Role: Real-time motor commutation controller using TPM edge-aligned PWM and ACMP-based zero-crossing detection. Use Value: Dual TPM modules generate complementary PWM outputs; ACMP compares back-EMF to internal reference without external components. |
Use Scenario: Portable blood glucose meter requiring accurate analog measurement, button interface, and USB charging status monitoring. IC Role / Device Role / Timing Role: System manager handling ADC conversion of test strip signal, button interrupts, and USB VBUS presence detection. Use Value: 16-channel ADC supports multiple sensor inputs; configurable pull-ups simplify button matrix design; LVD ensures reliable operation during battery discharge. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC9S08SG32E1CTG | 32 KB Flash, same 16-TSSOP package, identical peripheral set and pinout | Supports larger firmware images and bootloader partitioning; higher code density required | Select when firmware exceeds 16 KB or future scalability is needed without PCB change |
| S9KEAZ128AMLH | Kinetis E-series ARM Cortex-M0+, 128 KB Flash, 16 KB RAM, 48-pin LQFP | Higher performance, floating-point support, and enhanced connectivity (USB, CAN); requires layout redesign | Choose for next-generation designs needing upgrade path beyond 8-bit constraints |
Compared with MC9S08SG32E1CTG, the S9S08SG16E1CTG offers identical peripheral functionality and pin compatibility but halves Flash capacity - ideal for cost-sensitive, fixed-function applications. Versus S9KEAZ128AMLH, it provides proven 8-bit determinism and lower BOM cost, though at reduced computational headroom and package footprint.
Availability
S9S08SG16E1CTG is available at Aetrix Electronics and suitable for automotive body electronics, industrial sensor nodes, smart appliance control, and medical handheld devices requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant silicon.
Supply support for S9S08SG16E1CTG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader formed from the spin-off of Philips' semiconductor division, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The S9S08SG16E1CTG belongs to NXP's legacy HCS08 microcontroller family, designed specifically for cost-optimized, low-power embedded control in automotive body electronics and industrial subsystems where deterministic real-time response and Flash endurance are critical.
FAQ
What is the maximum bus frequency supported by the S9S08SG16E1CTG?
The S9S08SG16E1CTG supports a maximum bus frequency of 40 MHz when operating within its specified temperature range (-40°C to +125°C). At temperatures above 125°C, the maximum bus frequency is reduced to 36 MHz to maintain reliability. This frequency is generated via the Internal Clock Source (ICS) module's frequency-locked loop (FLL), which can be driven by either the internal trimmed reference or an external crystal/resonator. The S9S08SG16E1CTG achieves this performance while maintaining low power consumption in active and wait modes.
Does the S9S08SG16E1CTG support in-circuit debugging, and what interface is used?
Yes, the S9S08SG16E1CTG supports in-circuit debugging via a single-wire background debug interface (BDM) using the BKGD/MS pin. This interface enables full read/write access to memory and registers, breakpoint setting (one hardware breakpoint plus two more in the on-chip debug module), and flash programming without requiring additional pins or external debug hardware. The S9S08SG16E1CTG debug architecture is compatible with standard Freescale/NXP BDM tools and IDEs such as S32 Design Studio for S12Z and older CodeWarrior versions.
What is the Flash memory endurance and data retention specification for the S9S08SG16E1CTG?
The S9S08SG16E1CTG Flash memory is rated for a minimum of 100,000 program/erase cycles and guarantees 10 years of data retention at +85°C ambient temperature. These specifications apply across the full operating voltage (1.8–3.6 V) and temperature (-40°C to +125°C) ranges. Flash operations are controlled via the FCNFG, FPROT, and FCMD registers, and block protection can be configured to prevent accidental modification of bootloader or calibration data sections. The S9S08SG16E1CTG uses SuperFlash® technology licensed from SST to achieve these endurance characteristics.
How does the low-voltage detection (LVD) and low-voltage warning (LVW) function in the S9S08SG16E1CTG?
The S9S08SG16E1CTG integrates configurable low-voltage detection (LVD) with reset and low-voltage warning (LVW) with interrupt capabilities. LVD triggers a hardware reset when VDD falls below a selected threshold (e.g., 2.5 V or 2.8 V), while LVW generates a software-interrupt flag before VDD reaches the reset threshold - allowing firmware to execute safe shutdown, data save, or alert routines. Both features operate independently and are enabled via SOPT1 register bits. The S9S08SG16E1CTG guarantees functional operation between the VLVD0 threshold and VDD min (1.8 V), making it suitable for brown-out resilient designs.
Is the S9S08SG16E1CTG pin-compatible with other members of the MC9S08SGxx family?
Yes, the S9S08SG16E1CTG is fully pin-compatible with the MC9S08SG32E1CTG in the 16-pin TSSOP package, sharing identical pin assignments, electrical characteristics, and peripheral multiplexing. This allows direct substitution where Flash capacity requirements permit. However, it is not pin-compatible with 20-pin or 28-pin variants (e.g., MC9S08SG32CPB) due to differing pin counts and package footprints. The S9S08SG16E1CTG maintains the same thermal resistance (113 °C/W, single-layer board) and DC/AC electrical specs as its SG32 counterpart in the same package.
S9S08SG16E1CTG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width)
- Series:
- S08
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- S08
- Core Size:
- 8-Bit
- Speed:
- 40MHz
- Connectivity:
- I2C, LINbus, SCI, SPI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 12
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 1K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S9S08SG16E1CTG FAQ
1.How can I place an order for S9S08SG16E1CTG through Aetrix?
Please submit a Request for Quotation (RFQ) for S9S08SG16E1CTG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S9S08SG16E1CTG reliable?
The price and inventory of S9S08SG16E1CTG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S9S08SG16E1CTG is usually 5 days.
3.What payment methods are accepted for S9S08SG16E1CTG?
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S9S08SG16E1CTG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S9S08SG16E1CTG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S9S08SG16E1CTG?
For technical support, including S9S08SG16E1CTG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S9S08SG16E1CTG requirements.
6.How does Aetrix verify that S9S08SG16E1CTG is sourced from the original manufacturer or authorized distributors?
All S9S08SG16E1CTG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S9S08SG16E1CTG meets industry standards.
7.What is the process for return or replacement of S9S08SG16E1CTG?
All S9S08SG16E1CTG units undergo pre-shipment inspection (PSI). If there is an issue with S9S08SG16E1CTG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S9S08SG16E1CTG part is unused and in its original packaging.
Return procedure for S9S08SG16E1CTG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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